Automotive 0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability

Automotive 0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability



Product details


Protocols Analog Audio Configuration 2:1 SPDT Number of channels (#) 2 Bandwidth (MHz) 18.3 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 2.3 Ron (Typ) (Ohms) 0.52 Input/ouput voltage (Min) (V) -3.2 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 6 ESD HBM (Typ) (kV) 1.5 Operating temperature range (C) -40 to 125 Crosstalk (dB) -78 ESD CDM (kV) 1.5 ICC (Typ) (uA) 1 Input/output continuous current (Max) (mA) 150 CON (Typ) (pF) 370 Off isolation (Typ) (dB) -70 Ron (Max) (Ohms) 1.3 Ron channel match (Max) (Ohms) 0.3 RON flatness (Typ) (Ohms) 0.076 Turn off time (disable) (Max) (ns) 70 Turn on time (enable) (Max) (ns) 120 VIH (Min) (V) 1.4 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Protocol-specific switches & muxes


  • Qualified for automotive applications
  • Specified Break-Before-Make (BBM) switching
  • Negative signal swing capability: Maximum swing
    From –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal shunt switch prevents audible click-and-
    pop when switching between two sources
  • Low On-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent channel to channel On-state resistance
  • 2.3-V to 5.5-V power supply (VCC)
  • Latch-up performance meets 100 mA per AEC
  • ESD performance
    • 2500-V Human-Body Model tested per AEC
    • 1500-V Charged-Device Model tested per AEC
open-in-new Find other Protocol-specific switches & muxes


The TS5A22364-Q1 is a 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V supply. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364-Q1 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click-and-pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transfer of a signal from one path to another. Low On-state resistance, excellent channel-to-channel On-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications.

open-in-new Find other Protocol-specific switches & muxes

Technical documentation

star = Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 6
Type Title Date
* Data sheet TS5A22364-Q1 0.65-Ω Dual SPDT Analog Switch with Negative Signaling Capability datasheet (Rev. A) Jun. 24, 2016
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Application note 1.8 V Logic for Muxes and Signal (Rev. A) Jan. 06, 2021
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel

Design tools & simulation

SCDM122.ZIP (67 KB) - IBIS Model
SCDM123.ZIP (105 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
VSSOP (DGS) 10 View options

Ordering & quality

Information included:
  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​