開發模組 (EVM) 的 GUI
TAS67524-GUI — TAS67524 PPC3 GUI
TAS67524 PPC3 GUI
TAS67524-Q1
- AEC-Q100 qualified for Automotive applications
- Temperature grade 1: –40°C to +125°C, TA
- General operation
- 4.5V to 19V supply voltage, 40V load dump
- Low latency path reducing group delay by >70% at 48kHz
- Support for 1.8V and 3.3V I/Os
- I2C control with 8 address options
- 1L Modulation
- Requires only one inductor per channel saving four inductors versus a traditional design
- Lower system component cost for inductors
- Smaller PCB footprint
- Audio Performance
- THD+N 0.02% (4Ω, 1W, 1kHz)
- Output noise: 35µVRMS at 14.4V, A-weighting
- Efficiency > 90% at 4×25W, 4Ω, 14.4V
- Output current sensing by channel using I2S or TDM
- No external circuitry needed
- Real-time load diagnostics
- Monitor output conditions while playing audio
- Open Load, Shorted load, Short-to-power, and Short-to-ground detection
- DC and AC Standby load diagnostics
- Audio inputs
- 2-4 channel using I2S or 4-16 channel using TDM
- Input sample rates: 44.1, 48, 96, 192kHz
- Audio outputs
- 4 channel bridge-tied load (BTL), configurable 2 channel parallel-BTL (PBTL)
- 2MHz output switching frequency
- 4×30W (4Ω, 14.4V, 1kHz 10% THD+N)
- 4×50W (2Ω, 14.4V, 1kHz 10% THD+N)
- Advanced spread-spectrum and selectable phase offset
- Protection and Monitoring
- Cycle-by-cycle current limiting
- Output short protection
- Clip detection with configurable thresholds
- Thermal foldback and PVDD foldback
- I2C temperature and supply voltage readout
- Configurable overtemperature warning and individual channel shutdown
- DC offset, undervoltage and overvoltage
The TAS67524-Q1 is a four-channel digital-input Class-D audio amplifier that implements 1L modulation only requiring one inductor per BTL channel reducing system size and cost by removing four inductors compared to a traditional solution. Additionally, 1L modulation lowers switching losses compared to traditional Class-D modulation schemes.
The TAS67524-Q1 integrates DC and AC Load Diagnostics to determine the status of the connected loads. During audio playback this status can be monitored through output current sense which is available for each channel and reports the measurement to a host processor through TDM with minimal delay. The device monitors the output load condition while playing audio through real-time load diagnostics independent of the host and audio input.
The TAS67524-Q1 device features an additionala low latency signal path for each channel, providing up to 70% faster signal processing at 48kHz which enables time-sensitive Active Noise Cancellation (ANC), Road Noise Cancellation (RNC) applications.
The device supports global temperature, channel temperature and PVDD values using I2C readout for easy system level thermal management.
The device is offered in a 56 pin HSSOP package with the exposed thermal pad up.
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| 重要文件 | 類型 | 標題 | 格式選項 | 日期 |
|---|---|---|---|---|
| * | Data sheet | TAS67524-Q1 1L Modulation, 50 W, 2MHz Digital Input 4 -Channel Automotive Class-D Audio Amplifier with Current Sense and Real-time Load Diagnostics datasheet | PDF | HTML | 2025年 11月 25日 |
| Technical article | 利用 D 類放大器 1L 調變技術，縮減汽車音訊系統設計尺寸 (Rev. B) | PDF | HTML | 2026年 1月 21日 | |
| Application note | Using TI Audio Amplifiers in Automotive Seat Shaker Applications | PDF | HTML | 2026年 1月 5日 | |
| White paper | TSN in Automotive Zone Architectures: Enabling Ethernet Ring Architectures and AVB-Distributed Audio | PDF | HTML | 2025年 10月 16日 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
開發板
TAS67524Q1EVM — TAS67524-Q1 評估模組
TAS67524Q1EVM 展示了 TAS67524-Q1 具有 1L 調變功能的四通道、數位輸入閉合迴路 D 類車用音訊放大器，可在每通道減少 1 個電感器，並可為四通道減少 50% 的電感器成本。EVM 在編程和 I2C 配置中使用 PurePath™ Console (PPC3) 圖形使用者介面，以評估 TAS67524-Q1 裝置的特性、功能和性能。
支援軟體
TAS67524-Q1-DESIGN — TAS67524-Q1 Technical Documentation
TAS67524-Q1 Technical Documentation
支援產品和硬體
模擬工具
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PSpice for TI 設計和模擬環境可讓您使用其內建函式庫來模擬複雜的混合訊號設計。在進行佈局和製造之前，建立完整的終端設備設計和解決方案原型，進而縮短上市時間並降低開發成本。
在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| HSSOP (DKQ) | 56 | Ultra Librarian |
訂購與品質
內含資訊：
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中的可靠性監測
內含資訊：
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。