Qualification summary FAQs
What is TI’s position on semiconductor product qualification?
Quality and reliability are built into TI’s culture, with the goal of providing customers high quality products. TI’s semiconductor technologies are developed with a minimum goal of fewer than 50 Failures in Time (FIT) at 100,000 Power-On-Hours at 105C junction temperature. TI builds simulations, accelerated testing, and robustness evaluations into the product development process. During the product development process, TI carefully assesses silicon process reliability, package reliability, and silicon/package interaction.
What qualification standards does TI follow for non-automotive semiconductor products?
Non-Automotive devices are qualified with industry standard test methodologies performed primarily to the intent of the Joint Electron Devices Engineering Council (JEDEC). TI qualifies new devices, significant changes, and product families based on JEDEC standard JESD47. TI evaluates manufacturability of devices to verify a robust silicon and assembly flow to enable continuity of supply to customer.
What qualification standards does TI follow for automotive semiconductor products?
Automotive devices are qualified with industry standard test methodologies performed primarily to the intent of the Automotive Electronics Council (AEC) Q100 standard. AEC Q100 is an automotive industry standard that specifies the recommended new product and major change qualification requirements and procedures. See the Automotive Qualification section below for additional information about parts meeting the AEC-Q100 standard.
How is an AEC-Q100 qualified automotive product different from a commercial product?
The Q100 product is qualified based on the temperature grade. The stressing for Q100 product is pre and post tested at room and hot temperature per the grade pre and post reliability stress. The commercial product is only tested at room temperature post reliability stress.
How does temperature Grade impact the qualification and use requirements of an automotive product?
Grade 0 (-40 to 150°C), Grade 1(-40 to 125°C), Grade 2 (-40 to 105°C), and Grade 3 (-40 to 85°C) have different stress conditions. Depending on where the product is used in the automotive application will generally dictate the grade. For example, if the application is under the hood, Grade 0 will be used to withstand very high temperature environment. The qualification requirements are more stringent based on the grade of the device.
Where can I find qualification summaries for TI products?
Qualification Summaries for TI Products can be found on TI.com. Please see the TI Qualification Summary Tool for further information.
Why is High Temperature Operating Life (HTOL) Test performed on TI products?
HTOL is performed to determine the reliability of devices under operation at high temperature conditions over an extended period of time. The parts are subjected to a specified electrical bias for a specified amount of time temperature.
What does it mean if my device meets 2KV Human Body Model ESD testing?
The rating provides attenuation to prevent damage to the device during an ESD transient (2KV) during normal handling during manufacturing where IC’s are handled.
When qualification testing is performed on wafer level chip scale packages (WCSP) or Ball grid Array packages (BGA), are the components assembled on a PWB (printed wiring board)?
Components may be assembled on a printed wiring board (PWB) for stress testing.
Why preconditioning is performed prior to certain stresses and how is the preconditioning soak condition determined?
This stress is done to assess the ability of a device to withstand the thermal stress of the soldering process by simulating board mounting. The soak condition is determined by JEDEC which specifies performing Moisture Reflow Sensitivity Classification per IPC/JEDEC J-STD-020.
Is it true that products meeting AEC Q100 achieve zero defects?
The AEC Council has guidelines on the use of the tools and methods to use to reduce defects with the ultimate goal of zero defects. Some examples are DFMEA (Design Failure Modes and Effects Analysis), PFMEA (Process Failure Modes and Effects Analysis), and SPC (Statistical Process Control). TI incorporates these defect reduction systems in our design and manufacturing processes.
What does IATF 16949 specification mean and is Texas Instruments (TI) certified to that standard?
It is a global Quality Management System Standard for the Automotive industry. Texas Instruments manufacturing sites are certified to IATF 16949. View TI certifications here.
What is AEC- Q006?
AEC-Q006 is the Automotive Electronics Council qualification standard that specifies requirements for components using copper (Cu) wire interconnections in automotive products.
Are TI products compliant to the latest Q100 specification?
TI devices are qualified to the current version of AEC Q100 at the time the device was released. AEC documents can be found at http://www.aecouncil.com/
Why do I see different ESD-HBM and ESD-CDM ratings for different TI products?
Products are tested at multiple voltages levels for HBM and CDM. Individual device sensitivities such as feature sizes and die size may affect passing voltage level. The HBM classification table is in ANSI/ESDA/JEDEC JS-001-2017 and CDM levels per JESD22-C101 in JEDEC.
I see the data sheet of a competitor has higher ESD, why is TI not as high?
TI follows the JEDEC ESD standards for testing. The TI part may have been tested to the same voltage as the competitor, but the TI datasheet specified a lower voltage for margin. This assures the part meets that level over time. The Industry standard minimum component levels for HBM (1KV) and CDM (250V) are considered a safe target for manufacturing and handling of today’s products using basic ESD control methods.
Please refer to following ESD council articles on safe ESD levels.
I noticed in qualification reports there is Autoclave and some reports have unbiased HAST. Are they interchangeable as the conditions are different? The same question pertains to Temperature Humidity Bias (THB) and HAST as the stress times and conditions are different.
Per JEDEC, either Autoclave or unbiased HAST may be run. Autoclave is not recommended for Ball Grid Array (BGA) and Wafer Chip Scale (WCSP) devices. Either HAST (Highly Accelerated Stress Test) or THB stress may be run per JEDEC. THB is recommended for BGA with substrates. HAST may be used to accelerate the THB condition.