TPA3001D1
Amplificador de audio mono de Clase D, entrada analógica, 20 W y alimentación de 8 V a 18 V
TPA3001D1
- 20 W Into 8-
Load From 18-V Supply (10% THD+N) - Short-Circuit Protection (Short to VCC, Short to GND,
Short Between Outputs) - Third-Generation Modulation Technique:
- Replaces Large LC Filter With Small, Low-Cost Ferrite
Bead Filter in Most Applications - Improved Efficiency
- Improved SNR
- Replaces Large LC Filter With Small, Low-Cost Ferrite
- Low Supply Current: 8 mA Typ at 12 V
- Shutdown Control: < 1 µA Typ
- Space-Saving, Thermally-Enhanced PowerPAD™ Packaging
- APPLICATIONS
- LCD Monitors/TVs
- Hands-Free Car Kits
- Powered Speakers
PowerPAD Is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners
The TPA3001D1 (sometimes referred to as TPA3001) is a 20-W monaural bridge-tied load (BTL) class-D audio power amplifier (class-D amp) with high efficiency, eliminating the need for heat sinks. The TPA3001D1 can drive 4-
or 8-
speakers with only a ferrite bead filter required to reduce EMI.
The gain of the amplifier is controlled by two input terminals, GAIN1 and GAIN0. This allows the amplifier to be configured for a gain of 12, 18, 23.6, or 36 dB. The differential input stage provides high common-mode rejection and improved power-supply rejection.
The amplifier also includes depop circuitry to reduce the amount of pop at power-up and when cycling SHUTDOWN.
The TPA3001D1 (TPA3001) is available in the 24-pin thermally enhanced TSSOP package (PWP), which eliminates the need for an external heat sink.
Documentación técnica
| Tipo | Título | Fecha | ||
|---|---|---|---|---|
| * | Data sheet | 20W Mono Class-D Audio Power Amplifier datasheet (Rev. E) | 23 ago 2010 |
Pedidos y calidad
- RoHS
- REACH
- Marcado del dispositivo
- Acabado de plomo/material de la bola
- Clasificación de nivel de sensibilidad a la humedad (MSL) / reflujo máximo
- Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
- Contenido del material
- Resumen de calificaciones
- Monitoreo continuo de confiabilidad
- Lugar de fabricación
- Lugar de ensamblaje