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通用型音訊放大器

TPA741

現行

具有整合式 depop 電路的 700-mW、單聲道、類比輸入、AB 類音訊放大器

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產品規格表

TPA741

現行
產品規格表 立即訂購

產品詳細資料

Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.7 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.5 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
Audio input type Analog Input Architecture Class-AB Speaker channels (max) Mono Control interface Hardware Output power (W) 0.7 Power stage supply (max) (V) 5.5 Power stage supply (min) (V) 2.5 THD + N at 1 kHz (%) 0.5 Load (min) (Ω) 8 Analog supply voltage (min) (V) 2.5 Analog supply voltage (max) (V) 5.5 Rating Catalog Operating temperature range (°C) -40 to 85
SOIC (D) 8 29.4 mm² (4.9 mm × 6 mm) HVSSOP (DGN) 8 14.7 mm² (3 mm × 4.9 mm)
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
    • SOIC
    • PowerPAD™ MSOP
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.
  • Fully Specified for 3.3-V and 5-V Operation
  • Wide Power Supply Compatibility 2.5 V – 5.5 V
  • Output Power for RL = 8
    • 700 mW at VDD = 5 V
    • 250 mW at VDD = 3.3 V
    • SOIC
    • PowerPAD™ MSOP
  • Integrated Depop Circuitry
  • Thermal and Short-Circuit Protection
  • Surface-Mount Packaging
    • SOIC
    • PowerPAD™ MSOP

PowerPAD is a trademark of Texas Instruments.

The TPA741 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA741 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 µA during shutdown. The TPA741 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD™ MSOP, which reduces board space by 50% and height by 40%.

The TPA741 is a bridge-tied load (BTL) audio power amplifier developed especially for low-voltage applications where internal speakers are required. Operating with a 3.3-V supply, the TPA741 can deliver 250-mW of continuous power into a BTL 8- load at less than 0.6% THD+N throughout voice band frequencies. Although this device is characterized out to 20 kHz, its operation is optimized for narrower band applications such as wireless communications. The BTL configuration eliminates the need for external coupling capacitors on the output in most applications, which is particularly important for small battery-powered equipment. This device features a shutdown mode for power-sensitive applications with a supply current of 7 µA during shutdown. The TPA741 is available in an 8-pin SOIC surface-mount package and the surface-mount PowerPAD™ MSOP, which reduces board space by 50% and height by 40%.
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* 資料表 TPA741: 700-mW Mono Low-Voltage Audio Power Amplifier w/Differential Inputs datasheet (Rev. C) 2004/6/30

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