TS5A22364-Q1

ACTIVE

Automotive 0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability

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Automotive 0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability

TS5A22364-Q1

ACTIVE

Product details

Parameters

Protocols Analog Audio Configuration 2:1 SPDT Number of channels (#) 2 Bandwidth (MHz) 18.3 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 2.3 Ron (Typ) (Ohms) 0.52 Input/ouput voltage (Min) (V) -3.2 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 6 ESD HBM (Typ) (kV) 1.5 Operating temperature range (C) -40 to 125 Crosstalk (dB) -78 ESD CDM (kV) 1.5 ICC (Typ) (uA) 1 Input/output continuous current (Max) (mA) 150 CON (Typ) (pF) 370 Off isolation (Typ) (dB) -70 Ron (Max) (Ohms) 1.3 Ron channel match (Max) (Ohms) 0.3 Turn on time (enable) (Max) (ns) 120 VIH (Min) (V) 1.4 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Protocol-specific switches & muxes

Features

  • Qualified for automotive applications
  • Specified Break-Before-Make (BBM) switching
  • Negative signal swing capability: Maximum swing
    From –2.75 V to 2.75 V (VCC = 2.75 V)
  • Internal shunt switch prevents audible click-and-
    pop when switching between two sources
  • Low On-state resistance (0.65 Ω typical)
  • Low charge injection
  • Excellent channel to channel On-state resistance
    matching
  • 2.3-V to 5.5-V power supply (VCC)
  • Latch-up performance meets 100 mA per AEC
    Q100-004
  • ESD performance
    • 2500-V Human-Body Model tested per AEC
      Q100-002
    • 1500-V Charged-Device Model tested per AEC
      Q100-011
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Description

The TS5A22364-Q1 is a 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V supply. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364-Q1 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click-and-pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transfer of a signal from one path to another. Low On-state resistance, excellent channel-to-channel On-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 6
Type Title Date
* Datasheet TS5A22364-Q1 0.65-Ω Dual SPDT Analog Switch with Negative Signaling Capability datasheet (Rev. A) Jun. 24, 2016
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note 1.8 V Logic for Muxes and Signal May 16, 2018
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


Design tools & simulation

SIMULATION MODEL Download
SCDM122.ZIP (67 KB) - IBIS Model
SIMULATION MODEL Download
SCDM123.ZIP (105 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
VSSOP (DGS) 10 View options

Ordering & quality

Information included:
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  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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