Automotive 5-V, 2:1 (SPDT), 2-channel analog switch
Product details
Parameters
Package | Pins | Size
Features
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C
- Device HBM ESD Classification Level H2
- Device CDM ESD Classification Level C4B
- Customer-Specific Configuration Control Can Be Supported Along
With Major-Change Approval - Specified Break-Before-Make Switching
- Low ON-State Resistance (15 Ω)
- Control Inputs Are 5-V Tolerant
- Low Charge Injection
- Excellent ON-Resistance Matching
- Low Total Harmonic Distortion
- 1.8-V to 5.5-V Single-Supply Operation
- APPLICATIONS
- Sample-and-Hold Circuits
- Battery-Powered Equipment
- Audio and Video Signal Routing
- Communication Circuits
Description
The TS5A23157 is a dual, single-pole, double-throw (SPDT) analog switch designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals. The device can transmit signals up to 5.5 V (peak) in either direction.
For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI Web site at www.ti.com.
Technical documentation
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TS5A23157-Q1 Dual 15-Ohm SPDT Analog Switch datasheet (Rev. A) | Feb. 27, 2013 |
| Application note | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application note | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
| More literature | Automotive Logic Devices Brochure | Aug. 27, 2014 | |
| Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
| Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
Design tools & simulation
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| VSSOP (DGS) | 10 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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