Automotive 0.65-Ω, 5-V, 2:1 (SPDT), 2-channel analog switch with negative signaling capability
Product details
Parameters
Package | Pins | Size
Features
- Qualified for automotive applications
- Specified Break-Before-Make (BBM) switching
- Negative signal swing capability: Maximum swing
From –2.75 V to 2.75 V (VCC = 2.75 V) - Internal shunt switch prevents audible click-and-
pop when switching between two sources - Low On-state resistance (0.65 Ω typical)
- Low charge injection
- Excellent channel to channel On-state resistance
matching - 2.3-V to 5.5-V power supply (VCC)
- Latch-up performance meets 100 mA per AEC
Q100-004 - ESD performance
- 2500-V Human-Body Model tested per AEC
Q100-002 - 1500-V Charged-Device Model tested per AEC
Q100-011
- 2500-V Human-Body Model tested per AEC
Description
The TS5A22364-Q1 is a 2-channel single-pole double-throw (SPDT) analog switch designed to operate from 2.3 V to 5.5 V supply. The device features negative signal swing capability that allows signals below ground to pass through the switch without distortion. Additionally, the TS5A22364-Q1 includes an internal shunt switch, which automatically discharges any capacitance at the NC or NO terminals when they are unconnected to COM. This reduces the audible click-and-pop noise when switching between two sources. The break-before-make feature prevents signal distortion during the transfer of a signal from one path to another. Low On-state resistance, excellent channel-to-channel On-state resistance matching, and minimal total harmonic distortion (THD) performance are ideal for audio applications.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Data sheet | TS5A22364-Q1 0.65-Ω Dual SPDT Analog Switch with Negative Signaling Capability datasheet (Rev. A) | Jun. 24, 2016 |
| Application note | Multiplexers and Signal Switches Glossary (Rev. A) | Jun. 09, 2021 | |
| Application note | 1.8 V Logic for Muxes and Signal (Rev. A) | Jan. 06, 2021 | |
| Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| VSSOP (DGS) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
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Support & training
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