Automotive 5-V, 2:1 (SPDT), 2-channel analog switch

Automotive 5-V, 2:1 (SPDT), 2-channel analog switch



Product details


Configuration 2:1 SPDT Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 15 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 220 Operating temperature range (C) -40 to 105, -40 to 125 Features Break-before-make, Supports I2C signals Input/output continuous current (Max) (mA) 50 Rating Automotive CON (Typ) (pF) 17.5 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches & muxes

Package | Pins | Size

VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Analog switches & muxes


  • Qualified for Automotive Applications
  • AEC-Q100 Qualified With the Following Results:
    • Device Temperature Grade 1: –40°C to 125°C
    • Device HBM ESD Classification Level H2
    • Device CDM ESD Classification Level C4B
  • Customer-Specific Configuration Control Can Be Supported Along
    With Major-Change Approval
  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (15 Ω)
  • Control Inputs Are 5-V Tolerant
  • Low Charge Injection
  • Excellent ON-Resistance Matching
  • Low Total Harmonic Distortion
  • 1.8-V to 5.5-V Single-Supply Operation
    • Sample-and-Hold Circuits
    • Battery-Powered Equipment
    • Audio and Video Signal Routing
    • Communication Circuits

open-in-new Find other Analog switches & muxes


The TS5A23157 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.

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Technical documentation

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Type Title Date
* Data sheet TS5A23157-Q1 Dual 15-Ohm SPDT Analog Switch datasheet (Rev. A) Feb. 27, 2013
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Functional safety information TS5A23157-Q1 Functional Safety, FIT Rate, Failure Mode Distribution and Pin FMA Mar. 29, 2021
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
More literature Automotive Logic Devices Brochure Aug. 27, 2014
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel

Design tools & simulation

SCEM497.ZIP (92 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
VSSOP (DGS) 10 View options

Ordering & quality

Information included:
  • RoHS
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

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