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TIDA-060045

Accurate low-latency linear position sense reference design with quad 3D Hall-effect sensors

TIDA-060045

Design files

Overview

This reference design demonstrates precision, low-latency linear position sensing of a N45 magnet target using single or multiple equidistant placed 3D Hall-effect sensors TMAG5170 with high-speed 10MHz SPI interface, where the Z-axis and X-axis magnetic field strength as well as CRC data are transmitted in a single 32-bit frame for low latency and enhanced data integrity. The digital interface with 3.3V I/O is compatible to the C2000™ MCU Launchpad and enables evaluation of our 3D Hall-effect sensing technology with a C2000™, Sitara or other MCUs.

Features
  • Single-chip 3D Hall-effect sensor with integrated ADC and SPI interface reduce BOM and PCB size.
  • Linear position accuracy typically ±0.15mm over 100mm range using quad 3D Hall-effect sensors help achieve more precise linear position sensing systems.
  • 3D Hall-effect sensors with configurable sensitivity ±25mT to ±100mT and ±75mT to ±300mT help adjust measurement range for better accuracy.
  • Sample rates up to 8kHz, low latency of 57.5us and 10MHz SPI enable higher speed position control.
  • Dedicated ALERT pin enables simultaneous start-of-conversion of X,Y,Z axis across multiple 3D Hall-effect sensors.
  • 3D Hall-effect sensors diagnostics features help detect and report both system and device-level failures and simplify design for functional safety.
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A fully assembled board has been developed for testing and performance validation only, and is not available for sale.

Design files & products

Design files

Download ready-to-use system files to speed your design process.

PDF | HTML
TIDUF78.PDF (2550 K)

Reference design overview and verified performance test data

TIDMCX1.PDF (270 K)

Detailed schematic diagram for design layout and components

TIDMCX2.PDF (153 K)

Complete listing of design components, reference designators, and manufacturers/part numbers

TIDMCX3.PDF (196 K)

Detailed overview of design layout for component placement

TIDMCX5.ZIP (1449 K)

Files used for 3D models or 2D drawings of IC components

TIDCGP0.ZIP (528 K)

Design file that contains information on physical board layer of design PCB

TIDMCX4.PDF (679 K)

PCB layer plot file used for generating PCB design layout

Products

Includes TI products in the design and potential alternatives.

Multi-axis linear & angle position sensors

TMAG5170High-precision, linear 3D Hall-effect sensor with SPI bus interface

Data sheet: PDF | HTML
Multi-axis linear & angle position sensors

TMAG5273Low-power linear 3D Hall-effect sensor with I²C interface

Data sheet: PDF | HTML

Technical documentation

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Type Title Date
Certificate TIDA-060045 EU Declaration of Conformity (DoC) Apr. 09, 2024
Design guide Accurate Low Latency Linear Position Sense Reference Design With Quad 3-D Hall-Effect Sensors PDF | HTML Apr. 02, 2024

Related design resources

Hardware development

EVALUATION BOARD
LAUNCHXL-F280049C F280049C LaunchPad™ development kit C2000™ Piccolo™ MCU

Software development

SOFTWARE DEVELOPMENT KIT (SDK)
C2000WARE C2000Ware for C2000 MCUs
CODE EXAMPLE OR DEMO
TMAG5170-CODE-EXAMPLE TMAG5170 and TMAG5170-Q1 C code example

Design tools & simulation

SIMULATION TOOL
TI-MAGNETIC-SENSE-SIMULATOR Magnetic simulation software that includes mechanical motion and sensor output

Support & training

TI E2E™ forums with technical support from TI engineers

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