2-ch, 5.5-V, 0.25-A, 80-mΩ, load switch with active high enables
Product details
Parameters
We are not able to display this information. Please refer to the product data sheet.Package | Pins | Size
Features
- 80-m
High-Side MOSFET Switch
- 250 mA Continuous Current per Channel
- Independent Thermal and Short-Circuit Protection With Overcurrent Logic Output
- Operating Range: 2.7-V to 5.5-V
- CMOS- and TTL-Compatible Enable Inputs
- 2.5-ms Typical Rise Time
- Undervoltage Lockout
- 10 µA Maximum Standby Supply Current
- Bidirectional Switch
- Available in 8-Pin and 16-Pin SOIC Packages
- Ambient Temperature Range, 0°C to 85°C
- ESD Protection
Description
The TPS2090, TPS2091, and TPS2092 dual and the TPS2095, TPS2096 and TPS2097 quad power-distribution switches are intended for applications where heavy capacitive loads and short circuits are likely to be encountered. The TPS209x devices incorporate 80-m N-channel MOSFET high-side power switches for power-distribution systems that require multiple power switches in a single package. Each switch is controlled by an independent logic enable input. Gate drive is provided by an internal charge pump designed to control the power-switch rise times and fall times to minimize current surges during switching. The charge pump requires no external components and allows operation from supplies as low as 2.7 V.
When the output load exceeds the current-limit threshold or a short is present, the TPS209x limits the output current to a safe level by switching into a constant-current mode, pulling the overcurrent (OCx) logic output low. When continuous heavy overloads and short circuits increase the power dissipation in the switch causing the junction temperature to rise, a thermal protection circuit shuts off the switch to prevent damage. Recovery from a thermal shutdown is automatic once the device has cooled sufficiently. Internal circuitry ensures the switch remains off until valid input voltage is present. The TPS209x devices are designed to current limit at 0.5-A load.
Same functionality but is not pin-for-pin or parametrically equivalent to the compared device:
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | POWER-DISTRIBUTION SWITCHES datasheet (Rev. C) | Oct. 11, 2007 |
Selection guide | Power Management Guide 2018 (Rev. R) | Jun. 25, 2018 | |
Application note | Basics of eFuses (Rev. A) | Apr. 05, 2018 | |
Technical articles | How can a load switch extend your device’s battery life? | Mar. 20, 2018 | |
Technical articles | How and why you should use load switches for power sequencing | Feb. 06, 2018 | |
Technical articles | How to use load switches and eFuses in your set-top box design | Nov. 23, 2017 | |
Technical articles | Don’t leave it floating! Power off your outputs with quick output discharge | Dec. 09, 2016 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.