產品詳細資料

Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
Type Integrated Features Transformer drive Gain (min) (dB) 32 Gain (max) (dB) 90 Number of input channels 1 Supply voltage (min) (V) 6 Supply voltage (max) (V) 28 Operating temperature range (°C) -40 to 105 Interface type OWU (one-wire UART), TCI (time-command interface), UART, USART Rating Automotive
TSSOP (PW) 16 32 mm² 5 x 6.4
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics
  • Fully integrated solution for ultrasonic sensing
  • AEC-Q100 qualified with the following results:
    • Device temperature grade 2: –40°C to +105°C ambient operating temperature
    • Device HBM ESD classification level 2
    • Device CDM ESD classification level C4B
  • Complimentary low-side drivers with configurable current limit supporting both transformer based and direct drive topology for transducer excitation
  • Single transducer for both burst/listen or a transducer pair, one for burst and the other for listen operation
  • Low-noise receiver with programmable 6-point time-varying gain (32 to 90 dB) with DSP (BPF, demodulation) for echo envelope detection
  • Two presets of 12-point time-varying threshold for object detection
  • Timers to measure multiple echo distance and duration
  • Integrated temperature sensor
  • Record time for object detection up to 11 m
  • 128 bytes of RAM for echo recording
  • 42 bytes of user EEPROM to store configuration for fast initialization
  • One-wire high-voltage time-command interface or USART asynchronous interface
  • CMOS level USART interface
  • Sensor diagnostics (decay frequency and time, excitation voltage), supply, and transceiver diagnostics

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

The PGA460-Q1 device is a highly-integrated system on-chip ultrasonic transducer driver and signal conditioner with an advanced DSP core. The device has a complimentary low-side driver pair that can drive a transducer either in a transformer based topology using a step-up transformer or in a direct-drive topology using external high-side FETs. The device can receive and condition the reflected echo signal for reliable object detection. This feature is accomplished using an analog front-end (AFE) consisting of a low-noise amplifier followed by a programmable time-varying gain stage feeding into an ADC. The digitized signal is processed in the DSP core for both near-field and far-field object detection using time-varying thresholds.

The main communication with an external controller is achieved by either a time-command interface (TCI) or a one-wire USART asynchronous interface on the IO pin, or a CMOS-level USART interface on the RXD and TXD pins. The PGA460-Q1 can be put in ultra-low quiescent current low-power mode to reduce power consumption when not in use and can be woken up by commands on the communication interfaces.

The PGA460-Q1 also includes on-chip system diagnostics which monitor transducer voltage during burst, frequency and decay time of transducer to provide information about the integrity of the excitation as well as supply-side and transceiver-side diagnostics for overvoltage, undervoltage, overcurrent and short-circuit scenarios.

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類型 標題 日期
* Data sheet PGA460-Q1 Automotive Ultrasonic Signal Processor and Transducer Driver datasheet (Rev. C) PDF | HTML 2023年 2月 10日
White paper Automated parking made possible with TI mmWave radar and ultrasonic sensors (Rev. B) 2023年 6月 23日
Application note Ultrasonic Sensing Basics (Rev. D) PDF | HTML 2021年 12月 2日
Application note PGA460 Ultrasonic Module Hardware and Software Optimization (Rev. A) PDF | HTML 2021年 4月 7日
EVM User's guide PGA460PSM-EVM User's Guide 2019年 7月 15日
Application brief Ultrasonic Floor-Type and Cliff Detection on Automated Vacuum Robots 2019年 7月 15日
Application note PGA460 Array of Ultrasonic Transducers for Triangulation and Tracking 2019年 7月 12日
Technical article Paving the way with ultrasonic sensing PDF | HTML 2019年 6月 10日
Application note PGA460 Full-Bridge Driver Solutions for Ultrasonic Transducers (Rev. A) 2019年 2月 28日
Design guide Ultrasonic Proximity-Sensing Module (PSM) Reference Design 2018年 10月 9日
User guide PGA460-Q1 Ultrasonic Signal Conditioner EVM With Transducer User's Guide (Rev. B) 2018年 3月 19日
Application brief PGA460-Q1 in Automotive Ultrasonic Kick-to-open Liftgate Systems (Rev. B) 2018年 1月 3日
Application brief PGA460-Q1 in Ultrasonic Park Assist (UPA) (Rev. A) 2018年 1月 3日
Technical article Where are ultrasonic sensors used? – Part 2 PDF | HTML 2017年 10月 31日
Technical article Comparing capacitive and ultrasonic kick-to-open sensing PDF | HTML 2017年 9月 6日
Application note PGA460 Software Development Guide (Rev. A) 2017年 8月 22日
Technical article Where are ultrasonic sensors used? – Part 1 PDF | HTML 2017年 6月 29日
Application note PGA460 Frequently Asked Questions (FAQ) and EVM Troubleshooting Guide 2017年 5月 1日
User guide PGA460-Q1 EVM Quick Start Guide 2017年 2月 17日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

BOOSTXL-PGA460 — 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組

Fully evaluate the PGA460 ultrasonic sensor signal conditioner with the BOOSTXL-PGA460 (+ MSP430F5529LP). The PGA460 is an integrated ultrasonic front-end with a digital signal processor that outputs time-of-flight data, echo width and amplitude information. The driver strength is configurable by a (...)
使用指南: PDF
開發板

PGA460PSM-EVM — PGA460 超音波近距感測評估模組

For shipments to Europe, please order the equivalent signal conditioning device BOOSTXL-PGA460

The PGA460PSM evaluation module (EVM) is a small-form-factor solution showcasing double-sided printed circuit board (PCB) spacing and the supporting component requirements for the PGA460 ultrasonic (...)

使用指南: PDF
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程式碼範例或展示

SLAC741 PGA460 Energia Library and Code Example (Version 1.1.0)

支援產品和硬體

支援產品和硬體

產品
超音波感測器 AFE
PGA460 超音波訊號處理器與收發驅動器 PGA460-Q1 車用超音波訊號處理器與轉換器驅動器
硬體開發
開發板
BOOSTXL-PGA460 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組 PGA460PSM-EVM PGA460 超音波近距感測評估模組
開發模組 (EVM) 的 GUI

SLAC739 PGA460-Q1 EVM GUI (Version 1.0.2.0)

支援產品和硬體

支援產品和硬體

產品
超音波感測器 AFE
PGA460 超音波訊號處理器與收發驅動器 PGA460-Q1 車用超音波訊號處理器與轉換器驅動器
硬體開發
開發板
BOOSTXL-PGA460 具有轉換器的 PGA460-Q1 超音波感測器訊號調節評估模組 PGA460PSM-EVM PGA460 超音波近距感測評估模組
參考設計

TIDA-01424 — 車用超音波腳踢開啟參考設計

This reference design uses ultrasonic sensing to detect a kicking motion indicating the user's desire to activate a power lift-gate, power trunk, or power sliding door on an automobile.  Ultrasonic sensing allows detection of more than one object, and gives a measure of distance to each (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-01597 — 停車輔助專用的汽車超音波感測模組參考設計

This reference design provides hardware architecture for a Park Assist System (PAS) using three highly integrated, system-on-chip (SoC) ultrasonic transducer drivers. These ultrasonic transducer drivers have an integrated signal conditioner with an advanced digital signal processor (DSP) core. (...)
Design guide: PDF
電路圖: PDF
參考設計

TIDA-060024 — 超音波近距感測模組 (PSM) 參考設計

This reference design is a small-form factor solution showcasing double-sided PCB spacing and minimum supporting component requirements for the PGA460 ultrasonic sensor signal conditioner. This module operates in a mono-static mode for single sensor transmit and receive operation to enable object (...)
Design guide: PDF
電路圖: PDF
封裝 針腳 CAD 符號、佔位空間與 3D 模型
TSSOP (PW) 16 Ultra Librarian

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