Product details

Number of channels (#) 1 Vin (Min) (V) 1 Vin (Max) (V) 5.5 Imax (A) 3 Ron (Typ) (mOhm) 13.8 Shutdown current (ISD) (Typ) (uA) 0.76 Quiescent current (Iq) (Typ) (uA) 38 Soft start Fixed Rise Time Rise time (Typ) (us) 890 Current limit type None Features Quick output discharge, Reverse current protection Operating temperature range (C) -40 to 85
Number of channels (#) 1 Vin (Min) (V) 1 Vin (Max) (V) 5.5 Imax (A) 3 Ron (Typ) (mOhm) 13.8 Shutdown current (ISD) (Typ) (uA) 0.76 Quiescent current (Iq) (Typ) (uA) 38 Soft start Fixed Rise Time Rise time (Typ) (us) 890 Current limit type None Features Quick output discharge, Reverse current protection Operating temperature range (C) -40 to 85
DSBGA (YZP) 6 2 mm² .982 x 1.482
  • Integrated N-Channel Load Switch
  • Input Voltage Range: 1 V to 5.5 V
  • Internal Pass-FET RDSON = 8 mΩ (Typ)
  • Ultra-Low ON-Resistance
    • RON = 13 mΩ (Typ) at VIN = 5 V
    • RON = 14 mΩ (Typ) at VIN = 3.3 V
    • RON = 18 mΩ (Typ) at VIN = 1.8 V
  • 3A Maximum Continuous Switch Current
  • Reverse Current Protection (When Disabled)
  • Low Shutdown Current (760 nA)
  • Low Threshold 1.3-V GPIO Control Input
  • Controlled Slew-Rate to Avoid Inrush Current
  • Quick Output Discharge (TPS22964 only)
  • Six Terminal Wafer-Chip-Scale Package (Nominal Dimensions Shown - See Addendum for Details)
    • 0.9 mm x 1.4 mm, 0.5 mm Pitch, 0.5 mm Height (YZP)
  • ESD Performance Tested Per JESD 22
    • 2-kV Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • Integrated N-Channel Load Switch
  • Input Voltage Range: 1 V to 5.5 V
  • Internal Pass-FET RDSON = 8 mΩ (Typ)
  • Ultra-Low ON-Resistance
    • RON = 13 mΩ (Typ) at VIN = 5 V
    • RON = 14 mΩ (Typ) at VIN = 3.3 V
    • RON = 18 mΩ (Typ) at VIN = 1.8 V
  • 3A Maximum Continuous Switch Current
  • Reverse Current Protection (When Disabled)
  • Low Shutdown Current (760 nA)
  • Low Threshold 1.3-V GPIO Control Input
  • Controlled Slew-Rate to Avoid Inrush Current
  • Quick Output Discharge (TPS22964 only)
  • Six Terminal Wafer-Chip-Scale Package (Nominal Dimensions Shown - See Addendum for Details)
    • 0.9 mm x 1.4 mm, 0.5 mm Pitch, 0.5 mm Height (YZP)
  • ESD Performance Tested Per JESD 22
    • 2-kV Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)

The TPS22963/64 is a small, ultra-low RON load switch with controlled turn on. The device contains a low RDSON N-Channel MOSFET that can operate over an input voltage range of 1 V to 5.5 V and switch currents of up to 3 A. An integrated charge pump biases the NMOS switch in order to achieve a low switch ON-Resistance. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage GPIO control signals. The rise time of the TPS22963/64 device is internally controlled in order to avoid inrush current.

The TPS22963/64 provides reverse current protection. When the power switch is disabled, the device will not allow the flow of current towards the input side of the switch. The reverse current protection feature is active only when the device is disabled so as to allow for intentional reverse current (when the switch is enabled) for some applications.

The TPS22963/64 is available in a small, space-saving 6-pin WCSP package and is characterized for operation over the free air temperature range of –40°C to 85°C.

The TPS22963/64 is a small, ultra-low RON load switch with controlled turn on. The device contains a low RDSON N-Channel MOSFET that can operate over an input voltage range of 1 V to 5.5 V and switch currents of up to 3 A. An integrated charge pump biases the NMOS switch in order to achieve a low switch ON-Resistance. The switch is controlled by an on/off input (ON), which is capable of interfacing directly with low-voltage GPIO control signals. The rise time of the TPS22963/64 device is internally controlled in order to avoid inrush current.

The TPS22963/64 provides reverse current protection. When the power switch is disabled, the device will not allow the flow of current towards the input side of the switch. The reverse current protection feature is active only when the device is disabled so as to allow for intentional reverse current (when the switch is enabled) for some applications.

The TPS22963/64 is available in a small, space-saving 6-pin WCSP package and is characterized for operation over the free air temperature range of –40°C to 85°C.

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Technical documentation

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Type Title Date
* Data sheet TPS2296xC 5.5-V, 3-A, 13-mΩ On-Resistance Load Switch With Reverse Current Protection and Controlled Turn-On datasheet (Rev. A) 14 Jan 2015
Technical article How innovative packaging can drive higher power density in load switches 23 Feb 2022
Application note Load Switch Thermal Considerations (Rev. A) 11 Oct 2018
Application note Basics of Load Switches (Rev. A) 05 Sep 2018
Technical article How can a load switch extend your device’s battery life? 20 Mar 2018
Technical article How and why you should use load switches for power sequencing 06 Feb 2018
Technical article How to use load switches and eFuses in your set-top box design 23 Nov 2017
Application note Selecting a Load Switch to Replace a Discrete Solution 30 Apr 2017
Application note Timing of Load Switches 27 Apr 2017
Application note Reverse Current Protection in Load Switches 19 May 2016
Application note Managing Inrush Current (Rev. A) 28 May 2015
EVM User's guide Using the TPS22963/64EVM-029 Single Channel Load Switch IC (Rev. A) 26 Jun 2013

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Evaluation board

TPS22964CEVM-029 — TPS22964C Load Switch Evaluation Module

The Texas Instruments TPS22964CEVM-029 evaluation module (EVM) helps designers evaluate the performance of the TPS22964C low on-resistance, 3-A load switch in the ultra-small CSP-6 package. The EVM allows the designer to apply an input voltage (1.1 V-5.5 V) under different loading conditions (0-3 (...)

Simulation model

TPS22964C Unencrypted PSpice Transient Model Package (Rev. A)

SLVM832A.ZIP (41 KB) - PSpice Model
Simulation model

TPS22964C TINA-TI Reference Design

SLVMAR5.TSC (107 KB) - TINA-TI Reference Design
Simulation model

TPS22964C TINA-TI Transient Spice Model

SLVMAR6.ZIP (17 KB) - TINA-TI Spice Model
Simulation tool

PSPICE-FOR-TI — PSpice® for TI design and simulation tool

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Reference designs

TIDA-050043 — Integrated power supply reference design for NXP i.MX 6ULL processor

This reference design is a fully functional development board powering an NXP™ i.MX 6ULL application processor from a TPS6521815 PMIC. The hardware design consists of DDR3L SDRAM (512 MB), 32-MB Serial NOR Flash, 8-GB eMMC 5.0 iNAND, SD Card interface v3.0, dual-channel 100Base-T Ethernet, (...)
Reference designs

TIDA-00399 — SSD Power Delivery Reference Design

The TIDA-00399 design implements a complete power delivery solution for an SSD in the M.2 form factor. The TPS22954 load switch is used to limit inrush current and eliminate the need for a separate supervisor circuit on the system input. This design is tested and includes GUI, demo, and User's (...)
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DSBGA (YZP) 6 View options

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