產品詳細資料

Technology family HC Function Digital Multiplexer Configuration 4:1 Number of channels 2 Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
Technology family HC Function Digital Multiplexer Configuration 4:1 Number of channels 2 Operating temperature range (°C) -40 to 125 Rating HiRel Enhanced Product
SOIC (D) 16 59.4 mm² 9.9 x 6
  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 3-State Version of ’HC153
  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current Inverting Outputs Drive Up To 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 9 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Permit Multiplexing From n Lines to One Line
  • Perform Parallel-to-Serial Conversion

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

  • Controlled Baseline
    • One Assembly/Test Site, One Fabrication Site
  • Extended Temperature Performance of –40°C to 125°C
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree
  • 3-State Version of ’HC153
  • Wide Operating Voltage Range of 2 V to 6 V
  • High-Current Inverting Outputs Drive Up To 15 LSTTL Loads
  • Low Power Consumption, 80-µA Max ICC
  • Typical tpd = 9 ns
  • ±6-mA Output Drive at 5 V
  • Low Input Current of 1 µA Max
  • Permit Multiplexing From n Lines to One Line
  • Perform Parallel-to-Serial Conversion

Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

Each data selector/multiplexer contains inverters and drivers to supply full binary decoding data selection to the AND-OR gates. Separate output-control inputs are provided for each of the two 4-line sections.

The 3-state outputs can interface with and drive data lines of bus-organized systems. With all but one of the common outputs disabled (in the high-impedance state), the low impedance of the single enabled output drives the bus line to a high or low logic level. Each output has its own output-enable (OE)\ input. The outputs are disabled when their respective OE\ is high.

Each data selector/multiplexer contains inverters and drivers to supply full binary decoding data selection to the AND-OR gates. Separate output-control inputs are provided for each of the two 4-line sections.

The 3-state outputs can interface with and drive data lines of bus-organized systems. With all but one of the common outputs disabled (in the high-impedance state), the low impedance of the single enabled output drives the bus line to a high or low logic level. Each output has its own output-enable (OE)\ input. The outputs are disabled when their respective OE\ is high.

下載 觀看有字幕稿的影片 影片

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 15
類型 標題 日期
* Data sheet SN74HC253-EP datasheet 2004年 1月 6日
* VID SN74HC253-EP VID V6204699 2016年 6月 21日
Application note Implications of Slow or Floating CMOS Inputs (Rev. E) 2021年 7月 26日
Selection guide Logic Guide (Rev. AB) 2017年 6月 12日
Application note Understanding and Interpreting Standard-Logic Data Sheets (Rev. C) 2015年 12月 2日
User guide LOGIC Pocket Data Book (Rev. B) 2007年 1月 16日
Application note Semiconductor Packing Material Electrostatic Discharge (ESD) Protection 2004年 7月 8日
User guide Signal Switch Data Book (Rev. A) 2003年 11月 14日
Application note TI IBIS File Creation, Validation, and Distribution Processes 2002年 8月 29日
Application note CMOS Power Consumption and CPD Calculation (Rev. B) 1997年 6月 1日
Application note Designing With Logic (Rev. C) 1997年 6月 1日
Application note Input and Output Characteristics of Digital Integrated Circuits 1996年 10月 1日
Application note Live Insertion 1996年 10月 1日
Application note SN54/74HCT CMOS Logic Family Applications and Restrictions 1996年 5月 1日
Application note Using High Speed CMOS and Advanced CMOS in Systems With Multiple Vcc 1996年 4月 1日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

封裝 引腳 下載
SOIC (D) 16 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片