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最新 CC3301MOD 現行 SimpleLink™ Wi-Fi 6 和 Bluetooth® 低功耗配套模組 Certified modules with upgraded functionality of Wi-Fi 6 and Bluetooth Low Energy for cost-optimized applications

產品詳細資料

CPU External MPU Type Transceiver Technology Wi-Fi Protocols Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Features 802.11bgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 105
CPU External MPU Type Transceiver Technology Wi-Fi Protocols Wi-Fi 2.4 GHz Operating system Linux Throughput UDP (max) (Mbps) 100 Features 802.11bgn, AP, Mesh over Wi-Fi based on 802.11s, STA, Wi-Fi direct mode Edge AI enabled No Security Secure communication Rating Catalog Operating temperature range (°C) -40 to 105
DSBGA (YFV) 130 22.87520000000000493 mm² (— mm × — mm)
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence
  • General
    • Packaged in wafer scale package (WSP) for small PCB footprint
    • Provides efficient direct connection to battery by employing several integrated switched mode power supplies (DC2DC)
    • Seamless integration with TI Sitara and other application processors
    • Operating temperature: -40°C to +85°C
    • 105°C Extended temperature range is supported only in defined use-case profile
  • Wi-Fi
    • Baseband processor and RF Transceiver with support for IEEE 802.11b/g/n
    • Integrated 2.4G-Hz PA for complete WLAN solution
    • Medium access controller
      • Hardware-based encryption and decryption using 64-, 128-, and 256-bit WEP, TKIP, or AES keys
      • Support Wi-Fi Protected Access (WPA, WPA2, WPA3)and IEEE 802.11i
    • IEEE Std 802.11d,e,h,i,k,r PICS Compliant
    • 802.11v support for high-precision timing and location approximation
    • Supports 4 bit SDIO host interface, including High Speed (H3) and V3 modes
  • Bluetooth and Bluetooth Low Energy (WL1831 only)
    • Bluetooth 5.1 secure connection compliant and CSA2 support (Declaration ID: D032799)
    • Host controller interface (HCI) transport for Bluetooth over UART
    • Dedicated audio processor support for SBC encoding and A2DP
    • Dual-mode Bluetooth and Bluetooth Low Energy
    • TI’s Bluetooth and Bluetooth Low Energy certified stack
  • Key Benefits
    • Differentiated use cases by configuring WiLink 8 simultaneously in two roles (STA and AP) to connect directly with other Wi-Fi devices on different RF channels (Wi-Fi networks)
    • Different provisioning methods for in-home devices - connect to Wi-Fi in one step
    • Low Wi-Fi power consumption in connected idle (<800 µA)
    • Configurable wake-on-WLAN filters to only wake up the system
    • Wi-Fi and Bluetooth single antenna coexistence

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

The WiLink™ 8 WL18x1 is a highly integrated single-chip WLAN, Bluetooth, and Bluetooth Low Energy device that forms a complete stand-alone communication system.

The device is the 8th-generation connectivity combo chip from Texas Instruments. As such, the WL18x1 is based upon proven technology and complements the TI integrated devices for connectivity portfolio. This device is ideal for use in mobile devices, mobile computer and catalog embedded device applications due to its low current, small area and coexistence-friendly features. TI offers drivers for high-level operating systems such as Linux and Android™. Additional drivers, such as WinCE and RTOS, which includes QNX, Nucleus, ThreadX, and FreeRTOS are supported through third parties.

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CC3300 現行 SimpleLink™ Wi-Fi 6 配套 IC Upgraded functionality with Wi-Fi® 6 for cost-optimized applications

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重要文件 類型 標題 格式選項 下載最新的英文版本 日期
* 資料表 WL18x1 WiLink™ 8 Single-Band Combo Device Supporting Wi-Fi® , Bluetooth® , and Bluetooth® Low Energy datasheet PDF | HTML 2021/5/14
使用指南 WiLink8 Getting Started Guide (Rev. B) PDF | HTML 2021/12/20
網路安全諮詢 Bluetooth® Low Energy, Basic/Enhanced Data Rate–PIN-Code Pairing Key Derivation 2021/5/27
網路安全諮詢 FragAttacks - FRagmentation and AGgregation Attacks (Rev. A) 2021/5/19

設計與開發

如需其他條款或必要資源,請按一下下方的任何標題以檢視詳細頁面 (如有)。

軟體開發套件 (SDK)

PROCESSOR-SDK-AM335X — 適用於 AM335x Sitara 處理器的處理器 SDK - 支援 Linux 和 TI-RTOS

Processor SDK (Software Development Kit) is a unified software platform for TI embedded processors providing easy setup and fast out-of-the-box access to benchmarks and demos.  All releases of Processor SDK are consistent across TI’s broad portfolio, allowing developers to seamlessly (...)

支援產品和硬體
應用軟體及架構

WILINK-BT_WIFI-WIRELESS_TOOLS — 適用於 WL18XX 模組的 WiLink™ 無線工具

此套件包括以下應用程式:

  • WLAN 即時調整工具 (RTTT)
  • Bluetooth® 記錄器
  • WLAN gLogger
  • 連結品質監測器 (LQM)
  • HCITester 工具
    • BTSout
    • BTSTransform
    • ScriptPad

應用程式提供使用主機偵錯及監控 WiLink™ WLAN/Bluetooth/Bluetooth 低功耗韌體、執行 RF 驗證測試、執行法規認證測試的預先測試,以及偵錯硬體與軟體平台整合問題時所需的所有功能。

WLAN 和 Bluetooth 的無線偵錯和校準工具需要四個 UART 連接埠。將這些連接埠驅動至 PC 的最有效方式是使用 UART 至 USB 轉換器。TI 建議使用 (...)

lock = 需要匯出核准 (1 分鐘)
支援產品和硬體
應用軟體及架構

WILINK-WIFI_MESH_VISUALIZATION_TOOL — 適用於 WL18XX 模組的 WiLink™ Mesh 視覺化工具

Wireless Mesh Explorer is a Microsoft® Windows® based software tool for exploring and displaying mesh networks based on the Texas Instruments WiLink8.0 chipset.
lock = 需要匯出核准 (1 分鐘)
支援產品和硬體
驅動程式或資料庫

WILINK8-WIFI-NLCP — WiLink8 NLCP Wi-Fi driver package for Linux OS

WiLink™ 8 NLCP 套件包含用於更新 WiLink™ 8 Linux 驅動程式、韌體二進位、wpa supplicant、hostapd 等的建置指令碼。更多詳細信息請參閱版本說明和使用指南

軟體區塊概覽:

WL18xx Linux 驅動程式使用開源元件以及裝置的介面驅動程式來實現 Wi-Fi 功能。下方列出了幾個 NLCP 驅動程式套件元件:

  • WiLink 8 FW:FW 在裝置硬體上執行,以提供 Wi-Fi 的 PHY 和 MAC 功能。主機透過 SDIO 與 WLAN 裝置通訊。在裝置端,WLAN MAC 負責 802.11 MAC 功能,並在外部主機和韌體之間傳輸 WLAN (...)
支援產品和硬體
設計工具

3P-WIRELESS-MODULES — 第三方無線模組搜尋工具

第三方無線模組搜尋工具協助開發人員識別符合其終端設備規格的產品,並採購可投入生產的無線模組。搜尋工具中包含的第三方模組供應商是獨立的第三方公司,擁有使用 TI 無線連接產品設計與製造無線模組的專業知識。

支援產品和硬體
封裝 針腳 CAD 符號、佔位空間與 3D 模型
DSBGA (YFV) 130 Ultra Librarian

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