TS5A23160

ACTIVE

0.9-Ω on-state resistance, 5-V, 2:1 (SPDT), 2-channel analog switch

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 2 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 0.5 ON-state leakage current (Max) (µA) 0.15 Bandwidth (MHz) 100 Operating temperature range (C) -40 to 85 Features Powered-off protection, Break-before-make, Supports I2C signals Input/output continuous current (Max) (mA) 200 Rating Catalog CON (Typ) (pF) 55 Supply current (Typ) (uA) 0.001 open-in-new Find other Analog switches & muxes

Package | Pins | Size

VSSOP (DGS) 10 9 mm² 3 x 3 open-in-new Find other Analog switches & muxes

Features

  • Specified Make-Before-Break Switching
  • Low ON-State Resistance (1 )
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • APPLICATIONS
    • Cell Phones
    • PDAs
    • Portable Instrumentation
    • Audio and Video Signal Routing
    • Low-Voltage Data Acquisition Systems
    • Communication Circuits
    • Modems
    • Hard Drives
    • Computer Peripherals
    • Wireless Terminals and Peripherals

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Description

The TS5A23160 is a dual single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and an excellent channel-to-channel ON-state resistance matching. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

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Technical documentation

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Type Title Date
* Data sheet TS5A23160 datasheet (Rev. A) Feb. 14, 2006
Application note Multiplexers and Signal Switches Glossary (Rev. A) Jun. 09, 2021
Application note Eliminate Power Sequencing with Powered-off Protection Signal Switches (Rev. C) Jan. 06, 2021
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

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Hardware development

INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
VSSOP (DGS) 10 View options

Ordering & quality

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