Enhanced product 2-ch, 1.65-V to 5.5-V buffers with open-drain outputs

SN74LVC2G07-EP

ACTIVE

Product details

Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Number of channels (#) 2 IOL (Max) (mA) 32 ICC (Max) (uA) 10 IOH (Max) (mA) -32 Input type Standard CMOS Output type Open-Drain Features Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating HiRel Enhanced Product
Technology Family LVC Supply voltage (Min) (V) 1.65 Supply voltage (Max) (V) 5.5 Number of channels (#) 2 IOL (Max) (mA) 32 ICC (Max) (uA) 10 IOH (Max) (mA) -32 Input type Standard CMOS Output type Open-Drain Features Very high speed (tpd 5-10ns), Partial power down (Ioff), Over-voltage tolerant inputs Rating HiRel Enhanced Product
SOT-SC70 (DCK) 6 4 mm² 2 x 2.1
  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Supports 5-V VCC Operation
  • Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V
  • Max tpd of 5.7 ns at 3.3 V
  • Low Power Consumption, 10 µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly Site
    • One Test Site
    • One Fabrication Site
  • Extended Temperature Performance of –55°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • Supports 5-V VCC Operation
  • Inputs and Open-Drain Outputs Accept Voltages up to 5.5 V
  • Max tpd of 5.7 ns at 3.3 V
  • Low Power Consumption, 10 µA Max ICC
  • ±24-mA Output Drive at 3.3 V
  • Typical VOLP (Output Ground Bounce)
    <0.8 V at VCC = 3.3 V, TA = 25°C
  • Typical VOHV (Output VOH Undershoot)
    >2 V at VCC = 3.3 V, TA = 25°C
  • Ioff Supports Partial-Power-Down Mode Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

This dual buffer/driver is designed for 1.65-V to 5.5-V VCC operation. The output of the SN74LVC2G07 is open drain and can be connected to other open-drain outputs to implement active low wired OR or active high wired AND functions. The maximum sink current is 32 mA.

This device is fully specified for partial power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

Download

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 30
Type Title Date
* Data sheet Dual Buffer/Driver With Open Drain Ouputs datasheet 29 May 2008
* VID SN74LVC2G07-EP VID V6208616 21 Jun 2016
* Radiation & reliability report SN74LVC2G07MDCKTEP Reliability Report 06 Sep 2013
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 26 Jul 2021
Selection guide Little Logic Guide 2018 (Rev. G) 06 Jul 2018
Selection guide Logic Guide (Rev. AB) 12 Jun 2017
Application note How to Select Little Logic (Rev. A) 26 Jul 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 02 Dec 2015
User guide LOGIC Pocket Data Book (Rev. B) 16 Jan 2007
More literature Design Summary for WCSP Little Logic (Rev. B) 04 Nov 2004
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
Application note Selecting the Right Level Translation Solution (Rev. A) 22 Jun 2004
User guide Signal Switch Data Book (Rev. A) 14 Nov 2003
Application note Use of the CMOS Unbuffered Inverter in Oscillator Circuits 06 Nov 2003
More literature Logic Cross-Reference (Rev. A) 07 Oct 2003
User guide LVC and LV Low-Voltage CMOS Logic Data Book (Rev. B) 18 Dec 2002
Application note Texas Instruments Little Logic Application Report 01 Nov 2002
Application note TI IBIS File Creation, Validation, and Distribution Processes 29 Aug 2002
More literature Standard Linear & Logic for PCs, Servers & Motherboards 13 Jun 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) 22 May 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices 10 May 2002
More literature STANDARD LINEAR AND LOGIC FOR DVD/VCD PLAYERS 27 Mar 2002
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 01 Dec 1997
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 01 Aug 1997
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 01 Jun 1997
Application note LVC Characterization Information 01 Dec 1996
Application note Input and Output Characteristics of Digital Integrated Circuits 01 Oct 1996
Application note Live Insertion 01 Oct 1996
Design guide Low-Voltage Logic (LVC) Designer's Guide 01 Sep 1996
Application note Understanding Advanced Bus-Interface Products Design Guide 01 May 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Package Pins Download
SC70 (DCK) 6 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos