產品詳細資料

Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
Technology family FCT Operating temperature range (°C) -55 to 125 Rating Military
CDIP (J) 20 167.464 mm² 24.2 x 6.92 LCCC (FK) 20 79.0321 mm² 8.89 x 8.89
  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

  • Function, Pinout, and Drive Compatible With FCT and F Logic
  • Reduced VOH (Typically = 3.3 V) Versions of Equivalent FCT Functions
  • Edge-Rate Control Circuitry for Significantly Improved Noise Characteristics
  • Ioff Supports Partial-Power-Down Mode Operation
  • Matched Rise and Fall Times
  • Fully Compatible With TTL Input and Output Logic Levels
  • ESD Protection Exceeds JESD 22
    • 2000-V Human-Body Model (A114-A)
    • 200-V Machine Model (A115-A)
    • 1000-V Charged-Device Model (C101)
  • Edge-Triggered D-Type Inputs
  • 250-MHz Typical Switching Rate
  • CY54FCT574T
    • 32-mA Output Sink Current
    • 12-mA Output Source Current
  • CY74FCT574T
    • 64-mA Output Sink Current
    • 32-mA Output Source Current
  • 3-State Outputs

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

The \x92FCT574T devices are high-speed, low-power, octal D-type flip-flops, featuring separate D-type inputs for each flip-flop. These devices have 3-state outputs for bus-oriented applications. A buffered clock (CP) and output-enable (OE\) inputs are common to all flip-flops. The \x92FCT574T are identical to \x92FCT374T, except for a flow-through pinout to simplify board design. The eight flip-flops in the \x92FCT574T store the state of their individual D inputs that meet the setup-time and hold-time requirements on the low-to-high CP transition. When OE\ is low, the contents of the eight flip-flops are available at the outputs. When OE\ is high, the outputs are in the high-impedance state. The state of OE\ does not affect the state of the flip-flops.

These devices are fully specified for partial-power-down applications using Ioff. The Ioff circuitry disables the outputs, preventing damaging current backflow through the device when it is powered down.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 10
類型 標題 日期
* Data sheet 8-Bit Registers With 3-State Outputs datasheet 2001年 10月 11日
* SMD CY54FCT574T SMD 5962-92222 2016年 6月 21日
Application note Power-Up Behavior of Clocked Devices (Rev. B) PDF | HTML 2022年 12月 15日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
Application note Selecting the Right Level Translation Solution (Rev. A) 2004年 6月 22日
User guide CYFCT Parameter Measurement Information 2001年 4月 2日
Selection guide Advanced Bus Interface Logic Selection Guide 2001年 1月 9日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 引腳 下載
CDIP (J) 20 檢視選項
LCCC (FK) 20 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片