SN74LVT245B

ACTIVE

3.3-V ABT Octal Bus Transceivers With 3-State Outputs

Top

Product details

Parameters

Technology Family LVT VCC (Min) (V) 2.7 VCC (Max) (V) 3.6 Bits (#) 8 Voltage (Nom) (V) 3.3 F @ nom voltage (Max) (MHz) 160 ICC @ nom voltage (Max) (mA) 5 Propagation delay (Max) (ns) 3.5 IOL (Max) (mA) 64 IOH (Max) (mA) -32 Rating Catalog Operating temperature range (C) -40 to 85 open-in-new Find other Standard transceiver

Package | Pins | Size

SOIC (DW) 20 132 mm² 12.8 x 10.3 SOP (NS) 20 98 mm² 12.6 x 7.8 SSOP (DB) 20 38 mm² 5.3 x 7.2 TSSOP (PW) 20 42 mm² 6.5 x 6.4 VQFN (RGY) 20 16 mm² 3.5 x 4.5 open-in-new Find other Standard transceiver

Features

  • Supports Mixed-Mode Signal Operation (5-V Input and Output Voltages With 3.3-V VCC)
  • Supports Unregulated Battery Operation Down to 2.7 V
  • Typical VOLP (Output Ground Bounce)
       <0.8 V at VCC = 3.3 V, TA = 25°C
  • Ioff and Power-Up 3-State Support Hot Insertion
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)

open-in-new Find other Standard transceiver

Description

This octal bus transceiver is designed specifically for low-voltage (3.3-V) VCC operation, but with the capability to provide a TTL interface to a 5-V system environment.

The SN74LVT245B is designed for asynchronous communication between data buses. The device transmits data from the A bus to the B bus or from the B bus to the A bus, depending on the logic level at the direction-control (DIR) input. The output-enable (OE)\ input can be used to disable the device so the buses are effectively isolated.

To ensure the high-impedance state during power up or power down, OE\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

This device is fully specified for hot-insertion applications using Ioff and power-up 3-state. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down. The power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down, which prevents driver conflict.

open-in-new Find other Standard transceiver
Download

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 18
Type Title Date
* Datasheet SN74LVT245B datasheet (Rev. H) Sep. 09, 2003
Selection guide Logic Guide (Rev. AB) Jun. 12, 2017
Application note Implications of Slow or Floating CMOS Inputs (Rev. D) Jun. 23, 2016
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) Dec. 02, 2015
User guide LOGIC Pocket Data Book (Rev. B) Jan. 16, 2007
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature Logic Cross-Reference (Rev. A) Oct. 07, 2003
Application note TI IBIS File Creation, Validation, and Distribution Processes Aug. 29, 2002
Application note 16-Bit Widebus Logic Families in 56-Ball, 0.65-mm Pitch Very Thin Fine-Pitch BGA (Rev. B) May 22, 2002
Application note Power-Up 3-State (PU3S) Circuits in TI Standard Logic Devices May 10, 2002
More literature Military Low Voltage Solutions Apr. 04, 2001
Selection guide Advanced Bus Interface Logic Selection Guide Jan. 09, 2001
Application note LVT-to-LVTH Conversion Dec. 08, 1998
Application note LVT Family Characteristics (Rev. A) Mar. 01, 1998
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) Aug. 01, 1997
Application note Input and Output Characteristics of Digital Integrated Circuits Oct. 01, 1996
Application note Live Insertion Oct. 01, 1996
Application note Understanding Advanced Bus-Interface Products Design Guide May 01, 1996

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
10
Description
This EVM is designed to support any logic device that has a D, DW, DB, NS, PW, P, N, or DGV package in a 14 to 24 pin count.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic devices
EVALUATION BOARD Download
20
Description
Flexible EVM designed to support any logic or translation device that has a BQA, BQB, RGY (14-24 pin), RSV, RJW, or RHL package.
Features
  • Board design allows for versatility in evaluation
  • Supports a wide-range of logic and translation devices with included dual supply support
  • Board has 9 sections that can be broken apart for a smaller form factor

Design tools & simulation

SIMULATION MODEL Download
SCEJ256.ZIP (190 KB) - HSpice Model
SIMULATION MODEL Download
SCEM240B.ZIP (16 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
SO (NS) 20 View options
SOIC (DW) 20 View options
SSOP (DB) 20 View options
TSSOP (PW) 20 View options
VQFN (RGY) 20 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos

Related videos