Home
Design & development
Reference designs

TIDA-060045

Accurate low-latency linear position sense reference design with quad 3D Hall-effect sensors

Design files

TIDA-060045

Design files

Overview

This reference design demonstrates precision, low-latency linear position sensing of a N45 magnet target using single or multiple equidistant placed 3D Hall-effect sensors TMAG5170 with high-speed 10MHz SPI interface, where the Z-axis and X-axis magnetic field strength as well as CRC data are transmitted in a single 32-bit frame for low latency and enhanced data integrity. The digital interface with 3.3V I/O is compatible to the C2000™ MCU Launchpad and enables evaluation of our 3D Hall-effect sensing technology with a C2000™, Sitara or other MCUs.

Features
  • Single-chip 3D Hall-effect sensor with integrated ADC and SPI interface reduce BOM and PCB size.
  • Linear position accuracy typically ±0.15mm over 100mm range using quad 3D Hall-effect sensors help achieve more precise linear position sensing systems.
  • 3D Hall-effect sensors with configurable sensitivity ±25mT to ±100mT and ±75mT to ±300mT help adjust measurement range for better accuracy.
  • Sample rates up to 8kHz, low latency of 57.5us and 10MHz SPI enable higher speed position control.
  • Dedicated ALERT pin enables simultaneous start-of-conversion of X,Y,Z axis across multiple 3D Hall-effect sensors.
  • 3D Hall-effect sensors diagnostics features help detect and report both system and device-level failures and simplify design for functional safety.
Download View video with transcript Video

Design files & products

Design files

Download ready-to-use system files to speed your design process.

download Design guide — TIDA-060045
PDF | HTML
TIDUF78.PDF (2550 KB)

Reference design overview and verified performance test data

download Assembly drawing — TIDA-060045
TIDMCX3.PDF (196 KB)

Detailed overview of design layout for component placement

download Bill of materials (BOM) — TIDA-060045
TIDMCX2.PDF (153 KB)

Complete listing of design components, reference designators, and manufacturers/part numbers

download CAD/CAE symbol — TIDA-060045
TIDMCX5.ZIP (1450 KB)

Files used for 3D models or 2D drawings of IC components

download Gerber file — TIDA-060045
TIDCGP0.ZIP (529 KB)

Design file that contains information on physical board layer of design PCB

download PCB layout — TIDA-060045
TIDMCX4.PDF (680 KB)

PCB layer plot file used for generating PCB design layout

download Schematic — TIDA-060045
TIDMCX1.PDF (271 KB)

Detailed schematic diagram for design layout and components

Products

Includes TI products in the design and potential alternatives.

Multi-axis linear & angle position sensors

TMAG5273 — Low-power linear 3D Hall-effect sensor with I²C interface

Data sheet: PDF | HTML
Multi-axis linear & angle position sensors

TMAG5170 — High-precision linear 3D Hall-effect sensor with serial peripheral interface

Data sheet: PDF | HTML

Start development

Hardware development

Evaluation board

LAUNCHXL-F280049C — F280049C LaunchPad™ development kit C2000™ Piccolo™ MCU

This reference design demonstrates precision, low-latency linear position sensing of a N45 magnet target using single or multiple equidistant placed 3D Hall-effect sensors TMAG5170 with high-speed 10MHz SPI interface, where the Z-axis and X-axis magnetic field strength as well as CRC data are (...)
Supported products & hardware

Supported products & hardware

Hardware development
Reference design
TIDA-010232 — AFE for insulation monitoring in high-voltage EV charging and solar energy reference design TIDA-060045 — Accurate low-latency linear position sense reference design with quad 3D Hall-effect sensors TIDM-02006 — Distributed multi-axis servo drive over fast serial interface (FSI) reference design TIDM-02007 — Dual-axis motor drive using fast current loop (FCL) and SFRA on a single MCU reference design TIDM-02011 — Live firmware update reference design with C2000™ real-time MCUs TIDM-DC-DC-BUCK — Digitally Controlled Non-Isolated DC/DC Buck Converter Reference Design
Daughter card
BOOSTXL-BUCKCONV — Digital Power Buck Converter BoosterPack
Evaluation board
DRV8351EVM — DRV8351 evaluation module DRV8363-Q1EVM — DRV8363-Q1 evaluation module DRV8376EVM — DRV8376 evaluation module
In stock
Limit:
Out of stock on TI.com
Not available on TI.com

LAUNCHXL-F280049C — F280049C LaunchPad™ development kit C2000™ Piccolo™ MCU

close
Latest version
Version: null
Release date:
open-in-new

View all versions

Hardware development
Reference design
TIDA-010232 — AFE for insulation monitoring in high-voltage EV charging and solar energy reference design TIDA-060045 — Accurate low-latency linear position sense reference design with quad 3D Hall-effect sensors TIDM-02006 — Distributed multi-axis servo drive over fast serial interface (FSI) reference design TIDM-02007 — Dual-axis motor drive using fast current loop (FCL) and SFRA on a single MCU reference design TIDM-02011 — Live firmware update reference design with C2000™ real-time MCUs TIDM-DC-DC-BUCK — Digitally Controlled Non-Isolated DC/DC Buck Converter Reference Design
Daughter card
BOOSTXL-BUCKCONV — Digital Power Buck Converter BoosterPack
Evaluation board
DRV8351EVM — DRV8351 evaluation module DRV8363-Q1EVM — DRV8363-Q1 evaluation module DRV8376EVM — DRV8376 evaluation module
TI’s Standard Terms and Conditions for Evaluation Items apply.

Technical documentation

star
= Top documentation selected by TI
No results found. Please clear your search and try again.
View all 2
Top documentation Type Title Format options Date
* Design guide Accurate Low Latency Linear Position Sense Reference Design With Quad 3-D Hall-Effect Sensors PDF | HTML May 9, 2024
Certificate TIDA-060045 EU Declaration of Conformity (DoC) PDF | HTML Apr 9, 2024

Related design resources

Software development

CODE EXAMPLE OR DEMO
TMAG5170-CODE-EXAMPLE — TMAG5170 and TMAG5170-Q1 C code example
SOFTWARE DEVELOPMENT KIT (SDK)
C2000WARE — C2000Ware for C2000 MCUs

Design tools & simulation

SIMULATION TOOL
TI-MAGNETIC-SENSE-SIMULATOR — Magnetic simulation software that includes mechanical motion and sensor output

Support & training

TI E2E™ forums with technical support from TI engineers

View all forum topics

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support.

Disclaimer
See the important notice and disclaimer covering reference designs and other TI resources.