80-mΩ, 3.3-V, 2 x 2 crosspoint switch for audio applications


Product details


Protocols Analog Audio Configuration Crosspoint/exchange Number of channels (#) 2 Supply voltage (Max) (V) 3.6 Supply voltage (Min) (V) 3 Ron (Typ) (Ohms) 0.08 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 3.6 Supply current (Typ) (uA) 40 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 ESD CDM (kV) 0.5 ICC (Typ) (uA) 40 Input/output continuous current (Max) (mA) 100 OFF-state leakage current (Max) (µA) 0.5 Propagation delay (ns) 10 Ron (Max) (Ohms) 0.11 RON flatness (Typ) (Ohms) 1 Turn off time (disable) (Max) (ns) 10 Turn on time (enable) (Max) (ns) 200 VIH (Min) (V) 1.2 VIL (Max) (V) 0.4 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .847 x 1.348 open-in-new Find other Protocol-specific switches & muxes


  • Ultra Low RON for GND Switch (80-mΩ typical)
  • RON for MIC Switch <10-Ω
  • 3.0V to 3.6V V+ Operation
  • Control Input is 1.8-V Logic Compatible
  • 6-bump, 0.5mm pitch CSP Package (1.45mm × 0.95mm × 0.5mm)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 500-V Charged-Device Model (C101)
  • ESD Performance (SLEEVE, RING2)
    • ±8-kV Contact Discharge (IEC 61000-4-2)
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The TS3A26746E is a 2 × 2 cross-point switch that is used to interchange the Ground and MIC connections on a headphone connector. The Ground switch has an ultra low RON of <0.1Ω to minimize voltage drop across it, preventing undesired increases in headphone ground reference voltage. The switch state is controlled via the SEL input. When SEL=High, GND is connected to RING2 and MIC is connected to SLEEVE. When SEL=Low, GND is connected to SLEEVE and MIC is connected to RING2. An internal 100k pull-up resistor on the SEL input sets the default state of the switch.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 5
Type Title Date
* Datasheet 2 X 2 CROSSPOINT SWITCH FOR AUDIO APPLICATIONS datasheet (Rev. C) May 23, 2013
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
Technical articles USB Type-C audio: Do I need to buy a new pair of headphones? Jul. 07, 2016
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

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Hardware development

document-generic User guide
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SCDM143.ZIP (587 KB) - HSpice Model

CAD/CAE symbols

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DSBGA (YZP) 6 View options

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