5-V, 4:1, 1-channel, general-purpose analog multiplexer
Product details
Parameters
Package | Pins | Size
Features
- Rail to rail operation
- Bidirectional signal path
- 1.8 V Logic compatible
- Fail-safe logic
- Low on-resistance: 5 Ω
- Wide supply range: 1.08 V to 5.5 V
- -40°C to +125°C Operating temperature
- Low supply current: 10 nA
- Transition time: 14 ns
- Break-before-make switching
- ESD protection HBM: 2000 V
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Description
The TMUX1204 is a modern complementary metal-oxide semiconductor (CMOS) analog multiplexer (MUX) in a 4:1 single-ended (1-channel) configuration. The TMUX1204 works with a single supply (1.08 V to 5.5 V) which allows for use in a broad array of applications from personal electronics to building automation systems. A low supply current of 10 nA enables use in portable applications.
All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TMUX1204 5-V, 4:1, General Purpose Analog Multiplexer datasheet (Rev. A) | Oct. 01, 2019 |
| Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
| Application note | I2C Dynamic Addressing | Apr. 25, 2019 | |
| Application note | 1.8 V Logic for Muxes and Signal | May 16, 2018 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| USON (DQA) | 10 | View options |
| VSSOP (DGS) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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