TS5V522C

ACTIVE

5-V, 5-channel video exchange switch for dual VGA source to sink with –2-V undershoot protection

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Product details

Parameters

Protocols VGA Configuration Crosspoint/exchange Number of channels (#) 5 Bandwidth (MHz) 380 Supply voltage (Max) (V) 5.5 Supply voltage (Min) (V) 4 Ron (Typ) (Ohms) 3 Input/ouput voltage (Min) (V) 0 Input/ouput voltage (Max) (V) 5.5 ESD HBM (Typ) (kV) 2 Operating temperature range (C) -40 to 85 Crosstalk (dB) Yes ESD CDM (kV) 1 Input/output continuous current (Max) (mA) 128 COFF (Typ) (pF) 8.5 CON (Typ) (pF) 16.5 Off isolation (Typ) (dB) -44 OFF-state leakage current (Max) (µA) 10 Propagation delay (ns) 6.6 Ron (Max) (Ohms) 7 Turn off time (disable) (Max) (ns) 6 Turn on time (enable) (Max) (ns) 6.6 VIH (Min) (V) 2 VIL (Max) (V) 0.8 open-in-new Find other Protocol-specific switches & muxes

Package | Pins | Size

SSOP (DBQ) 24 52 mm² 8.65 x 6 TSSOP (PW) 24 34 mm² 7.7 x 4.4 open-in-new Find other Protocol-specific switches & muxes

Features

  • Bidirectional Data Flow, With Near-Zero Propagation Delay
  • High Bandwidth, 380MHZ (typ) RGB Switching
  • Low ON-State Resistance (ron) Characteristics (ron =3 Ω Typical)
  • Low Input/Output Capacitance Minimizes Loading and Signal Distortion
    (CIO(OFF) = 8pF Typical)
  • Undershoot Clamp Diodes on Data and Control Inputs.
  • Low Power Consumption (Icc = 3µA Max.)
  • Vcc Operation Range from 4V to 5.5V
  • Data I/Os Support 0 to 5-V Signaling Levels
    (0.8V, 1.2V, 1.5V, 1.8V, 2.5V, 3.3V, 4V)
  • Allow to pull up resistor up to 5V on the I/O
  • Ioff Supports Live Insertion, Partial Power Down Mode,
    and Back Drive Protection
  • Latch-Up Performance Exceeds 100Ma Per JESD 78, Class II.
  • ESD Performance Tested Per JESD 22
    • 2000-V Human-Body Model
      (A114-B, Class II)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • APPLICATIONS
    • Digital and Analog Signal Interface
    • Audio and Video Signal Interface
    • High Speed Signal Bus Exchange
    • Bus Isolation, Interleaving
    • Notebook Computer Graphics Control

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Description

The TS5V522C is high bandwidth analog switches offering a 2:2 dual-graphics crossover solution for VGA signal switching. The device is designed for switching between 2 VGA sources to either of the two destinations within a laptop computer. The TS5V522C integrates 5 very high-frequency 380Mhz (typ) SPDT switches for RGB signals, 2 pairs of level-translating buffer for the HSYNC and VSYNC lines, and integrated ESD protection. The 5 crossover switches can be controlled by either 5V or 3.3V TTL control signals.

The TS5V522C would bypass the VGA analog signal to destination with less distortions. DDC Channel (SCA, SCL) may require to +5Vopen drain level at the VGA connector and it may require a pull up resistor on the destination side. Active undershoot-protection circuitry on the data ports of the TS5V522C provide protection for undershoots up to -2V by sensing an undershoot event and ensuring that the switch remains in the proper off state.

To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pull up resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 3
Type Title Date
* Datasheet 5V, 5-BITS VIDEO EXCHANGE SWITCH FOR DUAL VGA SOURCE TO SINK, TS5V522C datasheet Mar. 29, 2011
Application note Preventing Excess Power Consumption on Analog Switches Jul. 03, 2008
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection Jul. 08, 2004

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

INTERFACE ADAPTER Download
10
Description

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

Features
  • Quick testing of TI's leaded surface mount packages 
  • Allows leaded suface mount packages to be plugged into 100mil spaced bread board 
  • Supports TI's 8 most popular leaded packages with a single panel


CAD/CAE symbols

Package Pins Download
SSOP (DBQ) 24 View options
TSSOP (PW) 24 View options

Ordering & quality

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  • MSL rating/Peak reflow
  • MTBF/FIT estimates
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  • Qualification summary
  • Ongoing reliability monitoring

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