TPS22925
- Input Voltage Range: 0.65 V to 3.6 V
- On-Resistance
- RON = 9.2 mΩ at VIN = 3.6 V
- RON = 9.2 mΩ at VIN = 1.8 V
- RON = 10.2 mΩ at VIN = 1 V
- RON = 13.1 mΩ at VIN = 0.65 V
- 3-A Maximum Continuous Switch Current
- Quiescent Current, IQ,VIN = 29 µA at VIN = 3.6 V
- Low Control Input Threshold Enables 1.5-, 1.8-, 2.5-, or 3.3-V Logic
- Controlled Slew Rate
- tR = 97 µs at VIN = 3.6 V (TPS22925Bx)
- tR = 810 µs at VIN = 3.6 V (TPS22925Cx)
- Reverse Current Blocking (When Disabled)
- Quick Output Discharge (QOD) (TPS22925B and TPS22925C only)
- Wafer Chip Scale Package:
- 0.9 mm × 1.4 mm, 0.5-mm Pitch, 0.4-mm Height
- ESD Performance Tested per JESD 22
- 2-kV HBM and 1-kV CDM
The TPS22925 product family consists of four devices: TPS22925B, TPS22925BN, TPS22925C, and TPS22925CN. Each device is a 9-mΩ, single-channel load switch with a controlled slew rate.
The devices contain an N–channel MOSFET that can operate over an input voltage range of 0.65 V to 3.6 V and can support a maximum continuous current of 3 A. This continuous current enables the devices to be used across multiple designs and end equipments. Each of the TPS22925 devices provides reverse current blocking when disabled allowing for power supply protection and power multiplexing capabilities.
The controlled rise time for the device greatly reduces inrush current caused by large bulk load capacitances, thereby reducing or eliminating power supply droop. When operating with an input voltage of 3.6 V, the TPS22925Bx devices feature a 97 µs rise time and the TPS22925Cx devices feature an 810 µs rise time.
The TPS22925 family of devices can help reduce the total solution size by offering an optional integrated, 150-Ω pull–down resistor for quick output discharge (QOD) when the switch is turned off. Each of the TPS22925 devices is available in a 0.9 mm × 1.4 mm, 0.5-mm pitch, 0.4-mm height 6–pin wafer chip scale package (WCSP) allowing for smaller, more integrated designs. The WCSP and 9 mΩ of on-resistance allow use in space constrained, battery powered applications. The device is characterized for operation over the free–air temperature range of –40°C to +105°C.
기술 자료
| 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | TPS22925 3.6-V, 3-A, 9-mΩ On-Resistance Load Switch datasheet (Rev. D) | PDF | HTML | 2016/08/15 |
| Application note | Load Switch Thermal Considerations (Rev. A) | 2018/10/11 | ||
| Application note | Basics of Load Switches (Rev. A) | 2018/09/05 | ||
| Application note | Power Multiplexing Using Load Switches and eFuses (Rev. A) | 2017/06/20 | ||
| Application note | Selecting a Load Switch to Replace a Discrete Solution | 2017/04/30 | ||
| Application note | Timing of Load Switches | 2017/04/27 | ||
| Application note | Reverse Current Protection in Load Switches | 2016/05/19 | ||
| Application note | Quiescent Current vs Shutdown Current for Load Switch Power Consumption | 2016/03/30 | ||
| Application note | Managing Inrush Current (Rev. A) | 2015/05/28 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
TPS22925EVM — TPS22925EVM 3.6V, 3A, 9mΩ 부하 스위치 평가 모듈
TPS22925EVM 평가 모듈(EVM)은 TPS22925 부하 스위치 평가 용도로 완조립 및 테스트를 거친 회로입니다. TPS22925EVM은 TPS22925 부하 스위치가 포함된 양면 PCB입니다. EVM을 사용하면 다양한 부하 조건(0A~3 A)에서 TPS22925에 여러 다른 입력 전압(0.65V~3.6V)을 인가할 수 있습니다. 출력, 입력 및 스위칭 파형은 EVM에서 모니터링할 수 있습니다.
TPS22925NEVM — TPS22925NEVM 3.6V, 3A, 9mΩ 부하 스위치 평가 모듈
The TPS22925EVM evaluation module (EVM) is a fully assembled and tested circuit for evaluating the TPS22925N load switch. TPS22925EVM is a two-sided PCB containing the TPS22925 load switches. The EVM allows the user to apply different input voltages (0.65 V to 3.6 V) under different loading (...)
TPS22925B Unencrypted PSpice Transient Model Package (Rev. A)
TPS22925BN Unencrypted PSpice Transient Model Package (Rev. A)
TPS22925C Unencrypted PSpice Transient Model Package (Rev. A)
TPS22925CN Unencrypted PSpice Transient Model Package (Rev. A)
TIDA-01366 — 최대 125°C의 Altera™ MAX® 10 FPGA를 위한 작고 효율적인 전원 공급 장치 레퍼런스 설계
| 패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
|---|---|---|
| DSBGA (YPH) | 6 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.