SN74LVC1G125-Q1

ACTIVE

Automotive single 1.65-V to 5.5-V buffer with 3-state outputs

SN74LVC1G125-Q1

ACTIVE

Product details

Technology family LVC Number of channels 1 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Automotive Operating temperature range (°C) -40 to 125
Technology family LVC Number of channels 1 IOL (max) (mA) 32 Supply current (max) (µA) 10 IOH (max) (mA) -32 Input type Standard CMOS Output type 3-State Features Balanced outputs, Over-voltage tolerant inputs, Partial power down (Ioff), Very high speed (tpd 5-10ns) Rating Automotive Operating temperature range (°C) -40 to 125
SOT-23 (DBV) 5 8.12 mm² (2.9 mm × 2.8 mm) USON (DRY) 6 1.45 mm² (1.45 mm × 1 mm) SOT-SC70 (DCK) 5 4.2 mm² (2 mm × 2.1 mm)
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device Human-Body Model (HBM) ESD Classification Level 2
    • Device Charged-Device Model (CDM) ESD Classification Level C5
  • Available in the small 1.45-mm2 package (DRY) With 0.5-mm Pitch
  • Supports 5-V VCC Operation
  • Over-voltage tolerant inputs accept voltages to 5.5 V
  • Provides down translation to VCC
  • Max tpd of 3.7 ns at 3.3 V
  • Low power consumption, 10-µA Max ICC
  • ±24-mA Output drive at 3.3 V
  • Ioff supports live insertion, partial-power-down mode, and back-drive protection
  • Latch-up performance exceeds 100 mA Per JESD 78, Class II
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to +125°C Ambient Operating Temperature Range
    • Device Human-Body Model (HBM) ESD Classification Level 2
    • Device Charged-Device Model (CDM) ESD Classification Level C5
  • Available in the small 1.45-mm2 package (DRY) With 0.5-mm Pitch
  • Supports 5-V VCC Operation
  • Over-voltage tolerant inputs accept voltages to 5.5 V
  • Provides down translation to VCC
  • Max tpd of 3.7 ns at 3.3 V
  • Low power consumption, 10-µA Max ICC
  • ±24-mA Output drive at 3.3 V
  • Ioff supports live insertion, partial-power-down mode, and back-drive protection
  • Latch-up performance exceeds 100 mA Per JESD 78, Class II

This bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G125-Q1 device is a single line driver with a 3-state output. The output is disabled when the output-enable ( OE) input is high.

The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.

The SN74LVC1G125-Q1 device is available in a variety of packages including the small DRY package with a body size of 1.45 mm × 1.00 mm.

This bus buffer gate is designed for 1.65-V to 5.5-V VCC operation.

The SN74LVC1G125-Q1 device is a single line driver with a 3-state output. The output is disabled when the output-enable ( OE) input is high.

The CMOS device has high output drive while maintaining low static power dissipation over a broad VCC operating range.

The SN74LVC1G125-Q1 device is available in a variety of packages including the small DRY package with a body size of 1.45 mm × 1.00 mm.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet SN74LVC1G125-Q1 Single-BUS buffer gate with 3-state output datasheet (Rev. E) PDF | HTML Aug 12, 2020
Application note Optimizing On-Board and Wireless Charger Systems Using Logic and Translation (Rev. A) PDF | HTML Apr 1, 2021
Application note Drive Transmission Lines With Logic PDF | HTML Oct 20, 2020
More literature Automotive Logic Devices Brochure Aug 27, 2014

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

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Flexible EVM designed to support any device that has a DCK, DCT, DCU, DRL, or DBV package in a 5 to 8 pin count.
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Evaluation board

5-8-NL-LOGIC-EVM — Generic logic and translation EVM supporting 5 to 8 pin DPW, DQE, DRY, DSF, DTM, DTQ and DTT pkgs

Generic EVM designed to support any logic or translation device that has a DTT, DRY, DPW, DTM, DQE, DQM, DSF, or DTQ package. Board design allows for flexible evaluation.

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Simulation model

SN74LVC1G125 Behavioral SPICE Model

SCEM639.ZIP (7 KB) - PSpice model
Supported products & hardware
Reference design

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This camera hub reference design allows connection of up to four 1.3-megapixel cameras to a TDA3x system-on-chip (SoC) evaluation module (EVM). Each camera connects to the hub through a single coax cable. Using FPD-Link III connections, the cameras are connected to a four-port deserializer. The (...)
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The TIDA-01323 camera hub reference design allows connection of up to four 2-megapixel, 60-fps cameras over coax cable. This design utilizes these coax cables to provide power, back-channel communication, and clock synchronization to the sensors. The 4-Gbps FPD-Link III quad deserializer supports (...)
Supported products & hardware
Package Pins CAD symbols, footprints & 3D models
SOT-23 (DBV) 5 Ultra Librarian
USON (DRY) 6 Ultra Librarian
SOT-SC70 (DCK) 5 Ultra Librarian

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