LMV7271
- (VS = 1.8 V, TA = 25°C,
Typical Values Unless Specified). - Single or Dual Supplies
- Ultra Low Supply Current 9 µA Per Channel
- Low Input Bias Current 10 nA
- Low Input Offset Current 200 pA
- Low Ensured VOS 4 mV
- Propagation Delay 880 ns (20-mV Overdrive)
- Input Common Mode Voltage Range 0.1 V
Beyond Rails - LMV7272 is Available in DSBGA Package
The LMV727x devices are rail-to-rail input low power comparators, characterized at supply voltages 1.8 V, 2.7 V, and 5 V. They consume as little as 9-µA supply current per channel while achieving a 800-ns propagation delay.
The LMV7271 and LMV7275 (single) are available in SC70 and SOT-23 packages. The LMV7272 (dual) is available in the DSBGA package. With these tiny packages, the PCB area can be significantly reduced. They are ideal for low voltage, low power, and space-critical designs.
The LMV7271 and LMV7272 both feature a push-pull output stage which allows operation with minimum power consumption when driving a load.
The LMV7275 features an open-drain output stage that allows for wired-OR configurations. The open-drain output also offers the advantage of allowing the output to be pulled to any voltage up to 5.5 V, regardless of the supply voltage of the LMV7275, which is useful for level-shifting applications.
The LMV727x devices are built with Texas Instruments advance submicron silicon-gate BiCMOS process. They all have bipolar inputs for improved noise performance, and CMOS outputs for rail-to-rail output swing.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | LMV727x Single and Dual, 1.8-V Low Power Comparators With Rail-to-Rail Input datasheet (Rev. I) | PDF | HTML | 2015年 9月 3日 |
Application note | Nano-Power Battery Monitoring in Personal Electronics | 2017年 12月 8日 | ||
E-book | The Signal e-book: A compendium of blog posts on op amp design topics | 2017年 3月 28日 | ||
Application note | AN-1984 LM57 Temperature Switch vs Thermistors (Rev. C) | 2013年 5月 1日 |
設計與開發
如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件,可測試通用運算放大器 (op amp) 參數,並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項,可滿足封裝需求,使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝,包括:
- D (SOIC-8)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV(SOT23-5 與 SOT23-6)
- DCK(SC70-5 與 SC70-6)
PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
SOT-23 (DBV) | 5 | Ultra Librarian |
SOT-SC70 (DCK) | 5 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。