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TS5V330

ACTIVE

5-V, 2:1 (SPDT), 4-channel video switch

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Data sheet

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TS5V330C ACTIVE 5-V, 2:1 (SPDT), 4-channel video switch with improved ESD protection Upgraded powered-off protection and undershoot protection support

TS5V330

ACTIVE
Data sheet Order now

Product details

Protocols Composite, RGB Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 300 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 4 Ron (typ) (mΩ) 3000 Input/ouput voltage (min) (V) 0 Input/ouput voltage (max) (V) 5.5 Supply current (typ) (µA) 3 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -63 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 4 CON (typ) (pF) 14 Off isolation (typ) (dB) -60 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.006 Ron (max) (mΩ) 10000 Turnoff time (disable) (max) (ns) 6 Turnon time (enable) (max) (ns) 6 VIH (min) (V) 2 VIL (max) (V) 0.8
Protocols Composite, RGB Configuration 2:1 SPDT Number of channels 4 Bandwidth (MHz) 300 Supply voltage (max) (V) 5.5 Supply voltage (min) (V) 4 Ron (typ) (mΩ) 3000 Input/ouput voltage (min) (V) 0 Input/ouput voltage (max) (V) 5.5 Supply current (typ) (µA) 3 Operating temperature range (°C) -40 to 85 Crosstalk (dB) -63 ESD CDM (kV) 1 Input/output continuous current (max) (mA) 128 COFF (typ) (pF) 4 CON (typ) (pF) 14 Off isolation (typ) (dB) -60 OFF-state leakage current (max) (µA) 1 Propagation delay time (µs) 0.006 Ron (max) (mΩ) 10000 Turnoff time (disable) (max) (ns) 6 Turnon time (enable) (max) (ns) 6 VIH (min) (V) 2 VIL (max) (V) 0.8
SOIC (D) 16 59.4 mm² 9.9 x 6 SSOP (DBQ) 16 29.4 mm² 4.9 x 6 TSSOP (PW) 16 32 mm² 5 x 6.4 VQFN (RGY) 16 14 mm² 4 x 3.5
  • Low Differential Gain and Phase
    (DG = 0.64%, DP = 0.1 Degrees Typ)
  • Wide Bandwidth (BW = 300 MHz Min)
  • Low Crosstalk (XTALK = –63 dB Typ)
  • Low Power Consumption
    (ICC = 3 µA Max)
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite-Video Switching
  • Low Differential Gain and Phase
    (DG = 0.64%, DP = 0.1 Degrees Typ)
  • Wide Bandwidth (BW = 300 MHz Min)
  • Low Crosstalk (XTALK = –63 dB Typ)
  • Low Power Consumption
    (ICC = 3 µA Max)
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite-Video Switching

The TS5V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

The TS5V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
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Technical documentation

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Type Title Date
* Data sheet TS5V330 datasheet (Rev. D) 18 Jun 2009
More literature Preventing Excess Power Consumption on Analog Switches 03 Jul 2008
More literature Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 08 Jul 2004
More literature TS5V330 Application Clip 11 May 2004

Design & development

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Interface adapter

LEADED-ADAPTER1 — Surface mount to DIP header adapter for quick testing of TI's 5, 8, 10, 16 & 24-pin leaded packages

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

User guide: PDF
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Interface adapter

LEADLESS-ADAPTER1 — Surface mount to DIP header adapter for testing of TI's 6,8,10,12,14,16, & 20-pin leadless packages

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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Simulation model

HSPICE Model for TS5V330

SCDJ031.ZIP (157 KB) - HSpice Model
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Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
VQFN (RGY) 16 View options

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