5-V, 2:1 (SPDT), 4-channel LAN switch
Product details
Parameters
We are not able to display this information. Please refer to the product data sheet.Package | Pins | Size
Features
- Wide Bandwidth (BW = 300 MHz Min)
- Low Differential Crosstalk (XTALK = –60 dB Typ)
- Low Power Consumption (ICC = 3 µA Max)
- Bidirectional Data Flow, With Near-Zero Propagation Delay
- Low ON-State Resistance (ron = 3
Typ)
- VCC Operating Range From 6 V to 6.5 V
- Ioff Supports Partial-Power-Down Mode Operation
- Data and Control Inputs Provide Undershoot Clamp Diode
- Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
- ESD Performance Tested Per JESD 22
- 2000-V Human-Body Model (A114-B, Class II)
- 1000-V Charged-Device Model (C101)
- Suitable for Both 10 Base-T/100 Base-T Signaling
Description
The TI TS5L100 LAN switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (E)\ input. When E\ is low, the switch is enabled and the I port is connected to the Y port. When E\ is high, the switch is disabled and the high-impedance state exists between the I and Y ports. The select (S) input controls the data path of the multiplexer/demultiplexer.
This device can be used to replace mechanical relays in LAN applications. This device has low ron, wide bandwidth, and low differential crosstalk, making it suitable for 10 Base-T, 100 Base-T, and various other LAN applications.
This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, E\ should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
Technical documentation
Type | Title | Date | |
---|---|---|---|
* | Datasheet | TS5L100 datasheet (Rev. A) | May 12, 2004 |
Application note | Preventing Excess Power Consumption on Analog Switches | Jul. 03, 2008 | |
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | Jul. 08, 2004 | |
More literature | TS5L100 and TS3L100 Application Clip | May 25, 2004 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages. The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.
Features
- Quick testing of TI's leaded surface mount packages
- Allows leaded suface mount packages to be plugged into 100mil spaced bread board
- Supports TI's 8 most popular leaded packages with a single panel
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
SOIC (D) | 16 | View options |
SSOP (DBQ) | 16 | View options |
TSSOP (PW) | 20 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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