5-pA, ±16.5-V, 4:1, 1-channel precision analog multiplexer
Product details
Parameters
Package | Pins | Size
Features
- Low On-Capacitance: 5 pF
- Low Input Leakage: 5 pA
- Low Charge Injection: 0.35 pC
- Rail-to-Rail Operation
- Wide Supply Range: ±5 V to ±16.5 V (Dual Supplies) or 10 V to 16.5 V (Single Supply)
- Low On-Resistance: 125 Ω
- Transition Time: 88 ns
- Break-Before-Make Switching Action
- EN Pin Connectable to VDD With Integrated Pull-down
- Logic Levels: 2 V to VDD
- Low Supply Current: 17 µA
- ESD Protection HBM: 2000 V
- Industry-Standard TSSOP Package
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Description
The TMUX6104 is a modern complementary metal-oxide semiconductor (CMOS) analog multiplexer (MUX) that offers 4:1 single-ended multiplexing. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or unsymmetric supplies (such as VDD = 12 V, VSS = –5 V). All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.
The TMUX6104 multiplexes one of four inputs (Sx) to a common output (D), depending on the status of the address pins (A0/ A1) and the enable pin (EN). Each switch conducts equally well in both directions in the ON position and supports input signal range up to the supplies. In the OFF condition, signal levels up to the supplies are blocked. All switches exhibit break-before-make (BBM) switching action.
The TMUX6104 device is part of Texas Instruments Precision Switches and Multiplexers family. The family of devices have very low leakage current and charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 17 µA enables the devices usage in portable applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX6104 36-V, Low-Capacitance, Low-Leakage-Current, Precision, 4:1 Analog Multiplexer datasheet (Rev. A) | Sep. 04, 2018 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | Improve Stability Issues with Low Con Multiplexers (Rev. A) | Dec. 10, 2018 | |
Technical articles | Is charge injection causing output voltage errors in your industrial control system? | Oct. 18, 2018 | |
Application note | System Level Protection for High Voltage Analog Multiplexers | Jan. 03, 2017 | |
Technical articles | Does a low-leakage multiplexer really matter in a high-impedance PLC system? | Feb. 19, 2016 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 14 | View options |
Ordering & quality
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- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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