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Product details

Parameters

Number of input channels 32 Interface Serial Active supply current (Typ) (mA) 10 Supply voltage (Max) (V) 5.5 Operating temperature range (C) 0 to 70 Approx. price (US$) 70.40 | 1ku open-in-new Find other Ultrasound AFEs

Package | Pins | Size

NFBGA (ZBX) 260 187 mm² 17 x 11 open-in-new Find other Ultrasound AFEs

Features

  • TX7332 supports:
    • 32-channel three-level pulser and active transmit/receive (T/R) switch
    • Very low power on-chip beamforming mode:
      • In receive-only mode: 0.45 mW/ch
      • In transmit-receive mode: 16.4 mW/ch
      • In CW mode: 160 mW/ch
      • In global power-down mode: 0.1 mW/ch
  • Three-level pulser:
    • Maximum output voltage: ±100 V
    • Minimum output voltage: ±1 V
    • Maximum output current: 1.2 A to 0.3 A
    • Maximum clamp current: 0.5 A to 0.12 A
    • Second harmonic : –45 dBc at 5 MHz
    • CW mode jitter: 100 fs measured from 100 Hz to 20 kHz
    • CW mode close-in phase noise: -154 dBc/Hz at 1 kHz offset for 5-MHz signal
    • –3-dB bandwidth with 2-kΩ || 120-pF load
      • 20 MHz (for ±100-V supply)
      • 25 MHz (for ±70-V supply)
  • Active T/R switch with:
    • ON, OFF control signals
    • Bandwidth: 50 MHz
    • HD2: –50 dBc
    • Turnon resistance: 24 Ω
    • Turnon time: 0.5 µs
    • Turnoff time: 1.75 µs
    • Transient glitch: 50 mVPP
  • Off-chip beamformer with:
    • Jitter cleaning using synchronization feature
    • Maximum synchronization clock frequency: 200 MHz
  • On-chip beamformer with:
    • Delay resolution: one beamformer clock period
    • Maximum delay: 213 beamformer clock period
    • Maximum beamformer clock speed: 200 MHz
    • On-chip RAM to store
      • 16 delay profiles
      • 32 pattern profiles
  • High-speed (100 MHz maximum) 1.8-V and 2.5-V CMOS serial programming interface
  • Automatic thermal shutdown
  • No specific power sequencing requirement
  • Small package: 260-pin NFBGA (17 mm × 11 mm) with 0.8-mm pitch

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Description

The TX7332 is a highly integrated, high-performance transmitter solution for ultrasound imaging system. The device has total 32 pulser circuits (PULS), 32 transmit/receive (T/R) switches, and supports both on-chip and off-chip beamformer (TxBF). The device also integrates on-chip floating power supplies that reduce the number of required high voltage power supplies.

The TX7332 has a pulser circuit that generates three-level high voltage pulses (up to ±100 V) that can be used to excite multiple channels of an ultrasound transducer. The device supports total 32 outputs. The maximum output current is configurable from 1.2 A to 0.3 A.

A T/R switch under OFF state protects the receiver circuit by providing high isolation between the high-voltage transmitter and the low-voltage receiver when the pulser is generating high-voltage pulses. When the transducer is receiving echo signals, the T/R switch turns ON and connects the transducer to the receiver. The ON/OFF operation of the T/R switch is either controlled by an external pin or controlled by on-chip beamforming engine in the device. The T/R switch offers 24-Ω impedance in the ON state.

Ultrasound transmission relies on the excitation of multiple transducer elements with the delay profile of the excitation across the different elements defining the direction of the transmission. Such an operation is referred to as transmit beamforming. The TX7332 supports staggered pulsing of the different channels, allowing for transmit beamforming. The device supports both off-chip and on-chip beamforming operation.

In the off-chip beamformer mode, the output transition of each pulser and TR switch ON/OFF operation is controlled by external control pins. To eliminate the effect of jitter from the external control signals, the device supports a synchronization feature. When the synchronization feature is enabled, the external control signals are latched using a low-jitter beamformer clock signal.

In the on-chip beamformer mode, the delay profile for the pulsing of the different channels is stored within the device. The device supports a transmit beamformer delay resolution of one beamformer clock period and a maximum delay of 213 beamformer clock periods. An internal pattern generator generates the output pulse patterns based on pattern profiles stored in a profile RAM. Up to 16 beamforming profiles and 32 pattern profiles can be stored in the profile RAM. On-chip beamforming mode reduces the number of control signals that must be routed from the FPGA to the device..

The TX7332 is available in a 17-mm × 11-mm 260-pin NFBGA package and is specified for operation from 0°C to 70°C.

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More Information

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Technical documentation

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Type Title Date
* Datasheet TX7332 Three-Level, 32-Channel Transmitter With 1.2-A Pulser, T/R Switch, and Integrated Transmit Beamformer datasheet Mar. 19, 2019
Application notes Designing High Voltage Power Supply for Ultrasound Smart Probes Oct. 22, 2019
Application notes Smart Ultrasound Probes Solution Jul. 19, 2019
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Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
$199.00
Description

The TX7332 evaluation module (EVM) evaluates the TX7332 device and its features.

Features
  • 32-channel 3-level pulser with output voltage support of ±2.5 V to ±100 V and current drive of 0.3 A to 1.2 A
  • Active transmit/receive (T/R) switch
  • Both off-chip and on-chip beamforming
  • Integrated floating power supply
  • Automatic thermal shutdown

Design tools & simulation

SIMULATION MODELS Download
SBOMAX8.ZIP (86 KB) - IBIS Model

CAD/CAE symbols

Package Pins Download
NFBGA (ZBX) 260 View options

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