36-V Low Ron, 1:1, 4 channel, multiplexer with 1.8V logic control
Product details
Parameters
Features
- Dual Supply Range: ±4.5 V to ±18 V
- Single Supply Range: 4.5 V to 36 V
- Low On-Resistance: 2 Ω
- –40°C to +125°C Operating Temperature
- Logic Levels: L8 V to VDD
- Fail-Safe Logic
- Rail-to-Rail Operation
- Bidirectional Operation
- Break-Before-Make Switching
- ESD Protection HBM: 2000 V
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Description
The TMUX6211, TMUX6212, and TMUX6213 are complementary metal-oxide semiconductor (CMOS) switches with four independently selectable 1:1, single-pole, singlethrow (SPST) switch channels. The devices work well with dual supplies (±4.5 V to±18 V), a single supply (4.5 V to 36 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX621x supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.
The switches of the TMUX6211 are turned on with Logic 0 on the appropriate logic control inputs, while Logic 1 is required to turn on switches in the TMUX6212. The four channels of the TMUX6213 are split with two switches supporting Logic 0, while the other two switches support Logic 1. The TMUX6213 exhibits break-before-make switching, allowing the device to be used in cross-point switching applications.
The TMUX621x are part of the precision switches and multiplexers family of devices. These devices have very low on and off leakage currents and low charge injection, allowing them to be used in high precision measurement applications.

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Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TMUX621x 36-V, Low-Ron, 1:1 (SPST), 4-Channel Precision Switches with 1.8-V Logic datasheet | Oct. 14, 2020 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
TSSOP (PW) | 16 | View options |
WQFN (RUM) | 16 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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