產品詳細資料

Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 9.5 CON (typ) (pF) 20 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 300 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (max) (mA) 10 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
Configuration 1:1 SPST Number of channels 4 Power supply voltage - single (V) 12, 16, 20, 36, 44 Power supply voltage - dual (V) +/-10, +/-15, +/-18, +/-22, +/-5 Protocols Analog Ron (typ) (Ω) 9.5 CON (typ) (pF) 20 ON-state leakage current (max) (µA) 0.025 Supply current (typ) (µA) 300 Bandwidth (MHz) 500 Operating temperature range (°C) -40 to 125 Features 1.8-V compatible control inputs, Break-before-make, Fail-safe logic, Overvoltage protection Input/output continuous current (max) (mA) 10 Rating Catalog Drain supply voltage (max) (V) 44 Supply voltage (max) (V) 44 Negative rail supply voltage (max) (V) -44
WQFN (RRP) 16 16 mm² 4 x 4
  • Wide supply voltage range:
    • Single supply: 8 V to 44 V
    • Dual supply: ±5 V to ±22 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Interrupt flags to indicate fault status
    • Output open circuited during fault
  • Latch-up immunity by device construction
  • Human Body Model (HBM) ESD rating: 6-kV
  • Low on-resistance: 8.3 Ω typical
  • Flat on-resistance: 10 mΩ typical
  • Logic capable: 1.8-V
  • Fail-safe logic: up to 44 V independent of supply
  • Industry-standard TSSOP and smaller WQFN packages
  • Wide supply voltage range:
    • Single supply: 8 V to 44 V
    • Dual supply: ±5 V to ±22 V
  • Integrated fault protection:
    • Overvoltage protection, source to supplies or source to drain: ±85 V
    • Overvoltage protection: ±60 V
    • Powered-off protection: ±60 V
    • Interrupt flags to indicate fault status
    • Output open circuited during fault
  • Latch-up immunity by device construction
  • Human Body Model (HBM) ESD rating: 6-kV
  • Low on-resistance: 8.3 Ω typical
  • Flat on-resistance: 10 mΩ typical
  • Logic capable: 1.8-V
  • Fail-safe logic: up to 44 V independent of supply
  • Industry-standard TSSOP and smaller WQFN packages

The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5  V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.

The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of the switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.

The TMUX7411F, TMUX7412F, and TMUX7413F are complementary metal-oxide semiconductor (CMOS) analog switches in 1:1 (SPST), 4-channel configurations. The devices work well with dual supplies (±5 V to ±22 V), a single supply (8 V to 44 V), or asymmetric supplies (such as VDD = 12 V, VSS = –5  V). The overvoltage protection is available in powered and powered-off conditions, making the TMUX741xF devices suitable for applications where power supply sequencing cannot be precisely controlled.

The devices block fault voltages up to +60 V or −60 V relative to ground in powered and powered-off conditions. When no power supplies are present, the switch channels remain in the OFF state regardless of the switch input conditions, and any control signal present on the logic pins is ignored. If the signal path input voltage on any Sx pin exceeds the supply voltage (VDD or VSS) by a threshold voltage (VT), the channel turns OFF and the Sx pin becomes high impedance. The drain pin (Dx) of a selected channel under a fault condition is floating. The TMUX741xF devices provide an active-low interrupt flag (FF) to indicate if any of the source inputs are experiencing a fault condition to help system diagnostics.

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類型 標題 日期
* Data sheet TMUX741xF ±60 V Fault-Protected, 1:1 (SPST), 4-Channel Switches With Latch-Up Immunity and 1.8-V Logic datasheet (Rev. B) PDF | HTML 2022年 11月 1日
Application note Protecting and Maintaining Signal Integrity in PLC Systems PDF | HTML 2024年 12月 22日
Application note Improving Analog Input Modules Reliability Using Fault Protected Multiplexers PDF | HTML 2021年 9月 28日

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開發板

TMUX741-746EVM — 適用於 PW 和 RRP 封裝的 TMUX741xF 和 TMUX7462F 評估模組

TMUX741-746EVM 支援評估採用 TSSOP (PW) 和 WQFN (RRP) 封裝的 TMUX741xF 和 TMUX746xF 裝置系列。此評估模組 (EVM) 可用於 TMUX741xF 和 TMUX746xF 裝置系列進行快速原型設計和測試,以進行 DC 參數評估。

使用指南: PDF | HTML
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介面轉接器

LEADED-ADAPTER1 — 適用於快速測試 TI 的 5、8、10、16 及 24 針腳引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADED1 board allows for quick testing and bread boarding of TI's common leaded packages.  The board has footprints to convert TI's D, DBQ, DCT,DCU, DDF, DGS, DGV, and PW surface mount packages to 100mil DIP headers.     

使用指南: PDF
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介面轉接器

LEADLESS-ADAPTER1 — 用於測試 TI 的 6、8、10、12、14、16 和 20 針腳無引線封裝的表面貼裝至 DIP 接頭適配器

The EVM-LEADLESS1 board allows for quick testing and bread boarding of TI's common leadless packages.  The board has footprints to convert TI's DRC, DTP, DQE, RBW, RGY, RSE, RSV, RSW RTE, RTJ, RUK , RUC, RUG, RUM,RUT and YZP surface mount packages to 100mil DIP headers.
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模擬型號

TMUX7413F IBIS Model

SCDM294.ZIP (31 KB) - IBIS Model
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WQFN (RRP) 16 檢視選項

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