0.75-Ω, 5-V, 2:1 (SPDT), 1-channel analog switch with input logic translation


Product details


Configuration 2:1 SPDT Number of channels (#) 1 Ron (Typ) (Ohms) 0.5 ON-state leakage current (Max) (µA) 0.2 Bandwidth (MHz) 43 Operating temperature range (C) -40 to 85 Features Break-before-make, 1.8-V compatible control inputs Input/output continuous current (Max) (mA) 450 Rating Catalog CON (Typ) (pF) 133 Supply current (Typ) (uA) 0.01 open-in-new Find other Analog switches/muxes

Package | Pins | Size

DSBGA (YZP) 8 3 mm² .928 x 1.928 open-in-new Find other Analog switches/muxes


  • Specified Break-Before-Make Switching
  • Low ON-State Resistance (0.75 Max)
  • Control Inputs Referenced to VIO
  • Low Charge Injection
  • Excellent ON-State Resistance Matching
  • Low Total Harmonic Distortion (THD)
  • 2.25-V to 5.5-V Power Supply (V+)
  • 1.65-V to 1.95-V Logic Supply (VIO)
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 4000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
    • 400-V Machine Model (A115-A)
  • COM Port to GND
    • 8000-V Human-Body Model
      (A114-B, Class II)
    • ±15-kV Contact Discharge (IEC 61000-4-2)
    • Cell Phones
    • PDAs
    • Portable Instrumentation

open-in-new Find other Analog switches/muxes


The TS5A6542 is a single-pole double-throw (SPDT) analog switch that is designed to operate from 2.25 V to 5.5 V. The device offers a low ON-state resistance with an excellent channel-to-channel ON-state resistance matching, and the break-before-make feature to prevent signal distorion during the transferring of a signal from one path to another. The device has excellent total harmonic distortion (THD) performance and consumes very low power. These features make this device suitable for portable audio applications.

The TS5A6542 has a separate logic supply pin (VIO) that is characterized to operate from 1.65 V to 1.95 V. VIO powers the control circuitry, which allows the TS5A6542 to be controlled by 1.8-V signals.

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Technical documentation

Design & development

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Hardware development

document-generic User guide
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SCEJ226.ZIP (90 KB) - HSpice Model
SCEM514.ZIP (67 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
DSBGA (YZP) 8 View options

Ordering & quality

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