TMUX136

ACTIVE

5-V, 2:1 (SPDT), 2-channel analog switch with powered-off isolation

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 2 Power supply voltage - single (V) 2.5, 3.3, 5 Ron (Typ) (Ohms) 4.6 ON-state leakage current (Max) (µA) 2 Bandwidth (MHz) 6100 Operating temperature range (C) -40 to 85 Features 1.8-V compatible control inputs, Powered-off protection, Supports I2C signals Input/output continuous current (Max) (mA) 20 Rating Catalog CON (Typ) (pF) 1.4 Supply current (Typ) (uA) 30 open-in-new Find other Analog switches & muxes

Package | Pins | Size

UQFN (RSE) 10 3 mm² 2 x 1.5 open-in-new Find other Analog switches & muxes

Features

  • VCC Range 2.3 V to 4.8 V
  • High Performance Switch Characteristics:
    • Bandwidth (–3 dB): 6.1 GHz
    • RON (Typical): 5.7 Ω
    • CON (Typical): 1.6 pF
  • Current Consumption: 30 µA (Typical)
  • Special Features:
    • IOFF Protection Prevents Current Leakage in Powered-Down State
    • 1.8-V Compatible Control Inputs (SEL, EN)
  • ESD Performance:
    • 5-kV Human Body Model (A114B, Class II)
    • 1-kV Charged-Device Model (C101)
  • Compact 10-Pin UQFN Package (1.5-mm × 2-mm, 0.5-mm Pitch)

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Description

The TMUX136 device is a high performance, 6-GHz, 2-channel, 2:1 switch that will support both differential and single ended signals. The device has a wide VCC range of 2.3 V to 4.8 V and supports a power-off protection feature forcing all I/O pins to be in high-impedance mode when power is not present on the VCC pin. The select pins of TMUX136 are compatible with 1.8-V control voltage, allowing them to be directly interfaced with the General-Purpose I/O (GPIO) from low voltage processors.

The TMUX136 comes in a small 10-pin UQFN package with only 1.5 mm × 2 mm in size, which makes it useful when PCB area is limited.

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Technical documentation

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Type Title Date
* Datasheet TMUX136 6-GHz, 2-Channel, 2:1 Switch, With Power-off Isolation datasheet (Rev. D) Aug. 18, 2020
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Application notes Eliminate power Sequencing with powered-off protection signal switches (Rev. B) Jan. 15, 2019
Application notes Improve Stability Issues with Low Con Multiplexers (Rev. A) Dec. 10, 2018
Application notes 1.8 V Logic for Muxes and Signal May 16, 2018

Design & development

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Hardware development

INTERFACE ADAPTERS Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODELS Download
SCDJ047.ZIP (84 KB) - Spice Model
SIMULATION MODELS Download
SCDM171.TSC (3045 KB) - TINA-TI Reference Design
SIMULATION MODELS Download
SCDM172.ZIP (4 KB) - TINA-TI Spice Model
SIMULATION MODELS Download
SCDM173A.ZIP (1 KB) - PSpice Model
SIMULATION MODELS Download
SCDM176.ZIP (2 KB) - IBIS Model
SIMULATION MODELS Download
SCDM209.ZIP (127 KB) - S-Parameter Model

CAD/CAE symbols

Package Pins Download
UQFN (RSE) 10 View options

Ordering & quality

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