TS5A3157

ACTIVE

5-V, 2:1 (SPDT), 1-channel general-purpose analog switch (6-pin SOT-23, SC70, DSBGA packages)

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Product details

Parameters

Configuration 2:1 SPDT Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 5.5 ON-state leakage current (Max) (µA) 0.2 Bandwidth (MHz) 300 Operating temperature range (C) -40 to 85 Features Break-before-make Input/output continuous current (Max) (mA) 50 Rating Catalog CON (Typ) (pF) 17.5 Supply current (Typ) (uA) 2.5 open-in-new Find other Analog switches & muxes

Package | Pins | Size

DSBGA (YZP) 6 2 mm² .928 x 1.428 SOT-23 (DBV) 6 5 mm² 2.9 x 1.6 SOT-SC70 (DCK) 6 4 mm² 2 x 2.1 open-in-new Find other Analog switches & muxes

Features

  • Low ON-State Resistance (10 Ω)
  • Control Inputs Are 5-V Tolerant
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch-Up Performance Exceeds 100 mA Per
    JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
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Description

The TS5A3157 device is a single-pole double-throw (SPDT) analog switch that is designed to operate from 1.65 V to 5.5 V. This device can handle both digital and analog signals, and signals up to V+ can be transmitted in either direction.

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功能相同,但与相比较的设备引脚不同或参数不等效:
TS5A12301E ACTIVE 0.75-Ω on-state resistance, 5-V, 2:1 (SPDT), 1-channel analog switch with 1.8-V input logic Upgraded 1.8-V logic support

Technical documentation

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Type Title Date
* Datasheet TS5A3157 10-Ω SPDT Analog Switch datasheet (Rev. B) May 15, 2015
Application note High-Efficiency Charging for TWS Using a 2-Pin Interface Application Report Jun. 18, 2020
Application note Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application note Multiplexers and Signal Switches Glossary Mar. 06, 2020
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARD Download
document-generic User guide
10
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTER Download
document-generic User guide
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 6 View options
SC70 (DCK) 6 View options
SOT-23 (DBV) 6 View options

Ordering & quality

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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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