Product details

Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.9 CON (typ) (pF) 146 ON-state leakage current (max) (µA) 0.07 Supply current (typ) (µA) 30 Bandwidth (MHz) 38 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 210 TI functional safety category Functional Safety-Capable Rating Automotive
Configuration 2:1 SPDT Number of channels 1 Power supply voltage - single (V) 5, 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 1.9 CON (typ) (pF) 146 ON-state leakage current (max) (µA) 0.07 Supply current (typ) (µA) 30 Bandwidth (MHz) 38 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make Input/output continuous current (max) (mA) 210 TI functional safety category Functional Safety-Capable Rating Automotive
VSSOP (DGK) 8 14.7 mm² 3 x 4.9
  • AEC-Q100 qualified for automotive applications
    • Device temperature grade 1: –40°C to 125°C ambient operating temperature
  • Functional safety-capable
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 2.1 Ω
  • Low charge injection: -10 pC
  • High current support: 330 mA (maximum)
  • 1.8 V logic compatible
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching
  • AEC-Q100 qualified for automotive applications
    • Device temperature grade 1: –40°C to 125°C ambient operating temperature
  • Functional safety-capable
  • Latch-up immune
  • Dual supply range: ±4.5 V to ±22 V
  • Single supply range: 4.5 V to 44 V
  • Low on-resistance: 2.1 Ω
  • Low charge injection: -10 pC
  • High current support: 330 mA (maximum)
  • 1.8 V logic compatible
  • Fail-safe logic
  • Rail-to-rail operation
  • Bidirectional signal path
  • Break-before-make switching

The TMUX7219-Q1 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a single channel, 2:1 (SPDT) configuration. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7219-Q1 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX7219-Q1 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

The TMUX7219-Q1 is a complementary metal-oxide semiconductor (CMOS) switch with latch-up immunity in a single channel, 2:1 (SPDT) configuration. The device works with a single supply (4.5 V to 44 V), dual supplies (±4.5 V to ±22 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5 V). The TMUX7219-Q1 supports bidirectional analog and digital signals on the source (Sx) and drain (D) pins ranging from VSS to VDD.

The TMUX7219-Q1 can be enabled or disabled by controlling the EN pin. When disabled, both signal path switches are off. When enabled, the SEL pin can be used to turn on signal path 1 (S1 to D) or signal path 2 (S2 to D). All logic control inputs support logic levels from 1.8 V to VDD, ensuring both TTL and CMOS logic compatibility when operating in the valid supply voltage range. Fail-Safe Logic circuitry allows voltages on the control pins to be applied before the supply pin, protecting the device from potential damage.

The TMUX72xx family provides latch-up immunity, preventing undesirable high current events between parasitic structures within the device typically caused by overvoltage events. A latch-up condition typically continues until the power supply rails are turned off and can lead to device failure. The latch-up immunity feature allows the TMUX72xx family of switches and multiplexers to be used in harsh environments.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 4
Type Title Date
* Data sheet TMUX7219-Q1 44-V, Latch-Up Immune, 2:1 (SPDT) Precision Switch with 1.8-V Logic datasheet (Rev. A) PDF | HTML 21 Jun 2021
Application note How to Handle High Voltage Common Mode Applications using Multiplexers PDF | HTML 03 Oct 2022
Application note Using Latch Up Immune Multiplexers to Help Improve System Reliability (Rev. A) 20 Sep 2021
Functional safety information TMUX7219-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML 14 Jun 2021

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
Not available on TI.com
Package Pins Download
VSSOP (DGK) 8 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos