TS5V330C

ACTIVE

5-V, 2:1 (SPDT), 4-channel video switch with improved ESD protection

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Product details

Parameters

Protocols RGB, Composite Configuration 1:2 SPDT Number of channels (#) 4 Bandwidth (MHz) 250 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 4 Ron (Typ) (Ohms) 3 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 5.5 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 Crosstalk (dB) -87 ESD CDM (kV) 1 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 5.5 CON (Typ) (pF) 16.5 Off isolation (Typ) (dB) -54 OFF-state leakage current (Max) (µA) 10 Propagation delay (ns) 6 Ron (Max) (Ohms) 10 Turn off time (disable) (Max) (ns) 5.9 Turn on time (enable) (Max) (ns) 6 VIH (Min) (V) 2 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

SOIC (D) 16 59 mm² 9.9 x 6 SSOP (DBQ) 16 29 mm² 4.9 x 6 TSSOP (PW) 16 22 mm² 5 x 4.4 open-in-new Find other Protocol-specific switches & muxes

Features

  • Low Differential Gain and Phase
    (Typical DG = 0.24%, Typical DP = 0.039°)
  • Wide Bandwidth (Typical BW > 288 MHz)
  • Low Cross-Talk (Typical XTALK = –87 dB)
  • Low Power Consumption
    (Maximum ICC = 3 µA)
  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • Low ON-State Resistance (Typical rON = 3 )
  • VCC Operating Range From 4.5 V to 5.5 V
  • Ioff Supports Partial-Power-Down Mode Operation
  • Data and Control Inputs Provide Undershoot Clamp Diode
  • Control Inputs Can be Driven by TTL or 5-V/3.3-V CMOS Outputs
  • Latch-Up Performance Exceeds 100 mA Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Suitable for Both RGB and Composite Video Switching

open-in-new Find other Protocol-specific switches & muxes

Description

The TS5V330C is a 4-bit 1-of-2 multiplexer/demultiplexer video switch with a single switch-enable (EN) input. The select (IN) input controls the data path of the multiplexer/demultiplexer. When EN is low, the switch is enabled and the D port is connected to the S port. When EN is high, the switch is disabled and a high impedance state exists between the D and S ports.

Low differential gain and phase makes this switch ideal for video applications. The device has a wide bandwidth and low cross talk which makes it suitable for high frequency video applications. The device can be used for RGB and composite video switching applications.

This device is fully specified for partial-power-down applications using Ioff. The Ioff feature ensures that damaging current will not backflow through the device when it is powered down. The device has isolation during power off.

To ensure the high-impedance state during power up or power down, EN should be tied to VCC through a pullup resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

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Type Title Date
* Data sheet 4 Bit 1-of-2 FET Multiplexer/Demultiplexer datasheet (Rev. B) Dec. 03, 2009
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
document-generic User guide
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
SOIC (D) 16 View options
SSOP (DBQ) 16 View options
TSSOP (PW) 16 View options

Ordering & quality

Information included:
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  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

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