Product details

Output power (W) 0.08 Analog supply (Min) (V) 1.8 Analog supply (Max) (V) 4.5 PSRR (dB) 80 Rating Catalog Operating temperature range (C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (uA) 1 Architecture Class-AB Iq per channel (Typ) (mA) 3.7
Output power (W) 0.08 Analog supply (Min) (V) 1.8 Analog supply (Max) (V) 4.5 PSRR (dB) 80 Rating Catalog Operating temperature range (C) -40 to 85 Headphone channels Stereo Volume control No Shutdown current (ISD) (uA) 1 Architecture Class-AB Iq per channel (Typ) (mA) 3.7
DSBGA (YZH) 16 5 mm² 2.206 x 2.206 WQFN (RTJ) 20 16 mm² 4.0 x 4.0
  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs
  • Space Saving Packages
    • 20-Pin, 4 mm × 4 mm Thin QFN
      • PA4411 — Thermally Optimized PowerPAD™ Package
      • TTPA4411M — Thermally Enhanced PowerPAD™ Package
    • 16-Ball, 2.18 mm × 2.18 mm WCSP
  • Ground-Referenced Outputs Eliminate
    DC-Bias Voltages on Headphone Ground Pin
    • No Output DC-Blocking Capacitors
      • Reduced Board Area
      • Reduced Component Cost
      • Improved THD+N Performance
      • No Degradation of Low-Frequency Response Due to Output Capacitors
    • Wide Power Supply Range: 1.8 V to 4.5 V
    • 80-mW/Ch Output Power into 16- at 4.5 V
    • Independent Right and Left Channel
      Shutdown Control
    • Short-Circuit and Thermal Protection
    • Pop Reduction Circuitry
  • APPLICATIONS
    • Notebook Computers
    • CD / MP3 Players
    • Smart Phones
    • Cellular Phones
    • PDAs

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

The TPA4411 and TPA4411M are stereo headphone drivers designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The TPA4411 and TPA4411M are ideal for small portable electronics where size and cost are critical design parameters.

The TPA4411 and TPA4411M are capable of driving 80 mW into a 16- load at 4.5 V. Both TPA4411 and TPA4411M have a fixed gain of 1.5 V/V and headphone outputs that have ±8-kV IEC ESD protection. The TPA4411 and TPA4411M have independent shutdown control for the right and left audio channels.

The TPA4411 is available in a 2.18 mm × 2.18 mm WCSP and 4 mm × 4 mm Thin QFN packages. The TPA4411M is available in a 4 mm × 4 mm Thin QFN package. The TPA4411RTJ package is a thermally optimized PowerPAD™ package allowing the maximum amount of thermal dissipation and the TPA4411MRTJ is a thermally enhanced PowerPAD package designed to match competitive package footprints.

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Technical documentation

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Type Title Date
* Data sheet 80-mW DirectPath(TM) Stereo Headphone Driver datasheet (Rev. E) 04 Mar 2008
Application note Guidelines for Measuring Audio Power Amplifier Performance (Rev. A) 26 Aug 2019
Application note AN-1849 An Audio Amplifier Power Supply Design (Rev. C) 27 Jun 2019
More literature Журнал по применению аналоговых компонентов 2кв. 2010 08 Aug 2011
Analog Design Journal 2Q 2010 Issue Analog Applications Journal 06 May 2010
Analog Design Journal Precautions for connecting APA outputs to other devices 06 May 2010
EVM User's guide TPA4411EVM - User Guide (Rev. A) 09 Jan 2008
More literature TPA4411_NanoEVM_ Schematic 13 Feb 2007
More literature TPA4411_NanoEVM_OV 29 Jan 2007

Design & development

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Evaluation board

TPA4411EVM — TPA4411 Evaluation Module (EVM)

The TPA4411 is a stereo headphone driver evaluation module. The TPA4411 device is designed to allow the removal of the output DC-blocking capacitors for reduced component count and cost. The evaluation module consists of a TI TPA4411 80-mW audio power amplifier in a small QFN package. It is ideal (...)

User guide: PDF
Not available on TI.com
Gerber file

TPA4411 Gerber Files

SLVC074.ZIP (87 KB)
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Package Pins Download
DSBGA (YZH) 16 View options
QFN (RTJ) 20 View options

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