產品詳細資料

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

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類型 標題 日期
* Data sheet PGA460-Q1 Automotive Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 2023年 2月 10日
White paper Automated parking made possible with TI mmWave radar and ultrasonic sensors (Rev. B) 2023年 6月 23日
Application note Ultrasonic Sensing Basics (Rev. D) PDF | HTML 2021年 12月 2日
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 2021年 4月 7日
EVM User's guide PGA460PSM-EVM User's Guide 2019年 7月 15日
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 2019年 7月 15日
Application note PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 2019年 7月 12日
Technical article Paving the way with ultrasonic sensing PDF | HTML 2019年 6月 10日
Application note PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 2019年 2月 28日
Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design 2018年 10月 9日
User guide PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 2018年 3月 19日
Application brief PGA460-Q1 in Automotive Ultrasonic Kick-to-open Liftgate Systems (Rev. B) 2018年 1月 3日
Application brief PGA460-Q1 in Ultrasonic Park Assist (UPA) (Rev. A) 2018年 1月 3日
Technical article Where are ultrasonic sensors used? – Part 2 PDF | HTML 2017年 10月 31日
Technical article Comparing capacitive and ultrasonic kick-to-open sensing PDF | HTML 2017年 9月 6日
Application note PGA460 Software Development Guide (Rev. A) 2017年 8月 22日
Technical article Where are ultrasonic sensors used? – Part 1 PDF | HTML 2017年 6月 29日
Application note PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 2017年 5月 1日
User guide PGA460-Q1 EVM Quick Start Guide 2017年 2月 17日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

BOOSTXL-PGA460 — 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組

利用 BOOSTXL-PGA460 (+ MSP430F5529LP) 全面評估 PGA460 超音波感測器訊號調節器。PGA460 是具有數位訊號處理器的整合式超音波前端,輸出飛時測距資料、回波寬度及振幅資訊。驅動器強度可透過限制變壓器的電流進行配置,而接收器則可進行調整以過濾和處理傳回的回波資料,以進行後量測分析。相關的 PGA460 EVM GUI 可用於自訂、配置和控制超音波設定,以及監控所產生的超音波活動性能。

評估步驟

步驟 1:購買 PGA460-F5529-BNDL(或 BOOSTXL-PGA460 + MSP-EXP430F5529LP

步驟 2:下載 GUI

步驟 3:下載 (...)
使用指南: PDF
開發板

PGA460PSM-EVM — PGA460 超音波近距感測評估模組

若運送至歐洲,請訂購等效訊號調節裝置 BOOSTXL-PGA460

PGA460PSM 評估模組 (EVM) 是一款小型解決方案,展示雙面印刷電路板 (PCB) 間距,並符合 PGA460 超音波感測器訊號調節器的支援元件需求。此硬體型號只能在單靜態傳感器模式下操作。單靜態轉換器模式運用單一轉換器來傳送與接收超音波回波。

由於 PGA460 僅能以從屬裝置的方式操作,因此必須搭配一個主控器或處理器,才能進行 PGA460 的設定和運作。此 EVM 的使用指南著重於主要裝置,且僅在與 BOOSTXL-PGA460 評估模組 GUI 軟體配對時,將 MSP-EXP430F5529LP (...)

使用指南: PDF
TI.com 無法提供
程式碼範例或展示

SLAC741 PGA460 Energia Library and Code Example (Version 1.1.0)

支援產品和硬體

支援產品和硬體

產品
超音波感測器 AFE
PGA460 超音波訊號處理器與收發驅動器 PGA460-Q1 車用超音波訊號處理器與轉換器驅動器
硬體開發
開發板
BOOSTXL-PGA460 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組 PGA460PSM-EVM PGA460 超音波近距感測評估模組
開發模組 (EVM) 的 GUI

SLAC739 PGA460-Q1 EVM GUI (Version 1.0.2.0)

支援產品和硬體

支援產品和硬體

產品
超音波感測器 AFE
PGA460 超音波訊號處理器與收發驅動器 PGA460-Q1 車用超音波訊號處理器與轉換器驅動器
硬體開發
開發板
BOOSTXL-PGA460 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組 PGA460PSM-EVM PGA460 超音波近距感測評估模組
參考設計

TIDA-01424 — 車用超音波腳踢開啟參考設計

此參考設計採用超音波感測來偵測踢腿的動作,以辨識使用者何時希望啟動汽車上的電動升降門、電動後車廂或電動滑動門的。  超音波感測可偵測多個物體,並測量每個物體的距離。本設計具備高解析度與低功耗,適用於強調手勢偵測與電池低電流消耗的車用免手持閉合系統。
Design guide: PDF
電路圖: PDF
參考設計

TIDA-01597 — 停車輔助專用的汽車超音波感測模組參考設計

此參考設計採用三個高度整合的系統單晶片 (SoC) 超音波轉換器驅動器,為停車輔助系統 (PAS) 提供硬體架構。這些超音波轉換器驅動器配備具進階數位訊號處理器 (DSP) 核心的整合式訊號調節器。透過這些整合式功能,即可實現對 25cm 至 2.5m 範圍內物件的偵測。距離資料將透過單線介面 (OWI) 傳送至本機電子控制單元 (ECU),並在此彙總和處理資料。此設計指南中所述的感測器初始化、物件偵測演算法和軟體為開發汽車或防撞 PAS 的工程師提供了基礎架構。
Design guide: PDF
電路圖: PDF
參考設計

TIDA-060024 — 超音波近距感測模組 (PSM) 參考設計

此參考設計為一小型解決方案,展示雙面 PCB 間距和 PGA460 超音波感測器訊號調節器的最低支援元件需求。此模組以單一感測器發射和接收操作的單靜態模式運作,可在 0.3 至 5m 範圍內透過空氣進行物體偵測。無論環境溫度、濕度或目標物的顏色與透明度,物體偵測皆不受影響;然而,極小或柔軟的目標物可能會影響最大偵測範圍。PGA460 以從屬裝置專用方式運作,需要獨立的主控制器。TI 建議使用 MSPEXP430F5529LP 做為範例主控制器,以重新利用現有 PGA460Q1EVM GUI 和範例原始碼。
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 16 Ultra Librarian

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  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 認證摘要
  • 進行中持續性的可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

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