Home Power management Power switches Load switches
Home
Power management
Power switches
Load switches

TPS22932B

ACTIVE

3.6-V, 0.5-A, 55-mΩ, 80nA leakage load switch with output discharge

Order now
Data sheet

TPS22932B

ACTIVE
Data sheet Order now

Product details

Number of channels 1 Vin (min) (V) 1.1 Vin (max) (V) 3.6 Imax (A) 0.5 Ron (typ) (mΩ) 58 Shutdown current (ISD) (typ) (µA) 0.34 Quiescent current (Iq) (typ) (µA) 0.86 Soft start Fixed Rise Time Current limit type None Features Quick output discharge Rating Catalog Operating temperature range (°C) -40 to 85 FET Internal Device type Load switches Function Inrush current control
Number of channels 1 Vin (min) (V) 1.1 Vin (max) (V) 3.6 Imax (A) 0.5 Ron (typ) (mΩ) 58 Shutdown current (ISD) (typ) (µA) 0.34 Quiescent current (Iq) (typ) (µA) 0.86 Soft start Fixed Rise Time Current limit type None Features Quick output discharge Rating Catalog Operating temperature range (°C) -40 to 85 FET Internal Device type Load switches Function Inrush current control
DSBGA (YFP) 6 1.4000000000000001 mm² 1 x 1.4000000000000001
  • Input Voltage: 1.1 V to 3.6 V
  • Ultralow ON-Resistance
    • rON = 55 mΩ at VIN = 3.6 V
    • rON = 65 mΩ at VIN = 2.5 V
    • rON = 75 mΩ at VIN = 1.8 V
    • rON = 115 mΩ at VIN = 1.2 V
  • 500-mA Maximum Continuous Switch Current
  • Quiescent Current < 1 µA
  • Shutdown Current < 1 µA
  • Low Control Threshold Allows Use of 1.2-V, 1.8-V,
    2.5-V, and 3.3-V Logic
  • Configurable Enable Logic
  • Controlled Slew Rate to Avoid Inrush Currents:
    165 µs at 1.8 V
  • Six-Terminal Wafer Chip Scale Package (DSBGA)
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • APPLICATIONS
    • PDAs
    • Cell Phones
    • GPS Devices
    • MP3 Players
    • Digital Cameras
    • Peripheral Ports
    • Portable Instrumentation

All other trademarks are the property of their respective owners
  • Input Voltage: 1.1 V to 3.6 V
  • Ultralow ON-Resistance
    • rON = 55 mΩ at VIN = 3.6 V
    • rON = 65 mΩ at VIN = 2.5 V
    • rON = 75 mΩ at VIN = 1.8 V
    • rON = 115 mΩ at VIN = 1.2 V
  • 500-mA Maximum Continuous Switch Current
  • Quiescent Current < 1 µA
  • Shutdown Current < 1 µA
  • Low Control Threshold Allows Use of 1.2-V, 1.8-V,
    2.5-V, and 3.3-V Logic
  • Configurable Enable Logic
  • Controlled Slew Rate to Avoid Inrush Currents:
    165 µs at 1.8 V
  • Six-Terminal Wafer Chip Scale Package (DSBGA)
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • APPLICATIONS
    • PDAs
    • Cell Phones
    • GPS Devices
    • MP3 Players
    • Digital Cameras
    • Peripheral Ports
    • Portable Instrumentation

All other trademarks are the property of their respective owners

The TPS22932B device is a low rON load switch with controlled turnon. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V.

The switch is controlled by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VIN or GND. The control pins can be connected to low-voltage GPIOs allowing the switch to be controlled by either 1.2-V, 1.8-V, 2.5-V, or 3.3-V logic signals while keeping extremely low quiescent current.

A 120-Ω on-chip load resistor is available for output quick discharge when the switch is turned off. The rise time (slew rate) of the device is internally controlled to avoid inrush current: the rise time of TPS22932B is 165 µs.

TPS22932B is available in a space-saving 6-pin DSBGA (YFP with 0.4-mm pitch). The device is characterized for operation over the free-air temperature range of –40°C to 85°C.

The TPS22932B device is a low rON load switch with controlled turnon. The device contains a P-channel MOSFET that can operate over an input voltage range of 1.1 V to 3.6 V.

The switch is controlled by eight patterns of 3-bit input. The user can choose the logic functions MUX, AND, OR, NAND, NOR, inverter, and noninverter. All inputs can be connected to VIN or GND. The control pins can be connected to low-voltage GPIOs allowing the switch to be controlled by either 1.2-V, 1.8-V, 2.5-V, or 3.3-V logic signals while keeping extremely low quiescent current.

A 120-Ω on-chip load resistor is available for output quick discharge when the switch is turned off. The rise time (slew rate) of the device is internally controlled to avoid inrush current: the rise time of TPS22932B is 165 µs.

TPS22932B is available in a space-saving 6-pin DSBGA (YFP with 0.4-mm pitch). The device is characterized for operation over the free-air temperature range of –40°C to 85°C.
open-in-new Find other Load switches
Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 7
Type Title Date
* Data sheet TPS22932B Low Input Voltage, Ultralow rON Load Switch With Configurable Enable Logic and Controlled Slew-Rate datasheet (Rev. C) PDF | HTML 29 May 2015
Application note Load Switch Thermal Considerations (Rev. A) 11 Oct 2018
Application note Basics of Load Switches (Rev. A) 05 Sep 2018
Application note Selecting a Load Switch to Replace a Discrete Solution 30 Apr 2017
Application note Timing of Load Switches 27 Apr 2017
Application note Managing Inrush Current (Rev. A) 28 May 2015
User guide TPS22931/32/32B Evaluation Module 19 Jan 2009

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Request
Package Pins Download
DSBGA (YFP) 6 View options
TI's Standard Terms and Conditions for Evaluation Items apply.

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos