PGA460-Q1
- Fully integrated solution for ultrasonic sensing
- AEC-Q100 qualified with the following results:
- Device temperature grade 2: –40°C to +105°C ambient operating temperature
- Device HBM ESD classification level 2
- Device CDM ESD classification level C4B
- Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
- Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
- Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
- Two presets of 12-point time-varying threshold for object detection
- Timers to measure multiple echo distance and duration
- Integrated temperature sensor
- Record time for object detection up to 11 m
- 128 bytes of RAM for echo recording
- 42 bytes of user EEPROM to store configuration for fast initialization
- One-wire high-voltage time-command interface or USART asynchronous interface
- CMOS level USART interface
- Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.
The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.
The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.
技術文件
設計與開發
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BOOSTXL-PGA460 — 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組
評估步驟
步驟 1:購買 PGA460-F5529-BNDL(或 BOOSTXL-PGA460 + MSP-EXP430F5529LP)
步驟 2:下載 GUI
步驟 3:下載 (...)
PGA460PSM-EVM — PGA460 超音波近距感測評估模組
若運送至歐洲,請訂購等效訊號調節裝置 BOOSTXL-PGA460
PGA460PSM 評估模組 (EVM) 是一款小型解決方案,展示雙面印刷電路板 (PCB) 間距,並符合 PGA460 超音波感測器訊號調節器的支援元件需求。此硬體型號只能在單靜態傳感器模式下操作。單靜態轉換器模式運用單一轉換器來傳送與接收超音波回波。
由於 PGA460 僅能以從屬裝置的方式操作,因此必須搭配一個主控器或處理器,才能進行 PGA460 的設定和運作。此 EVM 的使用指南著重於主要裝置,且僅在與 BOOSTXL-PGA460 評估模組 GUI 軟體配對時,將 MSP-EXP430F5529LP (...)
SLAC739 — PGA460-Q1 EVM GUI (Version 1.0.2.0)
支援產品和硬體
產品
超音波感測器 AFE
硬體開發
開發板
PGA460 Mono-static Transducer Transformer Driver Small Form Factor Design File
PGA460 Mono-static Transducer Half-Bridge Driver Small Form Factor Design File
PGA460 Mono-static Transducer Full-Bridge Driver Small Form Factor Design File
PGA460 Mono-static Transducer Transformer Driver Ultra-Small Design File
PGA460 Mono-Static Transducer Half-Bridge Driver Ultra-Small Design File
PGA460 Bi-static Transducer Transformer Driver Small Form Factor Design File
PGA460 Bi-static Transducer Half-Bridge Driver Small Form Factor Design File
PGA460 Bi-static Transducer Full-Bridge Driver Small Form Factor Design File
TIDA-01424 — 車用超音波腳踢開啟參考設計
TIDA-01597 — 停車輔助專用的汽車超音波感測模組參考設計
TIDA-060024 — 超音波近距感測模組 (PSM) 參考設計
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。