TS5V330

ACTIVE

5-V, 2:1 (SPDT), 4-channel video switch

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Same functionality and pinout but is not an equivalent to the compared device:
TS5V330C ACTIVE 5-V, 2:1 (SPDT), 4-channel video switch with improved ESD protection Upgraded powered-off protection and undershoot protection support
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Product details

Parameters

Protocols RGB, Composite Configuration 2:1 SPDT Number of channels (#) 4 Bandwidth (MHz) 300 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 4 Ron (Typ) (Ohms) 3 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 5.5 Supply current (Typ) (uA) 3 Operating temperature range (C) -40 to 85 Crosstalk (dB) -63 ESD CDM (kV) 1 ICC (Typ) (uA) 3 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 4 CON (Typ) (pF) 14 Off isolation (Typ) (dB) -60 OFF-state leakage current (Max) (µA) 1 Propagation delay (ns) 6 Ron (Max) (Ohms) 10 Turn off time (disable) (Max) (ns) 6 Turn on time (enable) (Max) (ns) 6 VIH (Min) (V) 2 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 4.4 x 5 VQFN (RGY) 16 14 mm² 4 x 3.5 open-in-new Find other Protocol-specific switches & muxes

Features

  • Low Differential Gain and Phase
    (DG = 0.64%, DP = 0.1 Degrees Typ)
  • Wide Bandwidth (BW = 300 MHz Min)
  • Low Crosstalk (XTALK = –63 dB Typ)
  • Low Power Consumption
    (ICC = 3 µA Max)
  • Bidirectional Data Flow With Near-Zero Propagation Delay
  • Low ON-State Resistance (ron = 3 Typ)
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite-Video Switching

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Description

The TS5V330 video switch is a 4-bit 1-of-2 multiplexer/demultiplexer with a single switch-enable (EN) input. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and the high-impedance state exists between the D and S ports. The select (IN) input controls the data path of the multiplexer/demultiplexer.

Low differential gain and phase make this switch ideal for composite and RGB video applications. This device has wide bandwidth and low crosstalk, making it suitable for high-frequency applications as well.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. This switch maintains isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 4
Type Title Date
* Datasheet TS5V330 datasheet (Rev. D) Jun. 18, 2009
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004
More literature TS5V330 Application Clip May 11, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


INTERFACE ADAPTER Download
10
Description
The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
Features
  • Quick testing of TI's surface mount packages 
  • Allows suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 16 most popular leadless packages with a single panel

Design tools & simulation

SIMULATION MODEL Download
SCDJ031.ZIP (157 KB) - HSpice Model

CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options
VQFN (RGY) 16 View options

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Qualification summary
  • Ongoing reliability monitoring

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