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TMUX1208-Q1

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Automotive, 5-V bidirectional 8:1 multiplexer with 1.8-V logic

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Product details

Parameters

Configuration 8:1 Number of channels (#) 1 Power supply voltage - single (V) 1.2, 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 0.75 Bandwidth (MHz) 65 Operating temperature range (C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic Input/output continuous current (Max) (mA) 30 Rating Automotive CON (Typ) (pF) 85 Supply current (Typ) (uA) 0.02 open-in-new Find other Analog switches & muxes

Package | Pins | Size

UQFN (RSV) 16 5 mm² 2.6 x 1.8 open-in-new Find other Analog switches & muxes

Features

  • AEC-Q100 Qualified for Automotive Applications
    • Temperature Grade 1: –40°C to 125°C, TA
  • Low On-resistance: 5 Ω
  • Wide Supply Range: 1.08 V to 5.5 V
  • Rail to Rail Operation
  • Bidirectional Signal Path
  • 1.8 V Logic Compatible
  • Fail-Safe Logic
  • Low Supply Current: 10 nA
  • Transition Time: 14 ns
  • Break-before-make Switching
  • ESD Protection HBM: 2000 V
  • Small QFN Package

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Description

The TMUX1208-Q1 is a general purpose complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1208-Q1 is an 8:1 mux configuration allowing 8 different signal paths to be switched to a common output pin . Wide operating supply of 1.08 V to 5.5 V allows for use in automotive applications with varying power supply requirements. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.

The TMUX1208-Q1 comes in a small QFN package to enable reduced system size requirements. The device has low on-resistance of 5Ω typical to minimize the impact of distortion and signal integrity issues when the device is not connected to a high impedance signal path.

All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

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Technical documentation

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Type Title Date
* Datasheet TMUX1208-Q1 5-V Bidirectional 8:1 Multiplexer with 1.8-V Logic datasheet (Rev. A) Jul. 24, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019

Design & development

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Hardware development

INTERFACE ADAPTER Download
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Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM214.ZIP (98 KB) - PSpice Model
SIMULATION MODEL Download
SCDM239.ZIP (8 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
UQFN (RSV) 16 View options

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