CD74ACT373
- Buffered inputs
- Typical pro-agation delay:
4.3 ns @ VCC = 5 V, TA = 25°C, CL = 50 pF - Exceeds 2-kV ESD Protection - MIL-STD-883, Method 3015
- SCR-Latchup-resistant CMOS process and circuit design
- Speed of bipolar FAST*/AS/S with significantly reduced power consumption
- Balanced propagation delays
- AC types feature 1.5-V to 5.5-V operation and balanced noise immunity at 30% of the supply
- ± 24-mA output drive current
-Fanout to 15 FAST* ICs
-Drives 50-ohm transmission lines - Characterized for operation from –40° to 85°C
*FAST is a Registered Trademark of Fairchild Semicondutor Corp.
The RCA-CD54/74AC373 and CD54/74AC533 and the CD54/74ACT373 and CD54/74ACT533 octal transparent 3-state latches use the RCA ADVANCED CMOS technology. The outputs are transparent to the inputs when the Latch Enable (LE\) is HIGH. When the Latch Enable (LE\) goes LOW, the data is latched. The Output Enable (OE\) controls the 3-sate outputs. When the Output Enable (OE\) is HIGH, the outputs are in the high-impedance state. The latch operation is independent of the state of the Output Enable.
The CD74AC/ACT373 and CD74AC/ACT533 are supplied in 20-lead dual-in-line plastic package (E suffix) and in 20-lead dual-in-line small-outline plastic packages (M suffix). Both package types are operable over the following temperature ranges: Commerical (0 to 70°C); Industrial (-40 to +85°C); and Extended Industrial/Military (-55 to +125°C).
The CD54AC/ACT373 and CD54AC/ACT533, available in chip form (H suffix), are operable over the -55 to +125°C temperature range.
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技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Octal Transparent Latch, 3-State datasheet | 1998年 12月 3日 | |
Application note | Power-Up Behavior of Clocked Devices (Rev. B) | PDF | HTML | 2022年 12月 15日 | |
Application note | Implications of Slow or Floating CMOS Inputs (Rev. E) | 2021年 7月 26日 | ||
Selection guide | Logic Guide (Rev. AB) | 2017年 6月 12日 | ||
Application note | Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) | 2015年 12月 2日 | ||
User guide | LOGIC Pocket Data Book (Rev. B) | 2007年 1月 16日 | ||
Application note | Semiconductor Packing Material Electrostatic Discharge (ESD) Protection | 2004年 7月 8日 | ||
Application note | Selecting the Right Level Translation Solution (Rev. A) | 2004年 6月 22日 | ||
Application note | TI IBIS File Creation, Validation, and Distribution Processes | 2002年 8月 29日 | ||
Application note | CMOS Power Consumption and CPD Calculation (Rev. B) | 1997年 6月 1日 | ||
Application note | Designing With Logic (Rev. C) | 1997年 6月 1日 | ||
Application note | Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc | 1996年 4月 1日 |
設計與開發
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14-24-LOGIC-EVM 評估模組 (EVM) 設計用於支援任何 14 針腳至 24 針腳 D、DW、DB、NS、PW、DYY 或 DGV 封裝的任何邏輯裝置。
封裝 | 引腳 | 下載 |
---|---|---|
PDIP (N) | 20 | 檢視選項 |
SOIC (DW) | 20 | 檢視選項 |
訂購與品質
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- 進行中可靠性監測
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