FDC2214-Q1
- Qualified for automotive applications
- AEC-Q100 qualified with the following
results:
- Device temperature grade 1: –40°C to +125°C ambient operating temperature range
- Device HBM ESD classification level 2
- Device CDM ESD classification level C5
- EMI-resistant architecture
- Maximum output rates (one active
channel):
- 13.3kSPS (FDC2112-Q1, FDC2114-Q1)
- 4.08kSPS (FDC2212-Q1, FDC2214-Q1)
- Maximum input capacitance: 250nF (at 10kHz with 1mH inductor)
- Sensor excitation frequency: 10kHz to 10MHz
- Number of channels: 2, 4
- Resolution: up to 28 bits
- RMS noise: 0.3fF at 100SPS and fSENSOR = 5MHz
- Supply voltage: 2.7V to 3.6V
- power consumption: active: 2.1mA
- Low-power sleep mode: 35µA
- Shutdown: 200nA
- Interface: I2C
- Temperature range: –40°C to +125°C
Capacitive sensing is a low-power, high-resolution contactless sensing technique that can be applied to a variety of applications ranging from proximity detection to gesture recognition. The sensor in a capacitive sensing system is any metal or conductor, allowing for highly flexible system design.
The main challenge limiting sensitivity in capacitive sensing applications is noise susceptibility of the sensors. With the FDC2x1x-Q1 resonant sensing architecture, performance can be maintained even in presence of fluorescent light.
The FDC2x1x-Q1 is a multi-channel family of high-resolution, high-speed capacitance-to-digital converters for implementing capacitive sensing solutions. The devices employ an innovative narrow-band based architecture to offer high rejection of noise while providing high resolution at high speed. The devices support a wide excitation frequency range, offering flexibility in system design.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | FDC2x1x-Q1 Multi-Channel, High Resolution Capacitance-to-Digital Converter for Capacitive Sensing Applications datasheet (Rev. A) | PDF | HTML | 2024/10/10 | ||
| 應用說明 | Common Inductive and Capacitive Sensing Applications (Rev. B) | PDF | HTML | 2021/6/22 | |||
| 應用說明 | Simulate Inductive Sensors Using FEMM (Finite Element Method Magnetics) (Rev. A) | PDF | HTML | 2021/6/16 | |||
| 應用說明 | Capacitive Proximity Sensing Using FDC2x1y (Rev. A) | 2017/10/20 | ||||
| 應用說明 | Ground Shifting in Capacitive Sensing Applications | PDF | HTML | 2016/5/27 | |||
| 應用說明 | Power Consumption Analysis for Low Power Capacitive Sensing Applications | PDF | HTML | 2016/1/18 | |||
| 更多文件說明 | A Guide to Capacitive Sensing Infographic (Rev. A) | 2015/10/19 | ||||
| 應用說明 | Derivative Integration Algorithm for Proximity Sensing | 2015/9/29 | ||||
| 應用說明 | Capacitive Sensing: Direct vs Remote Liquid Level Sensing Performance Analysis (Rev. A) | 2015/7/24 |
設計與開發
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FDC2214EVM — 具有兩個電容式感測器的 FDC2214 評估模組
FDC2214 評估模組展現電感感測技術，可精確偵測傳導性目標通過固定閾值。此評估模組包含兩組連接至 FDC2214 四個通道中其中兩個的 PCB 電容感測器。MSP430 微控制器用於將 FDC2214 介接至主機電腦。此模組旨在為使用者提供系統原型設計的最大彈性，且其在兩個位置設有折斷槽：
- 在 PCB 電容感測器與 FDC2214 之間
- FDC2214 和 MSP430 介面之間
第一個穿孔可讓使用者選擇從模組中拆下 PCB 線圈，並使用自訂感測器線圈進行實驗，第二個穿孔則可讓使用者將 FDC2214 和感測器線圈連接至不同的微控制器系統，或在單一系統中使用多個感測器。隨附的 GUI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| WQFN (RGH) | 16 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。