PAL16R4AM
- Choice of Operating Speeds
- High-Speed, A Devices . . . 25 MHz Min
- Half-Power, A-2 Devices . . . 16 MHz Min
- Choice of Input/Output Configuration
- Package Options Include Both Ceramic DIP and Chip Carrier in Addition to Ceramic Flat Package
| DEVICE | I INPUTS | 3-STATE O OUTPUTS | REGISTERED Q OUTPUTS | I/O PORT S | |||||
|---|---|---|---|---|---|---|---|---|---|
| | | | | | |||||
| | | | | | |||||
| | | | | | |||||
| | | | | |
PAL is a registered trademark of Advanced Micro Devices Inc.
These programmable array logic devices feature high speed and a choice of either standard or half-power devices. They combine Advanced Low-Power Schottky technology with proven titanium-tungsten fuses. These devices will provide reliable, high-performance substitutes for conventional TTL logic. Their easy programmability allow for quick design of "custom" functions and typically results in a more compact circuit board. In addition, chip carriers are available for further reduction in board space.
The Half-Power versions offer a choice of operating frequency, switching speeds, and power dissipation. In many cases, these Half-Power devices can result in significant power reduction from an overall system level.
The PAL16' M series is characterized for operation over the full military temperature range of -55°C to 125°C.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | Standard High-Speed Programmable Array Logic Circuits datasheet | 1992年 3月 1日 |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點