TS3A225E

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100-mΩ audio jack switch with autonomous microphone & ground detection

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Product details

Parameters

Configuration audio jack Features Autonomous headset MIC/GND detection (3 or 4 pole), Integrated Codec Sense Line, Manual I2C Control Supply voltage (Min) (V) 2.7 Supply voltage (Max) (V) 4.5 Supply current (Typ) (uA) 8 Operating temperature range (C) -40 to 85 open-in-new Find other Audio switches

Package | Pins | Size

DSBGA (YFF) 16 0 mm² 1.6 x 1.6 WQFN (RTE) 16 9 mm² 3 x 3 open-in-new Find other Audio switches

Features

  • VDD Range = 2.7 V to 4.5 V
  • Break Before Make Stereo Jack Switches
  • Ron for Ground FET Switches
    • WCSP Package: 70 mΩ
    • QFN Package: 100 mΩ
  • Autonomous Detection of GND and MIC Connections
  • Detection Triggered by I2C or External Trigger Pin
  • HDA Compatible MIC Present Indicator
  • 1.8V Compatible I2C Switch Control
  • ESD Performance Tested Per JESD 22:
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2, TIP)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
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Description

The TS3A225E is an audio headset switch device. The device detects the presence of an analog microphone and switches a system analog microphone pin between different connectors in an audio stereo jack. The microphone connection in a stereo connector can be swapped with the ground connection depending on manufacturer. When the TS3A225E detects a certain configuration, the device automatically connects the microphone line to the appropriate pin. The device also reports the presence of an analog microphone on an audio stereo jack.

In some systems, it is desirable to connect the stereo jack pin to ground. The TS3A225E provides two internal low resistance (<100mΩ) FET switches for ground shorting.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 8
Type Title Date
* Datasheet Autonomous Audio Headset Switch datasheet (Rev. A) May 29, 2013
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families (Rev. A) Jun. 30, 2020
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Support Selfie Sticks Using a TS3A227E Audio Jack Switch Mar. 04, 2016
Technical articles Can you hear me now? Audio jack switches could be the answer. Nov. 19, 2014
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
Application note CBT-C, CB3T, and CB3Q Signal-Switch Families Feb. 04, 2003

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

DAUGHTER CARD Download
Description

When plugged into a LaunchPad™ Development Kit, the BOOSTXL-AUDIO Audio BoosterPack™ Plug-in Module can capture audio input from a microphone and output audio through an on-board speaker. Headphone input and output is also supported. This audio input/output stream lets developers (...)

Features
  • High quality audio playback with onboard 14-bit DAC (can be bypassed if target MCU has an integrated DAC)
  • Automatic switching from onboard speakers and microphone to a headset with microphone
  • Onboard microphone supports sampling rates of up to 20kHz
INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDM145.ZIP (483 KB) - HSpice Model
SIMULATION MODEL Download
SCDM146.ZIP (482 KB) - HSpice Model
SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

CAD/CAE symbols

Package Pins Download
DSBGA (YFF) 16 View options
WQFN (RTE) 16 View options

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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