Single Bus Buffer Gate With 3-State Outputs
Product details
Parameters
Package | Pins | Size
Features
- Available in the Ultra Small 0.64-mm2
Package (DPW) With 0.5-mm Pitch - Supports 5-V VCC Operation
- Inputs Accept Voltages to 5.5 V
- Provides Down Translation to VCC
- Max tpd of 3.7 ns at 3.3 V
- Low Power Consumption, 10-μA Max ICC
- ±24-mA Output Drive at 3.3 V
- Ioff Supports Live Insertion, Partial-Power-Down Mode, and Back-Drive Protection
- Latch-Up Performance Exceeds 100 mA
Per JESD 78, Class II - ESD Protection Exceeds JESD 22
- 2000-V Human-Body Model (A114-A)
- 200-V Machine Model (A115-A)
- 1000-V Charged-Device Model (C101)
Description
This bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G125 device is a single line driver with a 3-state output. The output is disabled when the output-enable (OE) input is high.
The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.
The SN74LVC1G125 device is available in a variety of packages including the ultra-small DPW package with a body size of 0.8 mm × 0.8 mm.
Technical documentation
= Top documentation for this product selected by TI
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
Features
- Board design allows for versatility in evaluation
- Supports a wide-range of logic devices
Design tools & simulation
SCEJ253.ZIP (87 KB) - HSpice Model
SCEM270B.ZIP (53 KB) - IBIS Model
SCEM579.ZIP (20 KB) - PSpice Model
SCEM639.ZIP (7 KB) - PSpice Model
Reference designs
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
DSBGA (YZP) | 5 | View options |
SC70 (DCK) | 5 | View options |
SON (DRY) | 6 | View options |
SON (DSF) | 6 | View options |
SOT-23 (DBV) | 5 | View options |
SOT-5X3 (DRL) | 5 | View options |
X2SON (DPW) | 5 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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