TS5A3357-Q1

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Automotive 5-V, 3:1, 1-channel analog multiplexer

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Product details

Parameters

Configuration 3:1 Number of channels (#) 1 Power supply voltage - single (V) 1.8, 2.5, 3.3, 5 Ron (Typ) (Ohms) 5 ON-state leakage current (Max) (µA) 1 Bandwidth (MHz) 334 Operating temperature range (C) -40 to 125 Features Break-before-make Input/output continuous current (Max) (mA) 100 Rating Automotive CON (Typ) (pF) 17 Supply current (Typ) (uA) 0.001 open-in-new Find other Analog switches & muxes

Package | Pins | Size

VSSOP (DCU) 8 6 mm² 2 x 3.1 open-in-new Find other Analog switches & muxes

Features

  • Qualified for Automotive Applications
  • Specified Break-Before-Make Switching
  • Low ON-State Resistance
  • High Bandwidth
  • Control Inputs Are 5.5-V Tolerant
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 1.65-V to 5.5-V Single-Supply Operation
  • Latch Up Exceeds 100 mA per JESD78B, Class I

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Description

The TS5A3357 is a high-performance, single-pole triple throw (SP3T) analog switch that is designed to operate from 1.65 V to 5.5 V. The device offers a low ON-state resistance and low input/output capacitance and, thus, causes a very low signal distortion. The break-before-make feature allows transferring of a signal from one port to another, with a minimal signal distortion. This device also offers a low charge injection which makes this device suitable for high-performance audio and data acquisition systems.

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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet Single 5-Ohm SP3T Analog Switch 5-V/3-V 3:1 Multiplexer/Demultiplexer datasheet Sep. 30, 2009
Application notes Selecting the Right Texas Instruments Signal Switch (Rev. B) Apr. 02, 2020
Application notes TS5A3357-Q1 Functional Safety, FIT Rate, and Failure Mode Distribution Mar. 24, 2020
Application notes Multiplexers and Signal Switches Glossary Mar. 06, 2020
Technical articles Roll with the design punches and overcome power-sequencing challenges Jul. 29, 2019
More literature Automotive Logic Devices Brochure Aug. 27, 2014
Application notes Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application notes Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
Description

Speed up your op amp prototyping and testing with the DIP-Adapter-EVM, which provides a fast, easy and inexpensive way to interface with small, surface-mount ICs. You can connect any supported op amp using the included Samtec terminal strips or wire them directly to existing circuits.

The (...)

Features
  • Simplifies prototyping of SMT IC’s
  • Supports 6 common package types
  • Low Cost
INTERFACE ADAPTERS Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
VSSOP (DCU) 8 View options

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