TS5A23157-Q1

ACTIVE

Product details

Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, LVDS, UART Ron (typ) (Ω) 15 CON (typ) (pF) 17.5 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 220 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (A) 0.05 TI functional safety category Functional Safety-Capable Rating Automotive Drain supply voltage (max) (V) 5.5
Configuration 2:1 SPDT Number of channels 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Protocols Analog, I2C, LVDS, UART Ron (typ) (Ω) 15 CON (typ) (pF) 17.5 ON-state leakage current (max) (µA) 1 Supply current (typ) (µA) 0.01 Bandwidth (MHz) 220 Operating temperature range (°C) -40 to 125 Features Break-before-make Input/output continuous current (max) (A) 0.05 TI functional safety category Functional Safety-Capable Rating Automotive Drain supply voltage (max) (V) 5.5
VSSOP (DGS) 10 14.7 mm² (3 mm × 4.9 mm)
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to 125°C
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C4B
  • Functional safety-capable
    • Documentation available to aid functional safety system design
  • Customer-specific configuration control can be supported along with major-change approval
  • Specified break-before-make switching
  • Low ON-state resistance (15 Ω)
  • Control inputs are 5-V tolerant
  • Low charge injection
  • Excellent ON-resistance matching
  • Low total harmonic distortion
  • 1.8-V to 5.5-V single-supply operation
  • Qualified for automotive applications
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 1: –40°C to 125°C
    • Device HBM ESD classification level H2
    • Device CDM ESD classification level C4B
  • Functional safety-capable
    • Documentation available to aid functional safety system design
  • Customer-specific configuration control can be supported along with major-change approval
  • Specified break-before-make switching
  • Low ON-state resistance (15 Ω)
  • Control inputs are 5-V tolerant
  • Low charge injection
  • Excellent ON-resistance matching
  • Low total harmonic distortion
  • 1.8-V to 5.5-V single-supply operation

The TS5A23157-Q1 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.

The TS5A23157-Q1 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.

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Technical documentation

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Top documentation Type Title Format options Date
* Data sheet TS5A23157-Q1 Dual 15-Ω SPDT Analog Switch datasheet (Rev. B) PDF | HTML Jun 17, 2021
Product overview How to Support Two Controllers on the I2C Bus, Avoid Bus Contention, and Prevent Controller Failures PDF | HTML Nov 27, 2024
Application note Selecting the Correct Texas Instruments Signal Switch (Rev. E) PDF | HTML Jun 2, 2022
Application note Multiplexers and Signal Switches Glossary (Rev. B) PDF | HTML Dec 1, 2021
Functional safety information TS5A23157-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA PDF | HTML Mar 29, 2021
More literature Automotive Logic Devices Brochure Aug 27, 2014

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

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Simulation model

TS5A23157 IBIS Model

SCEM497.ZIP (92 KB) - IBIS model
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VSSOP (DGS) 10 Ultra Librarian

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