For additional terms or required resources, click any title below to view the detail page where available.
EVALUATION BOARD Download 10
INTERFACE ADAPTER Download 10
Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.
- Simplifies prototyping of SMT IC’s
- Supports 6 common package types
- Low Cost
SIMULATION MODEL Download
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
SCDM160A.ZIP (48 KB) - PSpice Model SIMULATION MODEL Download
SCDM161A.TSC (1780 KB) - TINA-TI Reference Design SIMULATION MODEL Download
SCDM162A.ZIP (5 KB) - TINA-TI Spice Model REFERENCE DESIGNS Download
Ultrasonic Flow Transmitter Reference Design
TIDA-01486 — This reference design features an ultrasonic flow transmitter that is able to measure water flow in the large pipes used in the process industry. The reference design can drive four different Piezo transducers with up to 2 MHz ±12-V pulses and amplify the ultrasonic signal received from these (...)