제품 상세 정보

Technology family AHC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Military Supply current (max) (µA) 40
Technology family AHC Number of channels 1 Operating temperature range (°C) -55 to 125 Rating Military Supply current (max) (µA) 40
CDIP (J) 16 135.3552 mm² 19.56 x 6.92 CFP (W) 16 69.319 mm² 10.3 x 6.73 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Operating range 2V to 5.5V VCC
  • Designed specifically for high-speed memory decoders and data-transmission systems
  • Incorporate three enable inputs to simplify cascading and/or data reception
  • Latch-up performance exceeds 250mA per JESD 17
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model (A114-A)
    • 1000V Charged-Device Model (C101)
  • Operating range 2V to 5.5V VCC
  • Designed specifically for high-speed memory decoders and data-transmission systems
  • Incorporate three enable inputs to simplify cascading and/or data reception
  • Latch-up performance exceeds 250mA per JESD 17
  • ESD protection exceeds JESD 22:
    • 2000V Human-Body Model (A114-A)
    • 1000V Charged-Device Model (C101)

The SNx4AHC138 decoders/demultiplexers are designed for high-performance memory-decoding and data-routing applications that require very short propagation-delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.

The SNx4AHC138 decoders/demultiplexers are designed for high-performance memory-decoding and data-routing applications that require very short propagation-delay times. In high-performance memory systems, these decoders can be used to minimize the effects of system decoding. When employed with high-speed memories utilizing a fast enable circuit, the delay times of these decoders and the enable time of the memory usually are less than the typical access time of the memory. This means that the effective system delay introduced by the decoders is negligible.

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기술 자료

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21개 모두 보기
유형 직함 날짜
* Data sheet SNx4AHC138 3-Line to 8-Line Decoders/Demultiplexers datasheet (Rev. N) PDF | HTML 2024/07/24
* SMD SN54AHC138 SMD 5962-98516 2016/06/21
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021/07/26
Selection guide Little Logic Guide 2018 (Rev. G) 2018/07/06
Selection guide Logic Guide (Rev. AB) 2017/06/12
Application note How to Select Little Logic (Rev. A) 2016/07/26
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015/12/02
User guide LOGIC Pocket Data Book (Rev. B) 2007/01/16
Product overview Design Summary for WCSP Little Logic (Rev. B) 2004/11/04
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004/07/08
Application note Selecting the Right Level Translation Solution (Rev. A) 2004/06/22
Application note Advanced High-Speed CMOS (AHC) Logic Family (Rev. C) 2002/12/02
Application note Texas Instruments Little Logic Application Report 2002/11/01
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002/08/29
Design guide AHC/AHCT Designer's Guide February 2000 (Rev. D) 2000/02/24
Application note Benefits & Issues of Migrating 5-V and 3.3-V Logic to Lower-Voltage Supplies (Rev. A) 1999/09/08
Product overview Military Advanced High-Speed CMOS Logic (AHC/AHCT) (Rev. C) 1998/04/01
Application note Migration From 3.3-V To 2.5-V Power Supplies For Logic Devices 1997/12/01
Application note Bus-Interface Devices With Output-Damping Resistors Or Reduced-Drive Outputs (Rev. A) 1997/08/01
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997/06/01
Application note Live Insertion 1996/10/01

설계 및 개발

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패키지 CAD 기호, 풋프린트 및 3D 모델
CDIP (J) 16 Ultra Librarian
CFP (W) 16 Ultra Librarian
LCCC (FK) 20 Ultra Librarian

주문 및 품질

포함된 정보:
  • RoHS
  • REACH
  • 디바이스 마킹
  • 납 마감/볼 재질
  • MSL 등급/피크 리플로우
  • MTBF/FIT 예측
  • 물질 성분
  • 인증 요약
  • 지속적인 신뢰성 모니터링
포함된 정보:
  • 팹 위치
  • 조립 위치

지원 및 교육

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