DS25CP102Q-Q1
- AECQ-100 Grade 3
- DC - 3.125 Gbps Low Jitter, Low Skew, Low Power Operation
- Pin Configurable, Fully Differential, Non-Blocking Architecture
- Pin Selectable Transmit Pre-Emphasis and Receive Equalization Eliminate Data Dependant Jitter
- Wide Input Common Mode Voltage Range Allows DC-coupled Interface to CML and LVPECL Drivers
- On-Chip 100Ω Input and Output Termination Minimizes Insertion and Return Losses, Reduces Component Count and Minimizes Board Space
- 8 kV ESD on LVDS I/O pins Protects Adjoining components
- Small 4 mm x 4 mm WQFN-16 Space Saving Package
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The DS25CP102Q is a 3.125 Gbps 2x2 LVDS crosspoint switch optimized for high-speed signal routing and switching over lossy FR-4 printed circuit board backplanes and balanced cables. Fully differential signal paths ensure exceptional signal integrity and noise immunity. The non-blocking architecture allows connections of any input to any output or outputs.
The DS25CP102Q features two levels (Off and On) of transmit pre-emphasis (PE) and two levels (Off and On) of receive equalization (EQ).
Wide input common mode range allows the switch to accept signals with LVDS, CML and LVPECL levels; the output levels are LVDS. A very small package footprint requires a minimal space on the board while the flow-through pinout allows easy board layout. Each differential input and output is internally terminated with a 100Ω resistor to lower device insertion and return losses, reduce component count and further minimize board space.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | Auto 3.125Gbps 2X2 LVDS Crosspoint Sw w/Xmit Pre-Emphasis & Receive Equalization datasheet (Rev. E) | 2013年 4月 14日 |
設計與開發
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DS25CP102EVK — 3.125 Gbps 2x2 LVDS 交叉點開關評估板
The DS25CP102EVK is an evaluation kit designed for demonstrating performance of the DS25CP102, a 3.125 Gbps 2x2 LVDS Crosspoint Switch with transmit pre-emphasis and receive equalization. The evaluation kit is comprised of the DS25CP102 with its associated input and output SMA connectors and (...)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
WQFN (RGH) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點