5-V, 2:1 (SPDT), 1-channel general-purpose analog switch (6-pin SOT-23, SC70, DSBGA packages)
Product details
Parameters
Package | Pins | Size
Features
- Low ON-State Resistance (10 Ω)
- Control Inputs Are 5-V Tolerant
- Low Charge Injection
- Excellent ON-State Resistance Matching
- Low Total Harmonic Distortion (THD)
- 1.65-V to 5.5-V Single-Supply Operation
- Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II - ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model
(A114-B, Class II) - 1000-V Charged-Device Model (C101)
- 2000-V Human-Body Model
Description
The TS5A3157 device is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction.
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Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | TS5A3157 10-Ω SPDT Analog Switch datasheet (Rev. B) | May 15, 2015 |
| Application notes | High-Efficiency Charging for TWS Using a 2-Pin Interface Application Report | Jun. 18, 2020 | |
| Application notes | Selecting the Right Texas Instruments Signal Switch (Rev. B) | Apr. 02, 2020 | |
| Application notes | Multiplexers and Signal Switches Glossary | Mar. 06, 2020 | |
| Technical articles | Roll with the design punches and overcome power-sequencing challenges | Jul. 29, 2019 | |
| Application notes | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
| Application notes | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
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Description
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The (...)
Features
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
LEADLESS-ADAPTER1
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages. The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's surface mount packages
- Allows suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 16 most popular leadless packages with a single panel
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| DSBGA (YZP) | 6 | View options |
| SC70 (DCK) | 6 | View options |
| SOT-23 (DBV) | 6 | View options |
Ordering & quality
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Support & training
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