現在提供此產品的更新版本
功能相同，但針腳輸出與所比較的裝置不同。
TLV3501A-Q1
- Qualified for Automotive Applications
- AEC-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to
+125°C Ambient Operating Temperature Range - Device HBM Classification Level 2
- Device CDM Classification Level C4B
- Device Temperature Grade 1: –40°C to
- High Speed: 4.5 ns
- Rail-To-Rail I/O
- Supply Voltage: 2.7 V to 5.5 V
- Push-Pull CMOS Output Stage
- Shutdown
- Micro Package: SOT23-6
- Low Supply Current: 3.2 mA
- Z-Suffix Offers Improved Delamination
- APPLICATIONS
- HEV/EV and Powertrain Applications
- DC-DC Converter
- Inverter
- Fuel Sensing
- Hybrid Power Control Unit
- Automatic Test Equipment
- Threshold Detector
- Zero-Crossing Detector
- Window Comparator
All other trademarks are the property of their respective owners
The TLV3501A-Q1 push-pull output comparator features a fast 4.5-ns propagation delay and operation from 2.7 V to 5.5 V. The input voltage supports a common-mode range that goes beyond the rails which makes the device an ideal choice for low-voltage applications. The rail-to-rail output directly drives either CMOS or TTL logic. The fast delay and wide common-mode range also makes TLV3501A-Q1 device ideal for EMI reduction through frequency dithering by lowering the EMI peaks. These parameters allow the device to be ideal for both DC-DC converter and inverter applications in HEV/EV and powertrain.
The SOT23-6 microsized package provides options for portable and space-restricted applications. The Z-suffix offers reduced delamination compared to the standard device.
技術文件
| 重要文件 | 類型 | 標題 | 格式選項 | 下載最新的英文版本 | 日期 | |
|---|---|---|---|---|---|---|
| * | 資料表 | TLV3501A-Q1 4.5-ns Rail-to-Rail, High-Speed Comparator in Microsize Packages datasheet (Rev. B) | PDF | HTML | 2015/10/15 | ||
| 電子書 | The Signal e-book: A compendium of blog posts on op amp design topics | PDF | HTML | 2017/3/28 |
設計與開發
如需其他條款或必要資源，請按一下下方的任何標題以檢視詳細頁面 (如有)。
AMP-PDK-EVM — 放大器性能開發套件評估模組
放大器性能開發套件 (PDK) 是一款評估模組 (EVM) 套件，可測試通用運算放大器 (op amp) 參數，並與大多數運算放大器和比較器相容。EVM 套件提供主板和多個插槽式子卡選項，可滿足封裝需求，使工程師能夠快速評估和驗證裝置性能。
AMP-PDK-EVM 套件支援五種最熱門的業界標準封裝，包括：
- D (SOIC-8 和 SOIC-14)
- PW (TSSOP-14)
- DGK (VSSOP-8)
- DBV (SOT23-5 和 SOT23-6)
- DCK (SC70-5 和 SC70-6)
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| SOT-23 (DBV) | 6 | Ultra Librarian |
訂購與品質
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。