首頁 介面 USB IC USB 轉接驅動器與多工器

TS3USB221A

現行

具單啓用和 ESD 保護的高速 USB 2.0 1:2 多工器/解多工器開關

產品詳細資料

Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 30 ESD HBM (typ) (kV) 7 Bandwidth (MHz) 900
Type Passive mux Function USB 2.0 USB speed (MBits) 480 Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 2.3 Ron (typ) (mΩ) 3000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 5.5 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 2.0 Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 30 ESD HBM (typ) (kV) 7 Bandwidth (MHz) 900
UQFN (RSE) 10 3 mm² 2 x 1.5
  • VCC Operation at 2.5 V to 3.3 V
  • VI/O Accepts Signals Up to 5.5 V
  • 1.8-V Compatible Control-Pin Inputs
  • Low-Power Mode When OE Is Disabled (1 μA)
  • RON = 6 Ω Maximum
  • ΔRON = 0.2 Ω Typical
  • Cio(on) = 6 pF Typical
  • Low Power Consumption (30 μA Maximum)
  • High Bandwidth (900 MHz Typical)
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 7000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O to GND
    • 12-kV Human-Body Model
  • VCC Operation at 2.5 V to 3.3 V
  • VI/O Accepts Signals Up to 5.5 V
  • 1.8-V Compatible Control-Pin Inputs
  • Low-Power Mode When OE Is Disabled (1 μA)
  • RON = 6 Ω Maximum
  • ΔRON = 0.2 Ω Typical
  • Cio(on) = 6 pF Typical
  • Low Power Consumption (30 μA Maximum)
  • High Bandwidth (900 MHz Typical)
  • Latch-Up Performance Exceeds 100 mA
    Per JESD 78, Class II
  • ESD Performance Tested Per JESD 22
    • 7000-V Human-Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • ESD Performance I/O to GND
    • 12-kV Human-Body Model

The TS3USB221A device is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The device also has a low power mode that will reduce the power consumtion to 1 μA for portible applications with a battery or limited power budget. The device is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221A device integrates ESD protection cells on all pins, is available in a tiny μQFN package (2 mm × 1.5 mm) and is characterized over the free air temperature range from –40°C to 85°C.

The TS3USB221A device is a high-bandwidth switch specially designed for the switching of high-speed USB 2.0 signals in handset and consumer applications, such as cell phones, digital cameras, and notebooks with hubs or controllers with limited USB I/Os. The wide bandwidth (900 MHz) of this switch allows signals to pass with minimum edge and phase distortion. The device multiplexes differential outputs from a USB host device to one of two corresponding outputs. The switch is bidirectional and offers little or no attenuation of the high-speed signals at the outputs. The device also has a low power mode that will reduce the power consumtion to 1 μA for portible applications with a battery or limited power budget. The device is designed for low bit-to-bit skew and high channel-to-channel noise isolation, and is compatible with various standards, such as high-speed USB 2.0 (480 Mbps).

The TS3USB221A device integrates ESD protection cells on all pins, is available in a tiny μQFN package (2 mm × 1.5 mm) and is characterized over the free air temperature range from –40°C to 85°C.

下載 觀看有字幕稿的影片 影片

您可能會感興趣的類似產品

open-in-new 比較替代產品
引腳對引腳的功能與所比較的產品相同
TS3USB3000 現行 DPDT USB 2.0 高速與行動高畫質連接 (MHL) (6.1GHz) 開關 higher bandwidth device and pin to pin with TS3USB221RSE

技術文件

star =TI 所選的此產品重要文件
找不到結果。請清除您的搜尋條件,然後再試一次。
檢視所有 4
類型 標題 日期
* Data sheet TS3USB221A ESD Protected, High-Speed USB 2.0 (480-Mbps) 1:2 Multiplexer and Demu datasheet (Rev. A) 2015年 2月 5日
Application note Passive Mux Selection Based On Bandwidth > Ron 2019年 9月 11日
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 2018年 6月 14日
White paper Selecting signal switches to enable IoT communication modules 2017年 3月 20日

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

開發板

TS3USB221EEVM — TS3USB221E 評估模組

The TS3USB221EEVM is an evaluation module for the Texas Instruments high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The USB221EEVM allows signals to pass with minimum edge and phase distortion, integrates IEC-level ESD protection cells on all pins, and also multiplexes (...)

使用指南: PDF
TI.com 無法提供
開發板

TS3USB221EVM — TS3USB221 評估模組

The TS3USB221EVM is an evaluation module for the Texas Instruments high-speed USB 2.0 (480-Mbps) 1:2 multiplexer/demultiplexer switch. The USB221EVM allows signals to pass with minimum edge and phase distortion and also multiplexes differential signals from a common USB input to one of two (...)

使用指南: PDF
TI.com 無法提供
模擬工具

PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具

PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
模擬工具

TINA-TI — 基於 SPICE 的類比模擬程式

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
使用指南: PDF
封裝 引腳 下載
UQFN (RSE) 10 檢視選項

訂購與品質

內含資訊:
  • RoHS
  • REACH
  • 產品標記
  • 鉛塗層/球物料
  • MSL 等級/回焊峰值
  • MTBF/FIT 估算值
  • 材料內容
  • 資格摘要
  • 進行中可靠性監測
內含資訊:
  • 晶圓廠位置
  • 組裝地點

建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。

支援與培訓

內含 TI 工程師技術支援的 TI E2E™ 論壇

內容係由 TI 和社群貢獻者依「現狀」提供,且不構成 TI 規範。檢視使用條款

若有關於品質、封裝或訂購 TI 產品的問題,請參閱 TI 支援。​​​​​​​​​​​​​​

影片