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CC2340R2

現行

具有 256kB 快閃記憶體的 SimpleLink™ 32 位元 Arm® Cortex®-M0+ 2.4GHz 無線 MCU

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使用指南

CC2340R2

現行
產品規格表 立即訂購

產品詳細資料

CPU Arm® Cortex®-M0+ Technology Bluetooth® LE, Proprietary 2.4 GHz Protocols Bluetooth® Low Energy, Proprietary 2.4 GHz, Zigbee, Zigbee 3.0 Flash memory (kByte) 256 RAM (kByte) 28, 36 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Features OAD Number of GPIOs 12, 26 Security Cryptographic acceleration Cryptographic accelerators AES, RNG Operating system FreeRTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 125 TX power (max) (dBm) 8 Edge AI enabled No
CPU Arm® Cortex®-M0+ Technology Bluetooth® LE, Proprietary 2.4 GHz Protocols Bluetooth® Low Energy, Proprietary 2.4 GHz, Zigbee, Zigbee 3.0 Flash memory (kByte) 256 RAM (kByte) 28, 36 Peripherals 1 SPI, 1 UART, 1 comparator, 12-bit ADC 8-channel, I2C, Integrated battery monitor, Integrated temperature monitor, Real-time clock (RTC) Features OAD Number of GPIOs 12, 26 Security Cryptographic acceleration Cryptographic accelerators AES, RNG Operating system FreeRTOS Type Wireless MCU Sensitivity (best) (dBm) -102 Operating temperature range (°C) -40 to 125 TX power (max) (dBm) 8 Edge AI enabled No
VQFN (RGE) 24 16 mm² (4 mm × 4 mm) VQFN (RKP) 40 25 mm² (5 mm × 5 mm)

Wireless microcontroller

  • Optimized 48MHz Arm Cortex-M0+ processor
  • Up to 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy and IEEE 802.15.4 PHY and MAC
  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode on CC2340R52
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

  • Bluetooth LE
    • Features: LE 2M, LE Coded, Periodic Advertising, Extended Advertising, LE Secure Connections
    • Qualified against Bluetooth Core 5.4
  • Zigbee®
  • Thread
  • Proprietary systems

High-performance radio

  • –102dBm sensitivity for Bluetooth® LE Coded 125kbps
  • –96.5dBm sensitivity for Bluetooth® LE 1Mbps
  • –98dBm sensitivity for IEEE 802.15.4 (2.4GHz)
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • Up to 26 I/O pads
    • Two IO pads SWD, muxed with GPIOs
    • Two IO pads LFXT, muxed with GPIOs
    • Up to 22 DIOs (analog or digital IOs)
  • Up to 3 × 16-bit and 1× 24-bit general-purpose timers with quadrature decode mode and IR generation mode
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, up to 12 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +125°C

RoHS-compliant package

  • 5mm × 5mm RKP QFN40
  • 4mm × 4mm RGE QFN24
  • 2.2mm × 2.6mm YBG WCSP

Wireless microcontroller

  • Optimized 48MHz Arm Cortex-M0+ processor
  • Up to 512KB of in-system programmable flash
  • 12KB of ROM for bootloader and drivers
  • Up to 64KB of ultra-low leakage SRAM. Full RAM retention in standby mode
  • 2.4GHz RF transceiver compatible with Bluetooth Low Energy and IEEE 802.15.4 PHY and MAC
  • Integrated balun
  • Supports over-the-air upgrade (OTA)
  • Serial wire debug (SWD)

Low power consumption

  • MCU consumption:
    • 2.6mA active mode, CoreMark
    • 53µA/MHz running CoreMark
    • < 710nA standby mode on CC2340R52
    • 165nA shutdown mode, wake-up on pin
  • Radio consumption:
    • 5.3mA RX
    • 5.1mA TX at 0dBm
    • < 11.0mA TX at +8dBm

Wireless protocol support

  • Bluetooth LE
    • Features: LE 2M, LE Coded, Periodic Advertising, Extended Advertising, LE Secure Connections
    • Qualified against Bluetooth Core 5.4
  • Zigbee®
  • Thread
  • Proprietary systems

High-performance radio

  • –102dBm sensitivity for Bluetooth® LE Coded 125kbps
  • –96.5dBm sensitivity for Bluetooth® LE 1Mbps
  • –98dBm sensitivity for IEEE 802.15.4 (2.4GHz)
  • Output power up to +8dBm with temperature compensation

Regulatory compliance

  • Suitable for systems targeting compliance with these standards:
    • EN 300 328 (Europe)
    • FCC CFR47 Part 15
    • ARIB STD-T66 (Japan)

MCU peripherals

  • Up to 26 I/O pads
    • Two IO pads SWD, muxed with GPIOs
    • Two IO pads LFXT, muxed with GPIOs
    • Up to 22 DIOs (analog or digital IOs)
  • Up to 3 × 16-bit and 1× 24-bit general-purpose timers with quadrature decode mode and IR generation mode
  • 12-bit ADC, 1.2Msps with external reference, 267ksps with internal reference, up to 12 external ADC inputs
  • 1× low power comparator
  • 1× UART
  • 1× SPI
  • 1× I2C
  • Real-time clock (RTC)
  • Integrated temperature and battery monitor
  • Watchdog timer

Security enablers

  • AES 128-bit cryptographic accelerator
  • Random number generator from on-chip analog noise

Development tools and software

Operating range

  • On-chip buck DC/DC converter
  • 1.71V to 3.8V single supply voltage
  • Tj: –40°C up to +125°C

RoHS-compliant package

  • 5mm × 5mm RKP QFN40
  • 4mm × 4mm RGE QFN24
  • 2.2mm × 2.6mm YBG WCSP

The CC2340R SimpleLink™ family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy, Zigbee, Thread, and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf), and Personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the earlier Bluetooth LE specifications.
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 software development kit (SDK)
  • Zigbee® protocol stack support in the SimpleLink™ Low Power F3 software development kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R family is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100-percent code reuse when your design requirements change. For more information, visit the SimpleLink™ MCU platform.

The CC2340R SimpleLink™ family of devices are 2.4GHz wireless microcontrollers (MCUs), targeting Bluetooth Low Energy, Zigbee, Thread, and Proprietary 2.4GHz applications. These devices are optimized for low-power wireless communication with Over the Air Download (OAD) support in Building automation (wireless sensors, lighting control, beacons), asset tracking, medical, retail EPOS (electronic point of sale), ESL (electronic shelf), and Personal electronics (toys, HID, stylus pens) markets. Highlighted features of this device include:

  • Support for Bluetooth 5 features: high-speed mode (2Mbps PHY), long-range (LE Coded 125kbps and 500kbps PHYs), privacy 1.2.1 and channel selection algorithm #2, as well as backward compatibility and support for key features from the earlier Bluetooth LE specifications.
  • Fully qualified Bluetooth software protocol stack included with the SimpleLink™ Low Power F3 software development kit (SDK)
  • Zigbee® protocol stack support in the SimpleLink™ Low Power F3 software development kit (SDK)
  • Thread protocol stack support in SIMPLELINK TI OPENTHREAD SDK
  • Ultra-low standby current less than 0.71µA with RTC operational and full RAM retention that enables significant battery life extension, especially for applications with longer sleep intervals.
  • Integrated balun for reduced bill-of-material (BOM) board layout
  • Excellent radio sensitivity and robustness (selectivity and blocking) performance for Bluetooth Low Energy (–102dBm for 125kbps LE Coded PHY, with integrated balun)

The CC2340R family is part of the SimpleLink™ MCU platform, which consists of Wi-Fi, Bluetooth Low Energy, Thread, Zigbee, Sub1GHz MCUs, and host MCUs that all share a common, easy-to-use development environment with a single-core software development kit (SDK) and rich tool set. A one-time integration of the SimpleLink™ platform enables you to add any combination of the portfolio’s devices into your design, allowing 100-percent code reuse when your design requirements change. For more information, visit the SimpleLink™ MCU platform.
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技術文件

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 CC2340R SimpleLink™ Family of 2.4GHz Wireless MCUs datasheet (Rev. F) PDF | HTML 2025/11/7
* 使用指南 CC23xx SimpleLink Wireless MCU Technical Reference Manual (Rev. A) PDF | HTML 2024/8/7
* 勘誤表 CC2340R2 SimpleLink™ Wireless MCU Device Revision B (Rev. A) PDF | HTML 2024/8/23
網路安全諮詢 Invalid Bluetooth® LE Data Length Extension (DLE) Parameter Leading to DoS PDF | HTML 2026/5/28
網路安全諮詢 Denial of Service during Bluetooth LE authentication and connection PDF | HTML 2026/5/28
應用說明 How to Certify Your Bluetooth Product (Rev. N) PDF | HTML 2025/11/18
Product overview 無線 MCU 和 Zigbee ZBOSS 軟體讓高品質 RF 設計更加經濟 實惠 PDF | HTML Download English Version PDF | HTML 2024/7/18
應用說明 Configuring Bluetooth LE devices for Direct Test Mode PDF | HTML 2022/2/25

設計與開發

如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

LP-EM-CC2340R5 — 適用於 SimpleLink™ Bluetooth® 5.3 低耗能 MCU 的 CC2340R5 LaunchPad™ 開發套件

此 LaunchPad 開發套件可藉由支援 Bluetooth 5 低耗能 (LE) 及 2.4-GHz 專利通訊協定的 SimpleLink Bluetooth 低耗能 MCU 加快開發速度。軟體支援由 SimpleLink 低功率 F3 軟體開發套件 (SDK) 提供。

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開發板

DREAM-3P-CC2340 — DreamLNK CC2340 Bluetooth 模組

DL-CC2340-A 和 DL-CC2340-B Buetooth 低耗能模組都是以 TI SimpleLink CC2340R5 Bluetooth 低耗能裝置為基礎進行設計，該裝置使用 48MHz Cortex-M0+ 核心，最多可整合 512KB 快閃記憶體、36KB SRAM，以及多達 26 個通用 I/O 介面。此外，這些 Bluetooth 低耗能模組均配備內建 48-MHz 10-ppm 外部高速時脈及 32.768-kHz 外部低速時脈。

DL-CC2340-A Bluetooth 低耗能模組可針對 CC2340R5 晶片的所有 I/O 連接埠使用各種通用周邊設備，包括 (...)

從：Shenzhen DreamLNK Technology Co., Ltd.
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開發套件

LP-XDS110 — XDS110 LaunchPad™ 開發套件偵錯器

The LP-XDS110 LaunchPad 開發套件偵錯器，是可對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容產品進行編程和偵錯的工具。The LP-XDS110 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 和 XDS 相容裝置進行偵錯。

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開發套件

LP-XDS110ET — 具有 EnergyTrace™ 軟體的 XDS110ET LaunchPad™ 開發套件偵錯器

LP-XDS110ET LaunchPad 開發套件偵錯器可用於對德州儀器 (TI) 微控制器、微處理器和 DSP XDS 相容裝置進行編程和偵錯。LP-XDS110ET 設計為透過 20 針腳邊緣連接器直接連接到分離式 Launchpad 開發套件，也可用於對其他使用 XDS110 OUT 連接器的 LaunchPad 開發套件和 XDS 相容裝置進行偵錯。LP-XDS110ET 增加了功率量測電路、可支援 EnergyTrace™ 軟體。

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開發套件

BTV-3P-FMC — TI M0 居家健身器材自我供電控制與通訊解決方案

BTV-3P FMC 解決方案為居家健身器材提供控制與通訊功能，包括兩個功能模組：自我供電控制模組和藍牙通訊控制模組。
此解決方案專為居家健身器材（如划船機和健身腳踏車）所設計，可透過人體產生的動能驅動發電機，為整個系統供電，並控制運動阻力等級、測量運動指標參數，以及和手機/平板電腦/雲端通訊。

從：Beijing Touchvision Technology Co., Ltd
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開發套件

TTC-3P-BLUETOOTH-MODULES — TTC 藍牙低耗能模組

HY-23400XP 整合 Bluetooth 低耗能應用所需的所有功能，這是一款適合低功耗智慧裝置與 loT 應用之高度整合的 Bluetooth 5.3 模組。

HY-234001P 也爲低功耗產品應用提供 10 個可編程 GPIO，並提供 PCB 天線選擇。

HY-23400XP 提供了所有 Bluetooth 低耗能功能：無線電、堆疊、設定檔和客戶應用程式的應用空間。此模組也提供了連接感測器的彈性硬體介面。

HY-23400XP 可以直接利用標準 3-V 鈕釦型單芯電池或一對 AAA 電池供電。在最低功率關機模式下，只消耗 0.15-µA，並在幾微秒內喚醒。

HY-234001P 傳輸距離爲 (...)

從：Shenzhen Shengrun Technology Co., Ltd.
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子卡

BDE-3P-LE2340 — BDE LE2340 無線模組

BDE-3P-LE2340 modules are Bluetooth® 5.3 Low Energy wireless modules based on the CC2340R. With their low cost and exceptional RF and power consumption performance, these modules are ideal for applications that are cost-sensitive and require extended battery life. Multiple variants are available to (...)

從：BDE Technology Inc.
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偵錯探測器

TMDSEMU110-U — XDS110 JTAG 偵錯探測器

德州儀器 XDS110 是一種全新的偵錯探測器 (模擬器) 類別，適用於 TI 嵌入式處理器。XDS110 取代 XDS100 系列，可在單一 Pod 中支援更廣泛的標準 (IEEE1149.1、IEEE1149.7、SWD)。同時，所有 XDS 偵錯探針在所有配備嵌入式追蹤緩衝器 (ETB) 的 Arm® 與 DSP 處理器中均支援核心與系統追蹤。  對於針腳上的核心追蹤，則需要 XDS560v2 PRO TRACE。

德州儀器 XDS110 透過 TI 20 針腳連接器（具有用於 TI 14 針腳和 Arm 10 針腳和 Arm 20 針腳的多轉接器）連接到目標電路板，並透過 USB2.0 (...)

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軟體開發套件 (SDK)

SIMPLELINK-LOWPOWER-F3-SDK — SimpleLink™ Low Power F3 software development kit (SDK) for the CC23xx and CC27xx devices

SimpleLink™ 低功率 SDK 支援 CC13xx、CC23xx、CC26xx 及 CC27xx 產品系列。這些 SDK 搭配可提供適合開發 Sub-1 GHz 與 2.4 GHz 應用的全方位軟體套件，包括在 SimpleLink CC13xx、CC23xx、CC26xx 和 CC27xx 無線 MCU 上支援 Bluetooth® 低功耗、網狀網路、Zigbee®、Matter、Thread、802.15.4 型、專有與多協定解決方案。

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軟體開發套件 (SDK)

DSR-3P-ZBOSS — ZBOSS 是獨立、可攜式、高性能的 Zigbee 軟體通訊協定堆疊

ZBOSS 是由 DSR Corporation 開發的 Zigbee PRO 軟體通訊協定堆疊。ZBOSS 可協助公司針對其 Zigbee 解決方案，克服互通性、移植、自訂、測試及最佳化的相關挑戰。Zigbee 是開放且互通的完整堆疊 IoT 技術，適用於包含平台、產品與支援的多元生態系統。ZBOSS Zigbee PRO 2023 支援所有角色、多種叢集資料庫，以及領導級的 Zigbee 智慧住宅生態系統。ZBOSS 具備跨平台支援、多工處理、固定記憶體用量、無作業系統配置，以及易於使用的 API。

從：DSR Corporation
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IDE、配置、編譯器或偵錯程式

CCSTUDIO — Code Composer Studio™ integrated development environment (IDE)

CCStudio™ IDE is part of TI's extensive CCStudio™ development ecosystem and is an integrated development environment for TI's microcontrollers, processors, wireless connectivity devices, and radar sensors. CCStudio IDE is available as desktop or cloud-based applications. The cloud version (...)

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IDE、配置、編譯器或偵錯程式

CCSTUDIO-OPENOCD — OpenOCD Binary Releases

Pre-built binaries for the popular open-source OpenOCD debug stack.
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IDE、配置、編譯器或偵錯程式

SYSCONFIG — Standalone desktop version of SysConfig

CCStudio™ SysConfig is part of TI's extensive CCStudio™ development ecosystem and is a configuration tool that simplifies hardware and software configuration challenges to accelerate software development.

SysConfig provides an intuitive graphical user interface for configuring pins, peripherals, (...)

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線上培訓

SIMPLELINK-ACADEMY-CC23XX — Simplelink™ CC23xx Academy

SimpleLink™ Academy is an interactive learning experience for TI's wireless protocols. Our hands-on training modules cover all phases of development for LaunchPad™ development kits alongside software development kits (SDKs) in the SimpleLink MCU family.
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快速入門

TI-DEVELOPER-ZONE — Start embedded development on your desktop or in the cloud

From evaluation to deployment the TI Developer Zone provides a comprehensive range of software, tools and training to ensure that you have everything you need for each stage of the development process.
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軟體程式設計工具

UNIFLASH — UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash 是 TI 龐大 CCStudio™ 開發生態系統的一部分，是一款用於在 TI 微控制器與無線連線裝置上對晶片內快閃記憶體進行燒錄，以及在 TI 處理器上對板載快閃記憶體進行燒錄的軟體工具。UniFlash 提供圖形化介面與命令行介面，並可在桌面上或雲端中執行。

UniFlash 可從 CCStudio™ 開發人員區上的雲端執行，或在下載後於 Windows®、Linux® 和 macOS® 電腦中使用。

請注意，mmWave、AMx、K2G 和 J7 裝置不支援 macOS。AMx、K2G 和 J7 裝置僅於命令列上支援。

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支援軟體

SMARTRF-STUDIO-8 — 適用於 CC23xx 和 CC27xx 裝置以及 CC140xP 收發器的 SmartRF Studio 8 應用軟體

SmartRF™ Studio 是一款 Windows 應用程式，功用在於協助射頻系統的設計人員在為所有 TI CC1xxx 及 CC2xxx 低功耗射頻裝置設計過程中，能在早期階段輕鬆評估無線電。此程式簡化了配置暫存器值和命令的產生，以及射頻系統的實際測試和除錯。

SmartRF Studio 支援下列 TI 裝置：

 

資源

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支援軟體

HN-3P-BLE-TOOLKIT — 適用於 TI SimpleLink™ 無線 MCU 的 Hubble Network 全球 Bluetooth® 低功耗連線

Hubble Network 韌體可在德州儀器 SimpleLink™ 藍牙低功耗 (LE) MCU（包含 CC2340 與 CC2755 裝置系列）上實現全球資產可見性，無須行動數據機、衛星無線電或自訂硬體。透過在標準 TI 藍牙低功耗 MCU 上執行 Hubble 韌體，產品可透過 Hubble 超過一億個閘道器與衛星的網路回報位置與感測器資料。

支援 Hubble 的裝置會傳送藍牙低功耗廣播。附近的閘道器會偵測這些廣播並加入位置與時間資訊，接著 Hubble Cloud 會將偵測事件傳遞至您的後端系統。這使得利用低功耗 TI 晶片實現資產追蹤、物流、冷鏈監控、設備管理與工業物聯網 (...)

從：Hubble Network
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計算工具

BT-POWER-CALC — Bluetooth Power Calculator for CC13xx, CC26xx, CC23xx, and CC27xx devices

This tool is used to calculate Bluetooth Low Energy power consumption estimates for various use cases on TI Bluetooth devices. The calculator includes both advertising and peripheral use cases with the ability to configure different use case profile parameters. The calculator outputs an estimate (...)
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設計工具

SIMPLELINK-2-4GHZ-DESIGN-REVIEW — Hardware Design Review Request Form for SimpleLink™ CC2xxx Devices

SimpleLink 硬體設計審核流程提供一對一接觸的方式，並由主題內容專家協助審查您的設計，提供您寶貴的意見。一個簡單的三步驟流程用於請求審查，以及相關技術文件和資源的連結，可在此處找到。

入門指南

一般設計問題應張貼在我們的 E2E 討論區中，然後才能要求 2.4 GHz 硬體設計審查。

請確實備妥下列必要文件，隨硬體設計審查申請表一起傳送：

  • 確認產品頁上提供的所有硬體文件均已經過審查，例如產品規格表、設計指南、使用指南和其他硬體資源
  • 電路圖的可攜式文件格式 (PDF) 版本可供檢閱
  • 物料清單 (BOM) 可供檢閱
  • 堆疊詳細資料可供檢閱
  • 電路板設計的 Gerber 檔案 (含零件位置和參考指示項) (...)
支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
VQFN (RGE) 24 Ultra Librarian
VQFN (RKP) 40 Ultra Librarian
適用 TI 的評估品項標準條款與條件。

訂購與品質

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

以英文檢視所有論壇主題

內容係由 TI 和社群貢獻者依「現狀」提供，且不構成 TI 規範。檢視使用條款。

若有關於品質、封裝或訂購 TI 產品的問題，請參閱 TI 支援。​​​​​​​​​​​​​​

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