5-pA, ±16.5-V, 1:1 (SPST) 2-channel precision analog switch (active high)
Product details
Parameters
Package | Pins | Size
Features
- Wide Supply Range: ±5 V to ±16.5 V (dual) or 10 V to 16.5 V (single)
- Latch-Up Performance Meets 100 mA per JESD78 Class II Level A on all Pins
- Low On-Capacitance: 4.2 pF
- Low Input Leakage: 0.5 pA
- Low Charge Injection: 0.51 pC
- Rail-to-Rail Operation
- Low On-Resistance: 120 Ω
- Fast Switch Turn-On Time: 68 ns
- Break-Before-Make Switching (TMUX6123)
- SELx Pin Connectable to VDD With Integrated Pull-down
- Logic Levels: 2 V to VDD
- Low Supply Current: 16 µA
- Human Body Model (HBM) ESD Protection: ± 2kV on All Pins
- Industry-Standard VSSOP Package
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Description
The TMUX6121, TMUX6122, and TMUX6123 are modern complementary metal-oxide semiconductor (CMOS) devices that have two independently selectable single-pole, single-throw (SPST) switches. The devices work well with dual supplies (±5 V to ±16.5 V), a single supply (10 V to 16.5 V), or asymmetric supplies. All digital inputs have transistor-transistor logic (TTL) compatible thresholds, ensuring both TTL and CMOS logic compatibility.
The switches are turned on with Logic 1 on the digital control inputs in the TMUX6121. Logic 0 is required to turn on switches in the TMUX6122. The TMUX6123 has one switch with similar digital control logic to the TMUX6121 while the logic is inverted on the other switch. The TMUX6123 exhibits break-before-make switching, allowing the device to be used in the cross-point switching application.
The TMUX6121, TMUX6122, and TMUX6123 are part of the precision switches and multiplexers family of devices. The devices have very low leakage current and low charge injection, allowing them to be used in high-precision measurement applications. Low supply current of 16 µA enables the device usage in portable applications.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX612x ±16.5-V, Low-Capacitance, Low-Leakage-Current, Precision, Dual SPST Switches datasheet | Dec. 21, 2018 |
Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
Application note | System Level Protection for High Voltage Analog Multiplexers | Jan. 03, 2017 | |
Technical articles | Does a low-leakage multiplexer really matter in a high-impedance PLC system? | Feb. 19, 2016 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
VSSOP (DGS) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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