Automotive, 5-V bidirectional 8:1 multiplexer with 1.8-V logic
Product details
Parameters
Package | Pins | Size
Features
- AEC-Q100 Qualified for Automotive Applications
- Temperature Grade 1: –40°C to 125°C, TA
- Low On-resistance: 5 Ω
- Wide Supply Range: 1.08 V to 5.5 V
- Rail to Rail Operation
- Bidirectional Signal Path
- 1.8 V Logic Compatible
- Fail-Safe Logic
- Low Supply Current: 10 nA
- Transition Time: 14 ns
- Break-before-make Switching
- ESD Protection HBM: 2000 V
- Small QFN Package
All trademarks are the property of their respective owners.
Description
The TMUX1208-Q1 is a general purpose complementary metal-oxide semiconductor (CMOS) multiplexer (MUX). The TMUX1208-Q1 is an 8:1 mux configuration allowing 8 different signal paths to be switched to a common output pin . Wide operating supply of 1.08 V to 5.5 V allows for use in automotive applications with varying power supply requirements. The device supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from GND to VDD.
The TMUX1208-Q1 comes in a small QFN package to enable reduced system size requirements. The device has low on-resistance of 5Ω typical to minimize the impact of distortion and signal integrity issues when the device is not connected to a high impedance signal path.
All logic inputs have 1.8 V logic compatible thresholds, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX1208-Q1 5-V Bidirectional 8:1 Multiplexer with 1.8-V Logic datasheet (Rev. A) | Jul. 24, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
UQFN (RSV) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.