TPA4411

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80-mW, stereo, analog input headphone amplifier

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Product details

Parameters

Output power (W) 0.08 Analog supply (Min) (V) 1.8 Analog supply (Max) (V) 4.5 PSRR (dB) 80 Rating Catalog Operating temperature range (C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (uA) 1 Architecture Class-AB Iq per channel (Typ) (mA) 3.7 open-in-new Find other Headphone amps

Package | Pins | Size

DSBGA (YZH) 16 5 mm² 2.206 x 2.206 WQFN (RTJ) 20 16 mm² 4.0 x 4.0 open-in-new Find other Headphone amps

Features

  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs
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Description

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

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Technical documentation

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Type Title Date
* Data sheet 80-mW DirectPath(TM) Stereo Headphone Driver datasheet (Rev. E) Mar. 04, 2008
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) Aug. 26, 2019
Application note AN-1849 An Audio Amplifier Power Supply Design (Rev. C) Jun. 27, 2019
More literature Журнал по применению аналоговых компонентов 2кв. 2010 Aug. 08, 2011
Application note 2Q 2010 Issue Analog Applications Journal May 06, 2010
Application note Precautions for connecting APA outputs to other devices May 06, 2010
User guide TPA4411EVM - User Guide (Rev. A) Jan. 09, 2008
More literature TPA4411_NanoEVM_ Schematic Feb. 13, 2007
More literature TPA4411_NanoEVM_OV Jan. 29, 2007

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
49
Description

The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)

Features
  • Includes a 2mm x 2mm QFN IC
  • Eliminates Output DC-Blocking Capacitors
  • 80-mW Output Power Into 16-Ohms at 4.5V
  • Wide Supply Voltage Range (1.8V to 4.5V)
  • Independent R/L Channel Shutdown Control
  • Internal thermal and short-circuit protection
  • Pop Reduction Circuitry

Design tools & simulation

SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)
GERBER FILE Download
SLVC074.ZIP (87 KB)

CAD/CAE symbols

Package Pins Download
DSBGA (YZH) 16 View options
QFN (RTJ) 20 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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