SMOMAPL138B-HIREL

ACTIVO

Producto de alta confiabilidad, DSP de punto flotante C674x de baja potencia + procesador Arm9 - 375

Detalles del producto

Arm CPU 1 Arm9 Arm (max) (MHz) 456 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection Rating Military Operating temperature range (°C) -40 to 105
Arm CPU 1 Arm9 Arm (max) (MHz) 456 Coprocessors C674x DSP CPU 32-bit Display type 1 LCD Protocols Ethernet Ethernet MAC 1-Port 10/100 Hardware accelerators PRUSS Operating system Linux, RTOS Security Device identity, Memory protection Rating Military Operating temperature range (°C) -40 to 105
NFBGA (GWT) 361 256 mm² 16 x 16
  • Highlights
    • Dual Core SoC
      • 375-MHz ARM926EJ-S™ RISC MPU
      • 375-MHz 674x Fixed/Floating-Point VLIW DSP
    • Enhanced Direct-Memory-Access Controller (EDMA3)
    • Serial ATA (SATA) Controller
    • DDR2/Mobile DDR Memory Controller
    • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface
    • LCD Controller
    • Video Port Interface (VPIF)
    • 10/100 Mb/s Ethernet MAC (EMAC):
    • Programmable Real-Time Unit Subsystem
    • Three Configurable UART Modules
    • USB 1.1 OHCI (Host) With Integrated PHY
    • USB 2.0 OTG Port With Integrated PHY
    • One Multichannel Audio Serial Port
    • Two Multichannel Buffered Serial Ports
  • Dual Core SoC
    • 375-MHz ARM926EJ-S™ RISC MPU
    • 375-MHz C674x VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 16K-Byte Data Cache
    • 8K-Byte RAM (Vector Table)
    • 64K-Byte ROM
  • C674x Instruction Set Features
    • Superset of the C67x+™ and C64x+™ ISAs
    • Up to C674x MIPS/MFLOPS
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two Level Cache Memory Architecture
    • 32K-Byte L1P Program RAM/Cache
    • 32K-Byte L1D Data RAM/Cache
    • 256K-Byte L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct-Memory-Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Non-Aligned Support
    • 64 General-Purpose Registers (32 Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
      • Supports up to Two Floating Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP x SP -> SP Per Clock
        • 2 SP x SP -> DP Every Two Clocks
        • 2 SP x DP -> DP Every Three Clocks
        • 2 DP x DP -> DP Every Four Clocks
      • Fixed Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSP/BIOS™
    • Chip Support Library and DSP Library
  • 128K-Byte RAM Shared Memory
  • 1.8V or 3.3V LVCMOS IOs (except for USB and DDR2 interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8-/16-Bit-Wide Data)
      • NAND (8-/16-Bit-Wide Data)
      • 16-Bit SDRAM With 128 MB Address Space
    • DDR2/Mobile DDR Memory Controller
      • 16-Bit DDR2 SDRAM With 512 MB Address Space or
      • 16-Bit mDDR SDRAM With 256 MB Address Space
  • Three Configurable 16550 type UART Modules:
    • With Modem Control Signals
    • 16-byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPI) Each With Multiple Chip-Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO) Interfaces
  • Two Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus For High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Realtime Unit (PRU) Cores
      • 32-Bit Load/Store RISC architecture
      • 4K Byte instruction RAM per core
      • 512 Bytes data RAM per core
      • PRU Subsystem (PRUSS) can be disabled via software to save power
      • Register 30 of each PRU is exported from the subsystem in addition to the normal R31 output of the PRU cores.
    • Standard power management mechanism
      • Clock gating
      • Entire subsystem under a single PSC clock gating domain
    • Dedicated interrupt controller
    • Dedicated switched central resource
  • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High-/Full-Speed Client
    • USB 2.0 High-/Full-/Low-Speed Host
    • End Point 0 (Control)
    • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
  • One Multichannel Audio Serial Port:
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports:
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-channel TDM
    • FIFO buffers for Transmit and Receive
  • 10/100 Mb/s Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media Independent Interface
    • RMII Reduced Media Independent Interface
    • Management Data I/O (MDIO) Module
  • Video Port Interface (VPIF):
    • Two 8-bit SD (BT.656), Single 16-bit or Single Raw (8-/10-/12-bit) Video Capture Channels
    • Two 8-bit SD (BT.656), Single 16-bit Video Display Channels
  • Universal Parallel Port (uPP):
    • High-Speed Parallel Interface to FPGAs and Data Converters
    • Data Width on Each of Two Channels is 8- to 16-bit Inclusive
    • Single Data Rate or Dual Data Rate Transfers
    • Supports Multiple Interfaces with START, ENABLE and WAIT Controls
  • Serial ATA (SATA) Controller:
    • Supports SATA I (1.5 Gbps) and SATA II (3.0 Gbps)
    • Supports all SATA Power Management Features
    • Hardware-Assisted Native Command Queueing (NCQ) for up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock With 32 KHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each configurable as Two 32-Bit Timers)
  • One 64-bit General-Purpose/Watchdog Timer (Configurable as Two 32-bit General-Purpose Timers)
  • Two Enhanced Pulse Width Modulators (eHRPWM):
    • Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
    • 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture Modules (eCAP):
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) outputs
    • Single Shot Capture of up to Four Event Time-Stamps
  • 361-Ball Plastic Ball Grid Array (PBGA) [GWT Suffix], 0.80-mm Ball Pitch
  • Commercial, Extended or Industrial Temperature
  • Community Resources
    • TI E2E Community
    • TI Embedded Processors Wiki

TMS320C6000 is a trademark of Texas Instruments.

  • Highlights
    • Dual Core SoC
      • 375-MHz ARM926EJ-S™ RISC MPU
      • 375-MHz 674x Fixed/Floating-Point VLIW DSP
    • Enhanced Direct-Memory-Access Controller (EDMA3)
    • Serial ATA (SATA) Controller
    • DDR2/Mobile DDR Memory Controller
    • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface
    • LCD Controller
    • Video Port Interface (VPIF)
    • 10/100 Mb/s Ethernet MAC (EMAC):
    • Programmable Real-Time Unit Subsystem
    • Three Configurable UART Modules
    • USB 1.1 OHCI (Host) With Integrated PHY
    • USB 2.0 OTG Port With Integrated PHY
    • One Multichannel Audio Serial Port
    • Two Multichannel Buffered Serial Ports
  • Dual Core SoC
    • 375-MHz ARM926EJ-S™ RISC MPU
    • 375-MHz C674x VLIW DSP
  • ARM926EJ-S Core
    • 32-Bit and 16-Bit (Thumb®) Instructions
    • DSP Instruction Extensions
    • Single Cycle MAC
    • ARM® Jazelle® Technology
    • EmbeddedICE-RT™ for Real-Time Debug
  • ARM9 Memory Architecture
    • 16K-Byte Instruction Cache
    • 16K-Byte Data Cache
    • 8K-Byte RAM (Vector Table)
    • 64K-Byte ROM
  • C674x Instruction Set Features
    • Superset of the C67x+™ and C64x+™ ISAs
    • Up to C674x MIPS/MFLOPS
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • Compact 16-Bit Instructions
  • C674x Two Level Cache Memory Architecture
    • 32K-Byte L1P Program RAM/Cache
    • 32K-Byte L1D Data RAM/Cache
    • 256K-Byte L2 Unified Mapped RAM/Cache
    • Flexible RAM/Cache Partition (L1 and L2)
  • Enhanced Direct-Memory-Access Controller 3 (EDMA3):
    • 2 Channel Controllers
    • 3 Transfer Controllers
    • 64 Independent DMA Channels
    • 16 Quick DMA Channels
    • Programmable Transfer Burst Size
  • TMS320C674x Floating-Point VLIW DSP Core
    • Load-Store Architecture With Non-Aligned Support
    • 64 General-Purpose Registers (32 Bit)
    • Six ALU (32-/40-Bit) Functional Units
      • Supports 32-Bit Integer, SP (IEEE Single Precision/32-Bit) and DP (IEEE Double Precision/64-Bit) Floating Point
      • Supports up to Four SP Additions Per Clock, Four DP Additions Every 2 Clocks
      • Supports up to Two Floating Point (SP or DP) Reciprocal Approximation (RCPxP) and Square-Root Reciprocal Approximation (RSQRxP) Operations Per Cycle
    • Two Multiply Functional Units
      • Mixed-Precision IEEE Floating Point Multiply Supported up to:
        • 2 SP x SP -> SP Per Clock
        • 2 SP x SP -> DP Every Two Clocks
        • 2 SP x DP -> DP Every Three Clocks
        • 2 DP x DP -> DP Every Four Clocks
      • Fixed Point Multiply Supports Two 32 x 32-Bit Multiplies, Four 16 x 16-Bit Multiplies, or Eight 8 x 8-Bit Multiplies per Clock Cycle, and Complex Multiples
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Hardware Support for Modulo Loop Operation
    • Protected Mode Operation
    • Exceptions Support for Error Detection and Program Redirection
  • Software Support
    • TI DSP/BIOS™
    • Chip Support Library and DSP Library
  • 128K-Byte RAM Shared Memory
  • 1.8V or 3.3V LVCMOS IOs (except for USB and DDR2 interfaces)
  • Two External Memory Interfaces:
    • EMIFA
      • NOR (8-/16-Bit-Wide Data)
      • NAND (8-/16-Bit-Wide Data)
      • 16-Bit SDRAM With 128 MB Address Space
    • DDR2/Mobile DDR Memory Controller
      • 16-Bit DDR2 SDRAM With 512 MB Address Space or
      • 16-Bit mDDR SDRAM With 256 MB Address Space
  • Three Configurable 16550 type UART Modules:
    • With Modem Control Signals
    • 16-byte FIFO
    • 16x or 13x Oversampling Option
  • LCD Controller
  • Two Serial Peripheral Interfaces (SPI) Each With Multiple Chip-Selects
  • Two Multimedia Card (MMC)/Secure Digital (SD) Card Interface with Secure Data I/O (SDIO) Interfaces
  • Two Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • One Host-Port Interface (HPI) With 16-Bit-Wide Muxed Address/Data Bus For High Bandwidth
  • Programmable Real-Time Unit Subsystem (PRUSS)
    • Two Independent Programmable Realtime Unit (PRU) Cores
      • 32-Bit Load/Store RISC architecture
      • 4K Byte instruction RAM per core
      • 512 Bytes data RAM per core
      • PRU Subsystem (PRUSS) can be disabled via software to save power
      • Register 30 of each PRU is exported from the subsystem in addition to the normal R31 output of the PRU cores.
    • Standard power management mechanism
      • Clock gating
      • Entire subsystem under a single PSC clock gating domain
    • Dedicated interrupt controller
    • Dedicated switched central resource
  • USB 1.1 OHCI (Host) With Integrated PHY (USB1)
  • USB 2.0 OTG Port With Integrated PHY (USB0)
    • USB 2.0 High-/Full-Speed Client
    • USB 2.0 High-/Full-/Low-Speed Host
    • End Point 0 (Control)
    • End Points 1,2,3,4 (Control, Bulk, Interrupt or ISOC) Rx and Tx
  • One Multichannel Audio Serial Port:
    • Two Clock Zones and 16 Serial Data Pins
    • Supports TDM, I2S, and Similar Formats
    • DIT-Capable
    • FIFO buffers for Transmit and Receive
  • Two Multichannel Buffered Serial Ports:
    • Supports TDM, I2S, and Similar Formats
    • AC97 Audio Codec Interface
    • Telecom Interfaces (ST-Bus, H100)
    • 128-channel TDM
    • FIFO buffers for Transmit and Receive
  • 10/100 Mb/s Ethernet MAC (EMAC):
    • IEEE 802.3 Compliant
    • MII Media Independent Interface
    • RMII Reduced Media Independent Interface
    • Management Data I/O (MDIO) Module
  • Video Port Interface (VPIF):
    • Two 8-bit SD (BT.656), Single 16-bit or Single Raw (8-/10-/12-bit) Video Capture Channels
    • Two 8-bit SD (BT.656), Single 16-bit Video Display Channels
  • Universal Parallel Port (uPP):
    • High-Speed Parallel Interface to FPGAs and Data Converters
    • Data Width on Each of Two Channels is 8- to 16-bit Inclusive
    • Single Data Rate or Dual Data Rate Transfers
    • Supports Multiple Interfaces with START, ENABLE and WAIT Controls
  • Serial ATA (SATA) Controller:
    • Supports SATA I (1.5 Gbps) and SATA II (3.0 Gbps)
    • Supports all SATA Power Management Features
    • Hardware-Assisted Native Command Queueing (NCQ) for up to 32 Entries
    • Supports Port Multiplier and Command-Based Switching
  • Real-Time Clock With 32 KHz Oscillator and Separate Power Rail
  • Three 64-Bit General-Purpose Timers (Each configurable as Two 32-Bit Timers)
  • One 64-bit General-Purpose/Watchdog Timer (Configurable as Two 32-bit General-Purpose Timers)
  • Two Enhanced Pulse Width Modulators (eHRPWM):
    • Dedicated 16-Bit Time-Base Counter With Period And Frequency Control
    • 6 Single Edge, 6 Dual Edge Symmetric or 3 Dual Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
  • Three 32-Bit Enhanced Capture Modules (eCAP):
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator (APWM) outputs
    • Single Shot Capture of up to Four Event Time-Stamps
  • 361-Ball Plastic Ball Grid Array (PBGA) [GWT Suffix], 0.80-mm Ball Pitch
  • Commercial, Extended or Industrial Temperature
  • Community Resources
    • TI E2E Community
    • TI Embedded Processors Wiki

TMS320C6000 is a trademark of Texas Instruments.

This device is a Low-power applications processor based on an ARM926EJ-S and a C674x DSP core. It provides significantly lower power than other members of the TMS320C6000 platform of DSPs.

This device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.

The device DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit (I2C) Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSP) with FIFO buffers; two SPI interfaces with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 9 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed DDR2/Mobile DDR controller.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on each of two channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE and WAIT signals to provide control for a variety of data converters.

A Video Port Interface (VPIF) is included providing a flexible video input/output port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

This device has a complete set of development tools for the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

This device is a Low-power applications processor based on an ARM926EJ-S and a C674x DSP core. It provides significantly lower power than other members of the TMS320C6000 platform of DSPs.

This device enables OEMs and ODMs to quickly bring to market devices featuring robust operating systems support, rich user interfaces, and high processing performance life through the maximum flexibility of a fully integrated mixed processor solution.

The dual-core architecture of the device provides benefits of both DSP and Reduced Instruction Set Computer (RISC) technologies, incorporating a high-performance TMS320C674x DSP core and an ARM926EJ-S core.

The ARM926EJ-S is a 32-bit RISC processor core that performs 32-bit or 16-bit instructions and processes 32-bit, 16-bit, or 8-bit data. The core uses pipelining so that all parts of the processor and memory system can operate continuously.

The ARM core has a coprocessor 15 (CP15), protection module, and Data and program Memory Management Units (MMUs) with table look-aside buffers. It has separate 16K-byte instruction and 16K-byte data caches. Both are four-way associative with virtual index virtual tag (VIVT). The ARM core also has a 8KB RAM (Vector Table) and 64KB ROM.

The device DSP core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 32KB direct mapped cache and the Level 1 data cache (L1D) is a 32KB 2-way set-associative cache. The Level 2 program cache (L2P) consists of a 256KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two. Although the DSP L2 is accessible by ARM and other hosts in the system, an additional 128KB RAM shared memory is available for use by other hosts without affecting DSP performance.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a Management Data Input/Output (MDIO) module; one USB2.0 OTG interface; one USB1.1 OHCI interface; two inter-integrated circuit (I2C) Bus interfaces; one multichannel audio serial port (McASP) with 16 serializers and FIFO buffers; two multichannel buffered serial ports (McBSP) with FIFO buffers; two SPI interfaces with multiple chip selects; four 64-bit general-purpose timers each configurable (one configurable as watchdog); a configurable 16-bit host port interface (HPI) ; up to 9 banks of 16 pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; three UART interfaces (each with RTS and CTS); two enhanced high-resolution pulse width modulator (eHRPWM) peripherals; 3 32-bit enhanced capture (eCAP) module peripherals which can be configured as 3 capture inputs or 3 auxiliary pulse width modulator (APWM) outputs; and 2 external memory interfaces: an asynchronous and SDRAM external memory interface (EMIFA) for slower memories or peripherals, and a higher speed DDR2/Mobile DDR controller.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the device and a network. The EMAC supports both 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode. Additionally an Management Data Input/Output (MDIO) interface is available for PHY configuration. The EMAC supports both MII and RMII interfaces.

The SATA controller provides a high-speed interface to mass data storage devices. The SATA controller supports both SATA I (1.5 Gbps) and SATA II (3.0 Gbps).

The Universal Parallel Port (uPP) provides a high-speed interface to many types of data converters, FPGAs or other parallel devices. The UPP supports programmable data widths between 8- to 16-bits on each of two channels. Single-data rate and double-data rate transfers are supported as well as START, ENABLE and WAIT signals to provide control for a variety of data converters.

A Video Port Interface (VPIF) is included providing a flexible video input/output port.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

This device has a complete set of development tools for the ARM and DSP. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

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Tipo Título Fecha
* Data sheet SMOMAPL138B-HIREL Low-Power Applications Processor datasheet (Rev. B) 18 jul 2013
* Errata OMAP-L138 C6000 DSP+ARM Processor (Revs 2.3, 2.1, 2.0, 1.1, & 1.0) Errata (Rev. M) 21 mar 2014
* Radiation & reliability report SMOMAPL138BGWTA3R Reliability Report 09 abr 2012
Application note Introduction to TMS320C6000 DSP Optimization 06 oct 2011
White paper Software and Hardware Design Challenges Due to Dynamic Raw NAND Market 19 may 2011

Diseño y desarrollo

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Productos
Procesadores basados en Arm
OMAPL137-HT DSP de punto flotante C674x de alta temperatura y baja potencia + procesador Arm - hasta 456 MHz OMAPL138B-EP Producto mejorado, DSP de punto flotante C674x, de baja potencia + procesador Arm9 - 345 MHz SMOMAPL138B-HIREL Producto de alta confiabilidad, DSP de punto flotante C674x de baja potencia + procesador Arm9 - 375
Procesadores digitales de señales (DSP)
DM505 SoC para Vision Analytics, encapsulado de 15 mm SM320C6678-HIREL DSP de punto flotante y fijo C6678 de 8 núcleos de alto rendimiento y de producto de alta confiabili
Opciones de descarga
Códec de software

C66XCODECSVID C6678 Video Codecs - Software and Documentation

TI codecs are free, come with production licensing and are available for download now. All are production-tested for easy integration into video and voice applications. In many cases, the C64x+ codecs are provided and validated for C66x platforms. Datasheets and Release Notes are on the download (...)

Productos y hardware compatibles

Productos y hardware compatibles

Productos
Procesadores basados en Arm
OMAPL137-HT DSP de punto flotante C674x de alta temperatura y baja potencia + procesador Arm - hasta 456 MHz OMAPL138B-EP Producto mejorado, DSP de punto flotante C674x, de baja potencia + procesador Arm9 - 345 MHz SMOMAPL138B-HIREL Producto de alta confiabilidad, DSP de punto flotante C674x de baja potencia + procesador Arm9 - 375
Procesadores digitales de señales (DSP)
DM505 SoC para Vision Analytics, encapsulado de 15 mm SM320C6678-HIREL DSP de punto flotante y fijo C6678 de 8 núcleos de alto rendimiento y de producto de alta confiabili
Opciones de descarga
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
NFBGA (GWT) 361 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene preguntas sobre la calidad, el paquete o el pedido de productos de TI, consulte el soporte de TI. ​​​​​​​​​​​​​​

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